公开(公告)号：US20080142832A1

公开(公告)日：2008-06-19

申请号：US11954679

申请日：2007-12-12

申请人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

发明人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

摘要： A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

摘要翻译： 侧视光二极管封装安装在至少具有焊料凸块的印刷电路板上。 侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。 硅衬底具有第一表面和第二表面。 保持空间在第一表面具有顶部开口，在其上具有用于保持光二极管的底部。 接合表面设置在硅衬底的侧面并且结合到印刷电路板上。 该定位结构在接合面的至少一侧具有焊料接收部，与焊料凸块对应。 焊锡凸块在焊接过程中熔化并被接收在焊料接收部分中，从而便于将硅衬底定位在印刷电路板上。

公开(公告)号：US07701050B2

公开(公告)日：2010-04-20

申请号：US11954679

申请日：2007-12-12

申请人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

发明人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

IPC分类号： H01L23/48 ,  H01L29/267 ,  H01L29/22 ,  H01L31/0232 ,  H01L31/0203

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

摘要： A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

摘要翻译： 侧视光二极管封装安装在至少具有焊料凸块的印刷电路板上。 侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。 硅衬底具有第一表面和第二表面。 保持空间在第一表面具有顶部开口，在其上具有用于保持光二极管的底部。 接合表面设置在硅衬底的侧面并且结合到印刷电路板上。 该定位结构在接合面的至少一侧具有焊料接收部，与焊料凸块对应。 焊锡凸块在焊接过程中熔化并被接收在焊料接收部分中，从而便于将硅衬底定位在印刷电路板上。

公开(公告)号：US20070246724A1

公开(公告)日：2007-10-25

申请号：US11695345

申请日：2007-04-02

申请人： An-Nong Wen ,  Ching-Chi Cheng ,  Chih-Ming Chen

发明人： An-Nong Wen ,  Ching-Chi Cheng ,  Chih-Ming Chen

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package base structure of a light emitting device and associated manufacturing method is provided. The method includes steps of forming a first mask layer and a second mask layer on a first surface and a second surface of a substrate; defining a first opening and a second opening on the first mask layer and the second mask layer wherein the first opening is larger than the second opening; etching the substrate to form the package base structure having a holding space and at least two through holes. The upper opening of the holding space is located on the first surface of the substrate, and the bottom of the holding space can support the light emitting device. The lower openings of the through holes are located on the second surface of the substrate, and the tops of the through holes reach the bottom of the holding space. There is at least one slant structure at the contact between sidewalls of the through holes and the bottom of the holding space.

摘要翻译： 提供了发光器件的封装基础结构和相关的制造方法。 该方法包括在基板的第一表面和第二表面上形成第一掩模层和第二掩模层的步骤; 在所述第一掩模层和所述第二掩模层上限定第一开口和第二开口，其中所述第一开口大于所述第二开口; 蚀刻基板以形成具有保持空间和至少两个通孔的封装基部结构。 保持空间的上开口位于基板的第一表面上，并且保持空间的底部可以支撑发光装置。 通孔的下开口位于基板的第二表面上，并且通孔的顶部到达保持空间的底部。 在通孔的侧壁和保持空间的底部之间的接触处存在至少一个倾斜结构。

公开(公告)号：US08048694B2

公开(公告)日：2011-11-01

申请号：US11695345

申请日：2007-04-02

申请人： An-Nong Wen ,  Ching-Chi Cheng ,  Chih-Ming Chen

发明人： An-Nong Wen ,  Ching-Chi Cheng ,  Chih-Ming Chen

IPC分类号： H01L21/76

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package base structure of a light emitting device and associated manufacturing method is provided. The method includes steps of forming a first mask layer and a second mask layer on a first surface and a second surface of a substrate; defining a first opening and a second opening on the first mask layer and the second mask layer wherein the first opening is larger than the second opening; etching the substrate to form the package base structure having a holding space and at least two through holes. The upper opening of the holding space is located on the first surface of the substrate, and the bottom of the holding space can support the light emitting device. The lower openings of the through holes are located on the second surface of the substrate, and the tops of the through holes reach the bottom of the holding space. There is at least one slant structure at the contact between sidewalls of the through holes and the bottom of the holding space.

