公开(公告)号：US6084240A

公开(公告)日：2000-07-04

申请号：US136580

申请日：1998-08-19

Applicant: Chien-Hsing Lin ,  Cheng-Tai Peng

Inventor： Chien-Hsing Lin ,  Cheng-Tai Peng

IPC: H01J37/304 ,  H01J37/317 ,  H01J37/20

CPC classification number: H01J37/3171 ,  H01J37/304 ,  H01J2237/2001

Abstract: A temperature monitor is included inside an ion implanting chamber to constantly monitor the wafer temperature during ion implantation. The measured temperature signal is sent to a central control system through an interface circuit. When an abnormal temperature is detected, the central control system automatically ceases the ion implantation operation and triggers an alarm for operators.

Abstract translation: 离子注入室内装有一个温度监测器，以在离子注入期间不断地监测晶片温度。 测量的温度信号通过接口电路发送到中央控制系统。 当检测到异常温度时，中央控制系统自动停止离子注入操作，并为操作员触发报警。

公开(公告)号：US20100098924A1

公开(公告)日：2010-04-22

申请号：US12379006

申请日：2009-02-11

Applicant: Tzu-Yin Hsiao ,  Yu-Te Lin ,  Chien-Hsing Lin ,  Hsiang-Yin Lu

Inventor： Tzu-Yin Hsiao ,  Yu-Te Lin ,  Chien-Hsing Lin ,  Hsiang-Yin Lu

IPC: C07K14/78

CPC classification number: A61L27/24

Abstract: The present invention relates to a method for manufacturing a collagen membrane, which comprises the following steps: preparing a collagen slurry; degassing the collagen slurry, and then forming collagen gel at a predetermined collagen concentration, ionic strength, pH value, and temperature; removing water in the collagen gel by an absorbent device to form a collagen mat; and flattening and drying the collagen mat under vacuum by a gel dryer. The present invention provides the collagen membranes manufactured by the above-mentioned method. Such membranes are of good biocompatibility, high tensile strength, hydrophilicity, flexibility and easy handling features. Hence, these membranes can function as medical material suitable for repair of tissue and wound healing.

Abstract translation: 本发明涉及一种胶原膜的制造方法，其特征在于，包括以下步骤：制备胶原浆液; 脱胶胶原浆液，然后以预定的胶原浓度，离子强度，pH值和温度形成胶原凝胶; 通过吸收装置去除胶原凝胶中的水以形成胶原蛋白垫; 并通过凝胶干燥器在真空下对胶原蛋白垫进行压平和干燥。 本发明提供通过上述方法制造的胶原膜。 这种膜具有良好的生物相容性，高拉伸强度，亲水性，柔韧性和易于处理的特征。 因此，这些膜可以用作适合于修复组织和伤口愈合的医疗材料。

公开(公告)号：US06599823B1

公开(公告)日：2003-07-29

申请号：US09695162

申请日：2000-10-24

Applicant: Chien-Hsing Lin

Inventor： Chien-Hsing Lin

IPC: H01L214763

CPC classification number: H01L24/05 ,  H01L21/76801 ,  H01L23/53295 ,  H01L24/03 ,  H01L2224/05093 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/00014

Abstract: A method for improving package bonding between multi-level interconnection lines and low K inter-metal dielectric is provided. The present invention includes the steps of forming a trench between each pair of interconnection lines on one level of multi-level interconnection lines, and then filling the trench with an oxide dielectric material, instead of the low K inter-metal dielectric having a K value smaller than 3 filled therein before the trench formation. Since the oxide dielectric material has a K value higher than the low K inter-metal dielectric, the oxide dielectric is hard enough to resist the force of the package bonding. Accordingly, the relibility of bondability between the multi-level interconnection lines and the low K inter-metal dielectric is enhanced.

Abstract translation: 提供了一种用于改善多电平互连线和低K金属间电介质之间的封装接合的方法。 本发明包括以下步骤：在一层多层互连线上的每对互连线之间形成沟槽，然后用氧化物电介质材料填充沟槽，而不是具有K值的低K金属间电介质 在沟槽形成之前小于3填充。 由于氧化物电介质材料具有比低K金属间电介质高的K值，所以氧化物电介质足以抵抗封装结合的力。 因此，增强了多层互连线与低K金属间电介质之间的结合性的可靠性。

公开(公告)号：US20110280924A1

公开(公告)日：2011-11-17

申请号：US12801983

申请日：2010-07-07

Applicant: Chien-Hsing Lin ,  Yu-Te Lin ,  Hsiang-Yin Lu ,  Chin-Fu Wang ,  Dar-Jen Hsieh

Inventor： Chien-Hsing Lin ,  Yu-Te Lin ,  Hsiang-Yin Lu ,  Chin-Fu Wang ,  Dar-Jen Hsieh

IPC: A61K9/70 ,  A61P19/00 ,  A61K33/42 ,  A61K38/39 ,  A61K9/14

CPC classification number: A61L27/58 ,  A61L27/425 ,  A61L27/427 ,  A61L2430/02 ,  C08L89/06

Abstract: A biodegradable filler for restoration of alveolar bones is disclosed, which includes: first cross-linked collagen fibers prepared from reacting Non-crosslinked collagen fibers with a cross-linking agent; and supporting particles which are biomedical ceramic particles, bioactive glass, or a combination thereof, and distributed among the first cross-linked collagen fibers.

