公开(公告)号：US20110186545A1

公开(公告)日：2011-08-04

申请号：US12905624

申请日：2010-10-15

Applicant: Chetan MAHADESWARASWAMY ,  Walter R. MERRY ,  Sergio Fukuda SHOJI ,  Chunlei ZHANG ,  Yashaswini B. PATTAR ,  Duy D. NGUYEN ,  Tina TSONG ,  Shane C. NEVIL ,  Douglas A. BUCHBERGER, JR. ,  Fernando M. SILVEIRA ,  Brad L. MAYS ,  Kartik RAMASWAMY ,  Hamid NOORBAKHSH

Inventor： Chetan MAHADESWARASWAMY ,  Walter R. MERRY ,  Sergio Fukuda SHOJI ,  Chunlei ZHANG ,  Yashaswini B. PATTAR ,  Duy D. NGUYEN ,  Tina TSONG ,  Shane C. NEVIL ,  Douglas A. BUCHBERGER, JR. ,  Fernando M. SILVEIRA ,  Brad L. MAYS ,  Kartik RAMASWAMY ,  Hamid NOORBAKHSH

IPC: C23F1/08 ,  C23F1/00 ,  C23C16/50 ,  C23C16/458 ,  C23C16/52 ,  G05D23/00

CPC classification number: H01J37/32009 ,  G05B6/02 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32935 ,  H01J2237/334 ,  H05H1/0081

Abstract: Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.

Abstract translation: 用于控制等离子体处理室中的温度的方法和系统，其具有减少的控制器响应时间和增加的稳定性。 温度控制至少部分地基于从输入到处理室的等离子体功率得到的前馈控制信号。 补偿由于等离子体功率引起的温度的干扰的前馈控制信号可以与测量温度和期望温度之间的反馈控制信号抵消误差相组合。

公开(公告)号：US20130105084A1

公开(公告)日：2013-05-02

申请号：US13652257

申请日：2012-10-15

Applicant: Chetan MAHADESWARASWAMY

Inventor： Chetan MAHADESWARASWAMY

IPC: C23F1/08 ,  F28F27/02

CPC classification number: H01L21/67109

Abstract: Methods and systems for controlling temperatures in plasma processing chamber with a combination of proportional and pulsed fluid control valves. A heat transfer fluid loop is thermally coupled to a chamber component, such as a chuck. The heat transfer fluid loop includes a supply line and a return line to each of hot and cold fluid reservoirs. In an embodiment, an analog valve (e.g., in the supply line) is controlled between any of a closed state, a partially open state, and a fully open state based on a temperature control loop while a digital valve (e.g., in the return line) is controlled to either a closed state and a fully open state.

Abstract translation: 用于通过比例和脉冲流体控制阀的组合来控制等离子体处理室中的温度的方法和系统。 传热流体回路热耦合到腔室部件，例如卡盘。 传热流体回路包括一个供应管线和一个返回管线到每个热和冷流体储存器。 在一个实施例中，模拟阀（例如，在供应管线中）在数字阀（例如，在回报中）的基础上，基于温度控制回路在任何闭合状态，部分打开状态和完全打开状态之间进行控制 线）被控制为关闭状态和完全打开状态。

公开(公告)号：US20110303641A1

公开(公告)日：2011-12-15

申请号：US13111384

申请日：2011-05-19

Applicant: Chetan MAHADESWARASWAMY ,  Kallol BERA ,  Larry D. ELIZAGA

Inventor： Chetan MAHADESWARASWAMY ,  Kallol BERA ,  Larry D. ELIZAGA

IPC: C23F1/00 ,  F28D15/00 ,  C23F1/08

CPC classification number: H01J37/02 ,  F28D2021/0028 ,  F28F7/02 ,  H01J37/32522 ,  H01J37/32724 ,  H01J37/32908 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/67248

Abstract: Components and systems for controlling a process or chamber component temperature as a plasma process is executed by plasma processing apparatus. A first heat transfer fluid channel is disposed in a component subjacent to a working surface disposed within a plasma processing chamber such that a first length of the first channel subjacent to a first temperature zone of the working surface comprises a different heat transfer coefficient, h, or heat transfer area, A, than a second length of the first channel subjacent to a second temperature zone of the working surface. In embodiments, different heat transfer coefficients or heat transfer areas are provided as a function of temperature zone to make more independent the temperature control of the first and second temperature zones.

Abstract translation: 通过等离子体处理装置执行用于控制作为等离子体处理的工艺或室部件温度的部件和系统。 第一传热流体通道设置在位于等离子体处理室内的工作表面的下方的部件中，使得位于工作表面的第一温度区域下方的第一通道的第一长度包括不同的传热系数h， 或传热面积A比第一通道的第二长度低于工作表面的第二温度区域。 在实施例中，提供不同的传热系数或传热面积作为温度区域的函数，以使第一和第二温度区域的温度控制更独立。