摘要翻译： 提供了发光器件的封装基础结构和相关的制造方法。 该方法包括在基板的第一表面和第二表面上形成第一掩模层和第二掩模层的步骤; 在所述第一掩模层和所述第二掩模层上限定第一开口和第二开口，其中所述第一开口大于所述第二开口; 蚀刻基板以形成具有保持空间和至少两个通孔的封装基部结构。 保持空间的上开口位于基板的第一表面上，并且保持空间的底部可以支撑发光装置。 通孔的下开口位于基板的第二表面上，并且通孔的顶部到达保持空间的底部。 在通孔的侧壁和保持空间的底部之间的接触处存在至少一个倾斜结构。

公开(公告)号：US20080036045A1

公开(公告)日：2008-02-14

申请号：US11836036

申请日：2007-08-08

申请人： Chih-Ming Chen ,  Ching-Chi Cheng ,  An-Nong Wen

发明人： Chih-Ming Chen ,  Ching-Chi Cheng ,  An-Nong Wen

IPC分类号： H01L31/036 ,  H01L21/44

CPC分类号： H01L23/147 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process of manufacturing a package base of a power semiconductor device includes the following steps. Firstly, a semiconductor substrate including a first surface and a second surface is provided. Then, a portion of the semiconductor substrate is patterned and removed to form a recess on the first surface of the semiconductor substrate, which serves as a receiving space for receiving a power semiconductor element therein. Then, a conducting layer is overlaid on the first surface including the receiving space. Afterward, a portion of the conducting layer is patterned and removed to form a conducting structure to be electrically connected to the power semiconductor device.

摘要翻译： 功率半导体器件的封装基板的制造工序包括以下工序。 首先，提供包括第一表面和第二表面的半导体衬底。 然后，对半导体衬底的一部分进行图案化和去除，以在半导体衬底的第一表面上形成用作在其中接收功率半导体元件的接收空间的凹部。 然后，在包括接收空间的第一表面上覆盖导电层。 之后，对导电层的一部分进行图案化和去除，以形成电连接到功率半导体器件的导电结构。

公开(公告)号：US08513790B2

公开(公告)日：2013-08-20

申请号：US12428342

申请日：2009-04-22

申请人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng

发明人： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.

摘要翻译： 发光二极管的封装基础结构及其制造工艺。 封装体结构包括其上具有保持空间的基板; 绝缘层，其从所述保持空间的底表面延伸到所述基板的底部; 绝缘层中限定的通孔; 以及设置在所述绝缘层上的导电层。 绝缘层将电流和热流分离，以增加封装 - 基极结构与发光二极管的寿命。 在制造过程中，通过阳极蚀刻形成绝缘层，以使绝缘层具有多孔结构。

公开(公告)号：US20100308352A1

公开(公告)日：2010-12-09

申请号：US12621639

申请日：2009-11-19

申请人： CHUN-YING LIAO ,  Ching-Chi Cheng

发明人： CHUN-YING LIAO ,  Ching-Chi Cheng

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A carrier structure for mounting at least an LED chip includes at least a lead and a base. The LED chip housed inside the base is coupled parallel with an electronic element. The lead is connected electrically to the LED chip at one end, while another end is exposed to the atmosphere. The base encaving the lead further has a shallow accommodation room to mount the electronic element at a surface not the same with the surface that mounts the LED chip.

摘要翻译： 用于安装至少LED芯片的载体结构至少包括引线和基极。 容纳在基座内的LED芯片与电子元件平行地耦合。 引线在一端与LED芯片电连接，另一端暴露在大气中。 插入引线的基座还具有浅的容纳室，以将电子元件安装在与安装LED芯片的表面不相同的表面上。

公开(公告)号：US08427065B2

公开(公告)日：2013-04-23

申请号：US13246223

申请日：2011-09-27

申请人： Ching-Chi Cheng

发明人： Ching-Chi Cheng

IPC分类号： H05B41/16

CPC分类号： H05B33/0812 ,  H05B33/0845 ,  Y02B20/345

摘要： A driving circuit for light emitting elements comprises a rectifying unit, a first constant current unit, a first driving transistor, a first voltage control unit and at least one first light emitting element. The rectifying unit has a first terminal and a second terminal, is connected to an external power source that provides alternating current power that is sinusoidal and has alternating negative and positive segments, inverts the negative segments of the AC power to positive segments and forms a pulsating direct current voltage. The first constant current unit has a first end and a second end. The first driving transistor comprises a first gate, a first drain and a first source. The first voltage control unit comprises a first variable resistor and a first bias control element. The first light emitting element has a first end and a second end.

