公开(公告)号：US07701050B2

公开(公告)日：2010-04-20

申请号：US11954679

申请日：2007-12-12

申请人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

发明人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

IPC分类号： H01L23/48 ,  H01L29/267 ,  H01L29/22 ,  H01L31/0232 ,  H01L31/0203

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

摘要： A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

摘要翻译： 侧视光二极管封装安装在至少具有焊料凸块的印刷电路板上。 侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。 硅衬底具有第一表面和第二表面。 保持空间在第一表面具有顶部开口，在其上具有用于保持光二极管的底部。 接合表面设置在硅衬底的侧面并且结合到印刷电路板上。 该定位结构在接合面的至少一侧具有焊料接收部，与焊料凸块对应。 焊锡凸块在焊接过程中熔化并被接收在焊料接收部分中，从而便于将硅衬底定位在印刷电路板上。

公开(公告)号：US20080142832A1

公开(公告)日：2008-06-19

申请号：US11954679

申请日：2007-12-12

申请人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

发明人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

摘要： A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

摘要翻译： 侧视光二极管封装安装在至少具有焊料凸块的印刷电路板上。 侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。 硅衬底具有第一表面和第二表面。 保持空间在第一表面具有顶部开口，在其上具有用于保持光二极管的底部。 接合表面设置在硅衬底的侧面并且结合到印刷电路板上。 该定位结构在接合面的至少一侧具有焊料接收部，与焊料凸块对应。 焊锡凸块在焊接过程中熔化并被接收在焊料接收部分中，从而便于将硅衬底定位在印刷电路板上。

公开(公告)号：US08513790B2

公开(公告)日：2013-08-20

申请号：US12428342

申请日：2009-04-22

申请人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng

发明人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.

摘要翻译： 发光二极管的封装基础结构及其制造工艺。 封装体结构包括其上具有保持空间的基板; 绝缘层，其从所述保持空间的底表面延伸到所述基板的底部; 绝缘层中限定的通孔; 以及设置在所述绝缘层上的导电层。 绝缘层将电流和热流分离，以增加封装 - 基极结构与发光二极管的寿命。 在制造过程中，通过阳极蚀刻形成绝缘层，以使绝缘层具有多孔结构。

公开(公告)号：US20080099771A1

公开(公告)日：2008-05-01

申请号：US11798655

申请日：2007-05-16

申请人： Charng-Shyang Jong ,  Ming-Sen Hsu ,  Chin-Fu Ku ,  Chih-Ming Chen ,  Deng-Huei Hwang

发明人： Charng-Shyang Jong ,  Ming-Sen Hsu ,  Chin-Fu Ku ,  Chih-Ming Chen ,  Deng-Huei Hwang

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L33/005 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13034 ,  H01L2924/19041 ,  H01L2924/00014

摘要： This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.

摘要翻译： 本发明公开了一种用于晶片级封装的发光二极管，晶片级封装方法，晶片级结合方法和电路结构。 发光二极管包括封装载体，导电材料，至少一个发光二极管结构和封装材料。 封装载体在封装载体上具有至少一个封装单元和两个通孔，并对应于封装单元。 导电材料设置在通孔中并形成在封装单元的底部。 发光二极管结构形成在基板上。 具有发光二极管结构的基板在封装单元中被翻转，并且发光二极管结构的电极与导电材料接合。 在去除衬底之后，封装材料填充在封装单元中或发光二极管结构上。

公开(公告)号：US08097476B2

公开(公告)日：2012-01-17

申请号：US11798655

申请日：2007-05-16

申请人： Charng-Shyang Jong ,  Ming-Sen Hsu ,  Chin-Fu Ku ,  Chih-Ming Chen ,  Deng-Huei Hwang

发明人： Charng-Shyang Jong ,  Ming-Sen Hsu ,  Chin-Fu Ku ,  Chih-Ming Chen ,  Deng-Huei Hwang

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L33/005 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13034 ,  H01L2924/19041 ,  H01L2924/00014

摘要： This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.

摘要翻译： 本发明公开了一种用于晶片级封装的发光二极管，晶片级封装方法，晶片级结合方法和电路结构。 发光二极管包括封装载体，导电材料，至少一个发光二极管结构和封装材料。 封装载体在封装载体上具有至少一个封装单元和两个通孔，并对应于封装单元。 导电材料设置在通孔中并形成在封装单元的底部。 发光二极管结构形成在基板上。 具有发光二极管结构的基板在封装单元中被翻转，并且发光二极管结构的电极与导电材料接合。 在去除衬底之后，封装材料填充在封装单元中或发光二极管结构上。

公开(公告)号：US08456421B2

公开(公告)日：2013-06-04

申请号：US12506696

申请日：2009-07-21

申请人： Tsang-Der Ni ,  Deng-Huei Hwang ,  Ruey-Der Lou ,  Wen-Hsiung Yu

发明人： Tsang-Der Ni ,  Deng-Huei Hwang ,  Ruey-Der Lou ,  Wen-Hsiung Yu

IPC分类号： G06F3/033 ,  G09G5/08

CPC分类号： G06F3/017 ,  G06F3/0346 ,  G06F3/04817

摘要： A selection device for selecting an icon in an image area is provided including a motion-sensing unit and a processing unit. The motion-sensing unit senses a first motion and converts the first motion into a first signal. The processing unit converts the first signal into a first locus in the image area, determines a first area in the image area according to the first locus, and determines whether the icon is to be selected according to the first area and a second area where the icon is to be displayed in the image area.