Abstract translation: 公开了一种用于恢复肺泡骨的可生物降解的填料，其包括：由非交联胶原纤维与交联剂反应制备的第一交联胶原纤维; 和作为生物医学陶瓷颗粒，生物活性玻璃或其组合的支持颗粒，并分布在第一交联胶原纤维中。

公开(公告)号：US20090317447A1

公开(公告)日：2009-12-24

申请号：US12285906

申请日：2008-10-16

Applicant: Tzu-Yin Hsiao ,  Yu-Te Lin ,  Chien-Hsing Lin ,  Hsiang-Yin Lu

Inventor： Tzu-Yin Hsiao ,  Yu-Te Lin ,  Chien-Hsing Lin ,  Hsiang-Yin Lu

IPC: A61F2/00 ,  A61F2/28

CPC classification number: A61F2/28 ,  A61F2/2875 ,  A61F2002/2817 ,  A61F2002/2835 ,  A61F2002/2867 ,  A61F2002/30062 ,  A61F2002/30205 ,  A61F2002/3092 ,  A61F2210/0004 ,  A61F2230/0067 ,  A61F2310/00293 ,  A61F2310/00329 ,  A61F2310/00365

Abstract: In the present invention, a biodegradable bone graft is disclosed, which includes: a scaffold made of a biodegradable material; and a collagen-embedding matrix portion which completely encompasses the scaffold. The above-mentioned bone graft can increase the micro-porosity of the scaffold to enable cells to grow adhesively thereon. Compared with the scaffold only, the above-mentioned bone graft has high hydrophilicity. Hence, the bone graft of the present invention can efficiently retain tissue fluid, cell growth factors, blood and/or bone marrow which are mixed with the bone graft beforehand to achieve osteoinduction. Furthermore, the collagen-embedding matrix portion can also serve as a carrier to encompass other bone graft materials and drug molecules. The present invention also relates to a method for manufacturing the above-mentioned bone graft.

Abstract translation: 在本发明中，公开了一种可生物降解的骨移植物，其包括：由可生物降解材料制成的支架; 和完全包围支架的胶原蛋白嵌入基质部分。 上述骨移植物可以增加支架的微孔，使细胞能够在其上粘附生长。 与仅支架相比，上述骨移植具有很高的亲水性。 因此，本发明的骨移植物可以预先有效地保留与骨移植物混合的组织液，细胞生长因子，血液和/或骨髓，以实现骨诱导。 此外，胶原蛋白包埋基质部分还可以用作载体以包含其它骨移植材料和药物分子。 本发明还涉及上述骨移植物的制造方法。

公开(公告)号：US20080083832A1

公开(公告)日：2008-04-10

申请号：US11868121

申请日：2007-10-05

Applicant: Wei Chang ,  Chi-Han Lan ,  Hsu-Hung Chang ,  Chien-Hsing Lin

Inventor： Wei Chang ,  Chi-Han Lan ,  Hsu-Hung Chang ,  Chien-Hsing Lin

IPC: G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/0724 ,  G06K19/07767

Abstract: An RFID chip is modified with set data before being disposed in an electronic label so as to allow the electronic label to be selectively used with different types of RFID systems. The RFID chip includes a first data storage zone for storing first data set accessible by the first type of RFID system and the second type of RFID system; and a second data storage zone for storing second data set inaccessible by the first type of RFID system and the second type of RFID system. The second data set includes a modifiable code for indicating a type of the electronic label and with which of the first type of RFID system and the second type of RFID system the electronic label is to be used.