摘要翻译： 用于发光元件的驱动电路包括整流单元，第一恒流单元，第一驱动晶体管，第一电压控制单元和至少一个第一发光元件。 整流单元具有第一端子和第二端子，连接到外部电源，该外部电源提供正弦曲线并具有交替的负极和正段的交流电力，将交流电源的负段转换为正段，并形成脉动 直流电压。 第一恒定电流单元具有第一端和第二端。 第一驱动晶体管包括第一栅极，第一漏极和第一源极。 第一电压控制单元包括第一可变电阻器和第一偏置控制元件。 第一发光元件具有第一端和第二端。

公开(公告)号：US20090195169A1

公开(公告)日：2009-08-06

申请号：US12236262

申请日：2008-09-23

申请人： Chung-Tsai Huang ,  Shang-Jin Yan ,  Ching-Chi Cheng ,  Po-Yi Lee

发明人： Chung-Tsai Huang ,  Shang-Jin Yan ,  Ching-Chi Cheng ,  Po-Yi Lee

IPC分类号： H05B37/02

CPC分类号： H05B33/0851

摘要： The present invention provides a power supply circuit for driving multiple sets of DC loads. The power supply circuit includes a current providing circuit, a sharing circuit and a current control unit. The current providing circuit receives and regulates a supply voltage into specified output currents to be supplied to the multiple sets of DC loads. The sharing circuit is connected in series with output terminals of the current providing circuit and the multiple sets of DC loads. The sharing circuit includes at least one coupling inductor member for performing equal current sharing among the multiple sets of DC loads. The current control unit is connected to the current providing circuit and the multiple sets of DC loads for detecting magnitudes of the current passing through the multiple sets of DC loads and controlling the output currents from the current providing circuit.

摘要翻译： 本发明提供一种用于驱动多组DC负载的电源电路。 电源电路包括电流提供电路，共享电路和电流控制单元。 电流提供电路将电源电压接收并调节到指定的输出电流以供应给多组DC负载。 共享电路与电流提供电路的输出端子和多组DC负载串联连接。 共享电路包括用于在多组DC负载之间执行相等的电流共享的至少一个耦合电感器构件。 电流控制单元连接到电流提供电路和多组DC负载，用于检测通过多组DC负载的电流的大小，并控制来自电流提供电路的输出电流。

公开(公告)号：US20090153076A1

公开(公告)日：2009-06-18

申请号：US12036945

申请日：2008-02-25

申请人： Chung-Tsai Huang ,  Ching-Chi Cheng ,  Po-Yi Lee ,  Shang-Jin Yan

发明人： Chung-Tsai Huang ,  Ching-Chi Cheng ,  Po-Yi Lee ,  Shang-Jin Yan

IPC分类号： H05B41/36

CPC分类号： H05B33/089 ,  H05B33/0803 ,  H05B33/0818 ,  H05B33/0821 ,  H05B33/0854 ,  Y02B20/346

摘要： The present invention relates to a driving circuit for driving one or multiple LED chip sets. The driving circuit includes a power converting circuit, one or multiple switching elements, and a controller. The power converting circuit is electrically connected to the one or multiple LED chip sets for receiving an input power and converting the input power into a regulated output voltage or current required for illuminating the one or multiple LED chip sets. The one or multiple switching elements electrically connected to the one or multiple LED chip sets. The controller is electrically connected to the switching elements for controlling alternate or combined simultaneous/alternate switching on/off statuses of the one or multiple switching elements, so that the one or multiple LED chip sets emit light in an alternate lighting manner or a combined simultaneous/alternate lighting manner to reduce the operating temperatures of the one or multiple LED chip sets.

摘要翻译： 本发明涉及驱动一个或多个LED芯片组的驱动电路。 驱动电路包括功率转换电路，一个或多个开关元件和控制器。 电力转换电路电连接到一个或多个LED芯片组，用于接收输入功率，并将输入功率转换成照明一个或多个LED芯片组所需的稳定输出电压或电流。 一个或多个开关元件电连接到一个或多个LED芯片组。 控制器电连接到开关元件，用于控制一个或多个开关元件的交替或并联的同时/交替的开/关状态，使得一个或多个LED芯片组以交替的照明方式或组合的同时发光 /交替照明方式，以降低一个或多个LED芯片组的工作温度。