摘要:
A heat dissipation structure for a lighting engine, may include: a primary heat sink, and an extended heat sink, wherein the primary heat sink has a first contact surface, and the extended heat sink has a second contact surface provided opposite to the first contact surface, the first contact surface and the second contact surface directly contacted each other with no additional layer therebetween.
摘要:
An optical lens may include two sidewall portions arranged opposite to each other; and a midsection connecting the two sidewall portions, the two sidewall portions and the midsection defining a linear concave space accommodating a plurality of light sources in a linear arrangement, the midsection including a light input surface facing toward the light sources and a light output surface facing away from the light sources, the sidewall portions including a reflective surface which can totally reflect at least part of light.
摘要:
A lighting device may include: a cover in which a circuit board mounted with multiple lighting modules is provided, an end cap which is used to close the cover at least one end of the cover, as well as adhesive sealant, wherein the end cap includes a first portion that can be closely mounted into the cover and a second portion at the outside of the cover, and the second portion is configured to form a recess, the adhesive sealant encapsulate the cover and seal the end cap by flowing into the recess.
摘要:
A method for making a lamp chain may include: a) providing a tooling provided with a cavity therein, wherein multiple lens-like holes spaced apart from each other at a predetermined distance are formed in the bottom of the cavity; b) placing a circuit board mounted with multiple illuminants in the cavity and keeping the circuit board away from the bottom of the cavity at a predetermined distance; wherein the multiple lens-like holes correspond to the positions of the multiple illuminants at the circuit board; c) injecting glue into the cavity until the glue fully fills the cavity; and d) solidifying the glue.
摘要:
A housing of an electronic module may include: a mounting surface located at one side of the housing, wherein the mounting surface includes at least three sub-mounting surfaces, lines connecting the centers of respective sub-mounting surfaces form a polygon, and a mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon.
摘要:
An encapsulation housing for a LED module, may include an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower housing has an inner partition wall partitioning the cavity into an assembly cavity and an anti-leakage cavity encircling the assembly cavity.