公开(公告)号：US08987033B2

公开(公告)日：2015-03-24

申请号：US13196560

申请日：2011-08-02

申请人： Ching-Chung Su ,  Shih-Chang Liu ,  Shih Pei Chou ,  Chia-Shiung Tsai ,  Chun-Tsung Kuo ,  Wen-I Hsu ,  Yi-Shin Chu

发明人： Ching-Chung Su ,  Shih-Chang Liu ,  Shih Pei Chou ,  Chia-Shiung Tsai ,  Chun-Tsung Kuo ,  Wen-I Hsu ,  Yi-Shin Chu

IPC分类号： H01L21/00 ,  H01L27/146

CPC分类号： H01L27/1463

摘要： A method includes forming a blocking layer over a substrate, and etching the blocking layer to form a trench in the blocking layer. A dielectric layer is formed, wherein the dielectric layer comprises a first portion over the blocking layer, and a second portion in the trench. After the step of forming the dielectric layer, an implantation is performed to implant an impurity into the substrate to form a deep well region. After the implantation, the dielectric layer and the blocking layer are removed.

摘要翻译： 一种方法包括在衬底上形成阻挡层，并蚀刻阻挡层以在阻挡层中形成沟槽。 形成介电层，其中电介质层包括阻挡层上的第一部分和沟槽中的第二部分。 在形成介电层的步骤之后，进行注入以将杂质注入衬底以形成深阱区。 在植入之后，去除介电层和阻挡层。

公开(公告)号：US20130034929A1

公开(公告)日：2013-02-07

申请号：US13196560

申请日：2011-08-02

申请人： Ching-Chung Su ,  Shih-Chang Liu ,  Shih Pei Chou ,  Chia-Shiung Tsai ,  Chun-Tsung Kuo ,  Wen-I Hsu ,  Yi-Shin Chu

发明人： Ching-Chung Su ,  Shih-Chang Liu ,  Shih Pei Chou ,  Chia-Shiung Tsai ,  Chun-Tsung Kuo ,  Wen-I Hsu ,  Yi-Shin Chu

IPC分类号： H01L31/18

CPC分类号： H01L27/1463

摘要： A method includes forming a blocking layer over a substrate, and etching the blocking layer to form a trench in the blocking layer. A dielectric layer is formed, wherein the dielectric layer comprises a first portion over the blocking layer, and a second portion in the trench. After the step of forming the dielectric layer, an implantation is performed to implant an impurity into the substrate to form a deep well region. After the implantation, the dielectric layer and the blocking layer are removed.

摘要翻译： 一种方法包括在衬底上形成阻挡层，并蚀刻阻挡层以在阻挡层中形成沟槽。 形成介电层，其中电介质层包括阻挡层上的第一部分和沟槽中的第二部分。 在形成介电层的步骤之后，进行注入以将杂质注入衬底以形成深阱区。 在植入之后，去除介电层和阻挡层。

公开(公告)号：US08049213B2

公开(公告)日：2011-11-01

申请号：US11958942

申请日：2007-12-18

申请人： Ching-Chung Su ,  Yi-Wei Chiu ,  Tzu Chan Weng ,  Yih Song Chiu ,  Pin Chia Su ,  Chih-Cherng Jeng ,  Kuo-Hsiu Wei

发明人： Ching-Chung Su ,  Yi-Wei Chiu ,  Tzu Chan Weng ,  Yih Song Chiu ,  Pin Chia Su ,  Chih-Cherng Jeng ,  Kuo-Hsiu Wei

IPC分类号： H01L21/66 ,  H01L23/544

CPC分类号： H01L22/14 ,  H01L22/12 ,  H01L22/20

摘要： A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared.

摘要翻译： 测量尺寸特性的方法包括提供衬底并在衬底上形成反射层。 然后在反射层上形成电介质层。 电介质层包括在透明区域内插入的光栅图案和电阻率测试线。 然后将辐射引导到电介质层上，使得一些辐射透过透明区域到达反射层。 然后从由金属光栅图案反射和散射的辐射中检测出辐射图。 分析辐射图以确定第一维信息。 然后测量电阻率测试线的电阻，并分析该电阻以确定第二维信息。 然后比较第一和第二维信息。

公开(公告)号：US20090152545A1

公开(公告)日：2009-06-18

申请号：US11958942

申请日：2007-12-18

申请人： Ching-Chung Su ,  Yi-Wei Chiu ,  Tzu-Chan Weng ,  Yih Song Chiu ,  Pin Chia Su ,  Chih-Cherng Jeng ,  Kuo-Hsiu Wei

发明人： Ching-Chung Su ,  Yi-Wei Chiu ,  Tzu-Chan Weng ,  Yih Song Chiu ,  Pin Chia Su ,  Chih-Cherng Jeng ,  Kuo-Hsiu Wei

IPC分类号： H01L23/58 ,  H01L21/66

CPC分类号： H01L22/14 ,  H01L22/12 ,  H01L22/20

摘要： A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared.

摘要翻译： 测量尺寸特性的方法包括提供衬底并在衬底上形成反射层。 然后在反射层上形成电介质层。 电介质层包括在透明区域内插入的光栅图案和电阻率测试线。 然后将辐射引导到电介质层上，使得一些辐射透过透明区域到达反射层。 然后从由金属光栅图案反射和散射的辐射中检测出辐射图。 分析辐射图以确定第一维信息。 然后测量电阻率测试线的电阻，并分析该电阻以确定第二维信息。 然后比较第一和第二维信息。