公开(公告)号：US07170158B2

公开(公告)日：2007-01-30

申请号：US10186101

申请日：2002-06-27

Applicant: Hee Kook Choi ,  Cheol Joon Yoo

Inventor： Hee Kook Choi ,  Cheol Joon Yoo

IPC: H01L23/02

CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/8547 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multi-chip package comprises a double-sided circuit board having first and second surfaces. Each surface has a package area and a peripheral area. Each package area has a chip mounting area on which a chip is attached, and a bonding area with which the chip is electrically connected. The peripheral area of the first surface has a runner area on which molding compound flows, and the peripheral area of the second surface has external connection pattern with which the bonding areas are electrically connected. In particular, the circuit board has gate holes, which are co-located on each surface to result in a common hole.

Abstract translation: 多芯片封装包括具有第一表面和第二表面的双面电路板。 每个表面都有一个封装区域和一个外围区域。 每个封装区域具有安装芯片的芯片安装区域和与芯片电连接的接合区域。 第一表面的周边区域具有浇铸区域，模制化合物在其上流动，并且第二表面的周边区域具有与粘结区域电连接的外部连接图案。 特别地，电路板具有门孔，它们位于每个表面上以形成公共孔。

公开(公告)号：US06808379B2

公开(公告)日：2004-10-26

申请号：US10029165

申请日：2001-12-20

Applicant: Cheol Joon Yoo

Inventor： Cheol Joon Yoo

IPC: B29C3358

CPC classification number: H01L21/67051 ,  B08B1/00 ,  B29C45/14655 ,  B29C45/1753 ,  H01L21/67046

Abstract: An apparatus for cleaning a mold die set includes a pair of brushes, a pair of vacuum holes, and multiple nozzles. One of the brushes is positioned to scrub a first surface of the mold die set, and the other of the brushes is positioned to scrub a second surface of the mold die set to separate a residue from the first and second surfaces of the mold die set. The vacuum holes receives the separated residue from the first and second surfaces of the mold die set, and through the nozzles, a parting compound is provided to coat the first and second surfaces of the mold die set. The apparatus further includes multiple air holes through which air is blown to the first and second surfaces of the mold die set. An apparatus for semiconductor manufacturing includes a mold die set having a first surface and a second surface and a mold die set cleaner that can remove a residue from the first and second surfaces of the mold die set and coat a parting compound on the first and second surfaces.

Abstract translation: 用于清洁模具模具的装置包括一对刷子，一对真空孔和多个喷嘴。 刷子中的一个定位成擦拭模具模具的第一表面，并且另一个刷子被定位成擦拭模具模具的第二表面以将残留物与模具模具的第一和第二表面分离 。 真空孔从模具模具的第一和第二表面接收分离的残留物，并且通过喷嘴，提供分开化合物以涂覆模具模具的第一和第二表面。 该装置还包括多个气孔，空气通过该空气吹送到模具模具的第一和第二表面。 一种用于半导体制造的设备包括具有第一表面和第二表面的模具模具和模具模具清洁器，其可以从模具模具的第一和第二表面去除残留物并在第一和第二表面上涂覆分离化合物 表面。