摘要:
An electrostatic discharge (ESD) device with a parasitic silicon controlled rectifier (SCR) structure and controllable holding current is provided. A first distance is kept between a first N+ doped region and a first P+ doped region, and a second distance is kept between a second P+ doped region and a third N+ doped region. In addition, the holding current of the ESD device can be set to a specific value by modulating the first distance and the second distance. The holding current is in inverse proportion to the first distance and the second distance.
摘要:
The isolated high-voltage LDMOS transistor according to the present invention includes a split N-well and P-well in the extended drain region. The P-well is split in the extended drain region of the N-well to form a split junction-field in the N-well. The split N-well and P-well deplete the drift region, which shifts the electric field maximum into the bulk of the N-well. This achieves a higher breakdown voltage and allows the N-well to have a higher doping density. Furthermore, the LDMOS transistor according to the present invention includes a N-well embedded beneath the source diffusion region. This creates a low-impedance path for the source region, which restricts the transistor current flow between the drain region and the source region.
摘要:
A structure of an electrostatic discharge (ESD) device integrated with a pad is provided. The ESD device is integrated with the pad and formed under the pad. By using the area under the pad, the ESD device does not occupy additional space of an integrated circuit. Furthermore, since the pad is a large, plate, and ideal conductor, the connected pad and the ESD device are capable of distributing current in the ESD device averagely.
摘要:
A high voltage LDMOS transistor according to the present invention includes at least one P-field block in the extended drain region of the N-well. The P-field blocks form junction-fields in the N-well for equalizing the capacitance of parasitic capacitors between the drain region and the source region and fully deplete the drift region before breakdown occurs. A higher breakdown voltage is therefore achieved and the N-well having a higher doping density is thus allowed. The source region and P-field blocks enclose the drain region, which makes the LDMOS transistor self-isolated.
摘要:
A structure of an electrostatic discharge (ESD) device integrated with a pad is provided. The ESD device is integrated with the pad and formed under the pad. By using the area under the pad, the ESD device does not occupy additional space of an integrated circuit. Furthermore, since the pad is a large, plate, and ideal conductor, the connected pad and the ESD device are capable of distributing current in the ESD device averagely.
摘要:
A method of manufacturing different-voltage devices mainly comprises forming at least one high-voltage well in high-voltage device regions, at least one N-well in low-voltage device regions, at least one P-well in low-voltage device regions, source/drain wells in high-voltage device regions, and isolation wells in isolation regions in a p-type substrate. The breakdown voltage is adjusted by modulating the ion doping profile. Furthermore, parameters of implanting conductive ions are adjusted for implanting conductive ions into both high-voltage device regions and low-voltage device regions. The isolation wells formed in isolation regions between devices are for separating device formed over high-voltage device regions and device formed over low-voltage device regions. The thickness of a HV gate oxide layer is thicker than the thickness of an LV gate oxide layer for modulating threshold voltages of high-voltage devices and low-voltage devices.
摘要:
An electrostatic discharge (ESD) device has a parasitic SCR structure and a controllable trigger voltage. The controllable trigger voltage of the ESD device is achieved by modulating a distance between an edge of a lightly doped well and an edge of a heavily doped region located at two ends of the lightly doped well. Since the distance and the trigger voltage are linearly proportional, the trigger voltage can be set to a specific value from a minimum value to a maximum value.
摘要:
An electrostatic discharge (ESD) device, which functions like a diode during normal IC operation and like a SCR during an electrostatic discharge event, is provided. To form an equivalent SCR structure, the ESD device includes a plurality of N+ regions and a plurality of P+ regions formed inside an N-well. The P+ regions and the N+ regions are formed adjacent to each other in a sequence, and the regions located at both ends of the sequence are the N+ regions. In addition, the ESD device is integrated with a pad and is formed under the pad. Furthermore, since the pad has a large surface area and is plated to be a good electrical conductor, the current distribution in the ESD device is uniform.
摘要翻译:提供了在静电放电事件期间在正常IC操作期间像二极管一样工作的静电放电(ESD)装置。 为了形成等效的SCR结构,ESD器件包括形成在N阱内的多个N +区和多个P +区。 P +区域和N +区域以序列形式彼此相邻,并且位于序列两端的区域是N +区域。 此外,ESD装置与垫整合并形成在垫下。 此外,由于焊盘具有大的表面积并被电镀成良好的导体,所以ESD器件中的电流分布是均匀的。
摘要:
An electrostatic discharge (ESD) protection device with adjustable single-trigger or multi-trigger voltage is provided. The semiconductor structure has multi-stage protection semiconductor circuit function and adjustable discharge capacity. The single-trigger or multi-trigger semiconductor structure may be fabricated by using the conventional semiconductor process, and can be applied to IC semiconductor design and to effectively protect the important semiconductor devices and to prevent the semiconductor devices from ESD damage. In particular, the present invention can meet the requirements of high power semiconductor device and has better protection function compared to conventional ESD protection circuit. In the present invention, a plurality of N-wells or P-wells connected in parallel are used to adjust the discharge capacity of various wells in the P-substrate so as to improve the ESD protection capability and meet different power standards.
摘要:
A method of manufacturing different-voltage devices mainly comprises forming at least one high-voltage well in high-voltage device regions, at least one N-well in low-voltage device regions, at least one P-well in low-voltage device regions, source/drain wells in high-voltage device regions, and isolation wells in isolation regions in a p-type substrate. The breakdown voltage is adjusted by modulating the ion doping profile. Furthermore, parameters of implanting conductive ions are adjusted for implanting conductive ions into both high-voltage device regions and low-voltage device regions. The isolation wells formed in isolation regions between devices are for separating device formed over high-voltage device regions and device formed over low-voltage device regions. The thickness of a HV gate oxide layer is thicker than the thickness of an LV gate oxide layer for modulating threshold voltages of high-voltage devices and low-voltage devices.