摘要翻译： 提供了一种用于选择图像区域中的图标的选择装置，其包括运动感测单元和处理单元。 运动感测单元感测第一运动并将第一运动转换成第一信号。 处理单元将第一信号转换为图像区域中的第一轨迹，根据第一轨迹确定图像区域中的第一区域，并根据第一区域确定图标是否被选择，以及第二区域 图标将显示在图像区域中。

公开(公告)号：US20100033431A1

公开(公告)日：2010-02-11

申请号：US12506696

申请日：2009-07-21

申请人： Tsang-Der Ni ,  Deng-Huei Hwang ,  Ruey-Der Lou ,  Wen-Hsiung Yu

发明人： Tsang-Der Ni ,  Deng-Huei Hwang ,  Ruey-Der Lou ,  Wen-Hsiung Yu

IPC分类号： G06F3/033

CPC分类号： G06F3/017 ,  G06F3/0346 ,  G06F3/04817

摘要： A selection device for selecting an icon in an image area is provided including a motion-sensing unit and a processing unit. The motion-sensing unit senses a first motion and converts the first motion into a first signal. The processing unit converts the first signal into a first locus in the image area, determines a first area in the image area according to the first locus, and determines whether the icon is to be selected according to the first area and a second area where the icon is to be displayed in the image area.

摘要翻译： 提供了一种用于选择图像区域中的图标的选择装置，其包括运动感测单元和处理单元。 运动感测单元感测第一运动并将第一运动转换成第一信号。 处理单元将第一信号转换为图像区域中的第一轨迹，根据第一轨迹确定图像区域中的第一区域，并根据第一区域确定图标是否被选择，以及第二区域 图标将显示在图像区域中。

公开(公告)号：US09201515B2

公开(公告)日：2015-12-01

申请号：US13246336

申请日：2011-09-27

申请人： Deng-Huei Hwang ,  Tsang-Der Ni ,  Kwang-Sing Tone

发明人： Deng-Huei Hwang ,  Tsang-Der Ni ,  Kwang-Sing Tone

IPC分类号： G06F3/033 ,  G09G5/08 ,  G06F3/0346 ,  G06F3/0484

CPC分类号： G06F3/0346 ,  G06F3/04842

摘要： A system for interacting with a target in an operation area having a selection tool includes an operating device. The operating device senses a motion to make a decision about whether the motion has a specific motion, and confirms whether the selection tool is located upon the target according to a distance between the selection tool and the target when the decision is positive.

摘要翻译： 在具有选择工具的操作区域中与目标相互作用的系统包括操作装置。 操作装置感测运动以决定运动是否具有特定运动，并且当判定为肯定时，根据选择工具与目标之间的距离确认选择工具是否位于目标上。

公开(公告)号：US20130002549A1

公开(公告)日：2013-01-03

申请号：US13540069

申请日：2012-07-02

申请人： Ching-Tsung Chen ,  Tsang-Der Ni ,  Kwang-Sing Tone ,  Deng-Huei Hwang

发明人： Ching-Tsung Chen ,  Tsang-Der Ni ,  Kwang-Sing Tone ,  Deng-Huei Hwang

IPC分类号： G06F3/033

CPC分类号： G06F3/0346 ,  G06F3/0304

摘要： A control system for controlling an operation of a screen having a first geometric reference includes a marking device and a remote-control device. The marking device displays a first pattern associated with the first geometric reference on the screen. The remote-control device obtains a signal from the screen. The signal represents an image having a second geometric reference and a second pattern associated with the first pattern. The second pattern and the second geometric reference have a first geometric relationship therebetween. The remote-control device uses the first geometric relationship to transform the second pattern into a third pattern, and calibrates the first geometric reference according to the third pattern for controlling the operation of the screen.

摘要翻译： 用于控制具有第一几何参考的屏幕的操作的控制系统包括标记装置和遥控装置。 标记装置在屏幕上显示与第一几何参考相关联的第一模式。 遥控装置从屏幕获取信号。 信号表示具有第二几何参考的图像和与第一图案相关联的第二图案。 第二图案和第二几何图形之间具有第一几何关系。 遥控装置使用第一几何关系将第二图案变换为第三图案，并且根据用于控制屏幕操作的第三图案校准第一几何基准。

公开(公告)号：US08451221B2

公开(公告)日：2013-05-28

申请号：US12538371

申请日：2009-08-10

申请人： Deng-Huei Hwang

发明人： Deng-Huei Hwang

IPC分类号： G06F3/033

CPC分类号： G06F3/0481 ,  G06F3/0346

摘要： An instruction device is provided for communicating an instruction and an icon in an image area, and includes a motion sensing unit and a processing unit. The motion sensing unit senses a first motion to generate a corresponding first signal. The processing unit generates a first trajectory to determine a first region in the image area in response to the corresponding first signal for a decision whether the icon shall be or has been selected according to a relationship between the first region and a second region where the icon is displayed in the image area.

摘要翻译： 提供了用于在图像区域中传达指令和图标的指令装置，并且包括运动感测单元和处理单元。 运动感测单元感测第一运动以产生相应的第一信号。 处理单元产生第一轨迹，以响应于对应的第一信号来确定图像区域中的第一区域，以决定是否应该根据第一区域和第二区域之间的关系选择图标，其中图标 显示在图像区域。