公开(公告)号：US5278012A

公开(公告)日：1994-01-11

申请号：US938516

申请日：1992-09-02

申请人： Chie Yamanaka ,  Toshiaki Ichinose ,  Takanori Ninomiya ,  Hisafumi Iwata ,  Yasuo Nakagawa ,  Nobuyuki Akiyama

发明人： Chie Yamanaka ,  Toshiaki Ichinose ,  Takanori Ninomiya ,  Hisafumi Iwata ,  Yasuo Nakagawa ,  Nobuyuki Akiyama

IPC分类号： G01N21/956 ,  H01L21/00 ,  H01L21/48 ,  H01L21/66 ,  H05K3/22 ,  G01N21/88 ,  G01N21/64

CPC分类号： H01L21/67121 ,  G01N21/95684 ,  H01L21/4857 ,  H01L22/20 ,  H05K3/225 ,  G01N2021/8825

摘要： A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.

摘要翻译： 一种制造具有基底基板的薄膜多层基板的方法，其中通过介电层叠置在其上的多个导体图案层之间包括以下步骤：每当在导体图案层上形成导体图案层时，光学检测最上面的导体图案层 基底; 检查导体图案层的缺陷和/或存在故障; 并根据检查检测到的故障位置数据修复故障部分。 根据这种方法，可以提高生产成本较高的相对大尺寸薄膜多层基板的生产成本，以便在其上安装LSI芯片。

公开(公告)号：US4953224A

公开(公告)日：1990-08-28

申请号：US158125

申请日：1988-02-16

申请人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： G06T7/00 ,  G06K9/00

CPC分类号： G06T7/0006 ,  G06T2207/30141

摘要： A pattern defect detecting method and apparatus are disclosed on a connectivity processor to input a binary picture signal pattern and a pad position coordinate and outputting connectivity data between pads. Here, the connectivity processing refers to a processing for giving the identical number to one aggregation of connected or linked pads for the pads given to a serial pattern. In the connectivity processor wherein a plane on which the drawn pattern to be inspected is scanned by a linear sensor, the connectivity processing can be releazed almost concurrently with the scanning by driving a temporary memory.Also, a pattern defect detecting apparatus the above-mentioned connectivity. The invention processing coping with the difficulties of a required inspection level, and also represents a processing time of each embodiment theoretically. A moving time of the bed on which an inspecting object is placed and others are added to the real processing time.

摘要翻译： 在连接性处理器上公开了一种图案缺陷检测方法和装置，用于输入二进制图像信号模式和焊盘位置坐标，并在焊盘之间输出连接数据。 这里，连接处理是指给予给予串行模式的焊盘的连接或连接焊盘的一个聚合相同数量的处理。 在其中通过线性传感器扫描要检查的绘制图案的平面的连接处理器中，可以通过驱动临时存储器几乎与扫描同时地进行连接处理。 此外，图案缺陷检测装置具有上述连接性。 本发明处理应对所需检查水平的困难，并且也表示理论上各实施例的处理时间。 检查对象被放置的床的移动时间和其他被添加到实际处理时间。

公开(公告)号：US5463667A

公开(公告)日：1995-10-31

申请号：US53240

申请日：1993-04-28

申请人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Asahiro Kuni ,  Kozo Nakahata ,  Toshimitsu Hamada ,  Toshihiko Ayabe

发明人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Asahiro Kuni ,  Kozo Nakahata ,  Toshimitsu Hamada ,  Toshihiko Ayabe

IPC分类号： G01N23/04 ,  H01L21/66 ,  H01L23/50 ,  H05K3/34 ,  H05K13/08

CPC分类号： H05K13/08 ,  G01N23/04

摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.

摘要翻译： 一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。 该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转 将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在 固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头 所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品 选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。 该装置可以以相同的方式操作。

公开(公告)号：US4860371A

公开(公告)日：1989-08-22

申请号：US076213

申请日：1987-07-22

申请人： Yukio Matsuyama ,  Toshiaki Ichinose

发明人： Yukio Matsuyama ,  Toshiaki Ichinose

IPC分类号： G01N21/88 ,  G01N21/956 ,  G06T1/00 ,  G06T7/00 ,  H01L21/66

CPC分类号： G06T7/001 ,  G06T7/0002 ,  G06T2207/30148

摘要： System for detecting pattern defects wherein images of corresponding portions of two originally identical patterns are detected and two image signals representing the images are registered with each other, a second image signal of the two registered signals is shifted by a predetermined number of pixels with respect to a first image signal, thus providing shifted second image signals. Differences in brightness between the first and second image signals as well as each of the shifted second image signals are calculated within intervals corresponding to pixels on one scanning line, thus providing a first group of difference image signals, preset values are added to and substracted from the first or second image signal to provide a sum image signal and a substraction image signal. Differences in brightness between the second or first image signal and each of the sum and substraction image signals are calculated within the intervals to provide a second group of at least two difference signals, normality of one of the two patterns is decided when the first group of difference signals and the second group of difference signals have coexistent positive and negative signs within one interval and a minimum of absolute values of the first group of difference signals and the second group of difference signals is calculated when the first and second group of difference signals have all either positive signs or negative signs within one interval, and the mimimum is detected as a true defect when the minimum exceeds a predetermined threshold.

摘要翻译： 用于检测图案缺陷的系统，其中检测到两个原始相同图案的相应部分的图像，并且表示图像的两个图像信号彼此对齐，两个登记信号的第二图像信号相对于 第一图像信号，从而提供移位的第二图像信号。 在与一个扫描线上的像素对应的间隔内计算第一和第二图像信号之间的亮度差异以及移位的第二图像信号中的每一个，从而提供第一组差分图像信号，并将预设值加到并从 第一或第二图像信号以提供和图像信号和减影图像信号。 在间隔内计算第二或第一图像信号与和图像信号和减法图像信号中的每一个之间的亮度差异，以提供第二组至少两个差分信号，当第一组 差分信号和第二组差分信号在一个间隔内具有共同的正和负符号，并且当第一和第二组差分信号具有第一组差分信号时，计算第一组差分信号和第二组差分信号的绝对值的最小值 所有的一个区间内都有正号或负号，当最小值超过预定阈值时，最小值被检测为真实缺陷。