Abstract translation: RFID芯片在被放置在电子标签中之前用设置数据进行修改，以允许电子标签被选择性地与不同类型的RFID系统一起使用。 RFID芯片包括用于存储可由第一类型的RFID系统访问的第一数据集和第二类型的RFID系统的第一数据存储区; 以及第二数据存储区，用于存储由第一类型的RFID系统和第二类型的RFID系统不可访问的第二数据集。 第二数据集包括用于指示电子标签的类型的可修改代码，以及要使用电子标签的第一类RFID系统和第二类RFID系统中的哪一个。

公开(公告)号：US08313026B2

公开(公告)日：2012-11-20

申请号：US11868121

申请日：2007-10-05

Applicant: Wei Chang ,  Chi-Han Lan ,  Hsu-Hung Chang ,  Chien-Hsing Lin

Inventor： Wei Chang ,  Chi-Han Lan ,  Hsu-Hung Chang ,  Chien-Hsing Lin

IPC: G06F19/00

CPC classification number: G06K19/07749 ,  G06K19/0724 ,  G06K19/07767

Abstract: An RFID chip is modified with set data before being disposed in an electronic label so as to allow the electronic label to be selectively used with different types of RFID systems. The RFID chip includes a first data storage zone for storing first data set accessible by the first type of RFID system and the second type of RFID system; and a second data storage zone for storing second data set inaccessible by the first type of RFID system and the second type of RFID system. The second data set includes a modifiable code for indicating a type of the electronic label and with which of the first type of RFID system and the second type of RFID system the electronic label is to be used.

Abstract translation: RFID芯片在被放置在电子标签中之前用设置数据进行修改，以允许电子标签被选择性地与不同类型的RFID系统一起使用。 RFID芯片包括用于存储可由第一类型的RFID系统访问的第一数据集和第二类型的RFID系统的第一数据存储区; 以及第二数据存储区，用于存储由第一类型的RFID系统和第二类型的RFID系统不可访问的第二数据集。 第二数据集包括用于指示电子标签的类型的可修改代码，以及要使用电子标签的第一类RFID系统和第二类RFID系统中的哪一个。

公开(公告)号：US20110187567A1

公开(公告)日：2011-08-04

申请号：US12956071

申请日：2010-11-30

Applicant: Po Lin Yeh ,  Chien-Hsing Lin ,  Shao Ping Hung ,  Chih-Tien Chang ,  Chun-Chia Chen ,  Jui-Hua Yeh

Inventor： Po Lin Yeh ,  Chien-Hsing Lin ,  Shao Ping Hung ,  Chih-Tien Chang ,  Chun-Chia Chen ,  Jui-Hua Yeh

IPC: H03M1/12

CPC classification number: H03M1/12

Abstract: A phase digitizing apparatus for generating a corresponding digital value in response to a phase of an input signal is provided. The phase digitizing apparatus includes a coarse phase generator, for generating a coarse phase code according to the phase of the input signal and a first time unit; a fine phase code generator, for generating a fine phase code according to the phase of the input signal and a second time unit; and a calculating unit, for generating the digital value according to the coarse phase code and the fine phase code; wherein the first time unit is greater than the second time unit.

Abstract translation: 提供一种相位数字化装置，用于响应于输入信号的相位产生相应的数字值。 相位数字化装置包括粗略相位发生器，用于根据输入信号的相位和第一时间单位产生粗略相位代码; 精细相位代码发生器，用于根据输入信号的相位和第二时间单位产生精细相位代码; 以及计算单元，用于根据粗相位代码和精细相位码产生数字值; 其中所述第一时间单位大于所述第二时间单位。

公开(公告)号：US06486057B1

公开(公告)日：2002-11-26

申请号：US10107146

申请日：2002-03-28

Applicant: Ching-Fa Yeh ,  Yueh-Chuan Lee ,  Chien-Hsing Lin

Inventor： Ching-Fa Yeh ,  Yueh-Chuan Lee ,  Chien-Hsing Lin

IPC: H01L214763

CPC classification number: H01L21/76831 ,  H01L21/76826 ,  H01L21/76834

Abstract: The present invention discloses a technique of enhancing adhesion between a passivation layer and a low-K dielectric layer, in which a SiO2 layer as the passivation formed on the low-K dielectric layer is subjected to N2O plasma annealing. This technique is useful in improving the yield of a process for preparing Cu damascene interconnection.

Abstract translation: 本发明公开了一种增强钝化层和低K电介质层之间的粘附性的技术，其中在低K电介质层上形成的钝化层的SiO2层进行N2O等离子体退火。 该技术可用于提高制备Cu镶嵌互连的方法的产率。

公开(公告)号：US06326306B1

公开(公告)日：2001-12-04

申请号：US09783872

申请日：2001-02-15

Applicant: Chien-Hsing Lin

Inventor： Chien-Hsing Lin

IPC: H01L2144

CPC classification number: H01L21/76843 ,  H01L21/28562 ,  H01L21/76879

Abstract: A method of forming a copper dual damascene structure is disclosed. The method comprises forming copper lead lines and copper contacts simultaneously and selectively depositing tungsten layers on silicide layers formed on the active regions to complete the copper dual damascene structure and avoid the diffusion of copper into the active regions.

Abstract translation: 公开了形成铜双镶嵌结构的方法。 该方法包括同时形成铜引线和铜触点，并在形成在有源区上的硅化物层上选择性地沉积钨层，以完成铜双镶嵌结构，并避免铜扩散到有源区。