公开(公告)号：US08033014B2

公开(公告)日：2011-10-11

申请号：US12168164

申请日：2008-07-07

Applicant: Cheng-Hung Yu ,  Chi-En Li

Inventor： Cheng-Hung Yu ,  Chi-En Li

IPC: H05K3/02

CPC classification number: H05K3/1258 ,  H05K1/0284 ,  H05K1/0306 ,  H05K3/048 ,  H05K3/107 ,  H05K3/4069 ,  H05K2201/09118 ,  H05K2203/0191 ,  H05K2203/0264 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.

Abstract translation: 本发明提供一种制造模制互连装置的方法。 该方法包括以下步骤：对其上具有至少一个图案化电路沟槽结构的塑料体注塑; 并将导电材料填充到图案化电路沟槽结构中，从而在塑料体上形成电路迹线。

公开(公告)号：US20100000086A1

公开(公告)日：2010-01-07

申请号：US12168164

申请日：2008-07-07

Applicant: Cheng-Hung Yu ,  Chi-En Li

Inventor： Cheng-Hung Yu ,  Chi-En Li

IPC: H05K3/02

CPC classification number: H05K3/1258 ,  H05K1/0284 ,  H05K1/0306 ,  H05K3/048 ,  H05K3/107 ,  H05K3/4069 ,  H05K2201/09118 ,  H05K2203/0191 ,  H05K2203/0264 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.

Abstract translation: 本发明提供一种制造模制互连装置的方法。 该方法包括以下步骤：对其上具有至少一个图案化电路沟槽结构的塑料体注塑; 并将导电材料填充到图案化电路沟槽结构中，从而在塑料体上形成电路迹线。