公开(公告)号：US20110063608A1

公开(公告)日：2011-03-17

申请号：US12857036

申请日：2010-08-16

申请人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

发明人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

IPC分类号： G01N21/01

CPC分类号： G01J1/02 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0403 ,  G01J1/0407 ,  G01J1/0414 ,  G01J1/0425 ,  G01J3/505

摘要： A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device.

摘要翻译： 一种用于发光器件的感测模块包括具有至少一个第一孔和连接到第一孔的至少一个第二孔的衬底，位于第一孔中的光学器件，其被配置成将从发光器件发出的光聚集到 所述第一孔，定位在所述第二孔中的导光装置，位于所述第一孔中的反射器，其被配置为将所述发光装置从所述发光装置反射到所述导光装置;以及光耦合器， 并且与导光装置耦合。

公开(公告)号：US08389926B2

公开(公告)日：2013-03-05

申请号：US12857310

申请日：2010-08-16

申请人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

发明人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

IPC分类号： H01J5/02

CPC分类号： G01N21/255

摘要： A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.

摘要翻译： 一种用于发光装置的感测模块包括电路板，该电路板具有被配置为保持光学传感器的至少一个保持区域，至少一个电路被配置为将光学传感器电连接到电路板的前端处的输出接口， 位于所述电路板上并具有暴露所述保持区域的至少一个孔的衬底，以及定位在所述孔上并被配置为收集从发光器件通过所述孔将光发射到所述保持区域的光学器件。

公开(公告)号：US20110062317A1

公开(公告)日：2011-03-17

申请号：US12857310

申请日：2010-08-16

申请人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

发明人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

IPC分类号： H01J40/14

CPC分类号： G01N21/255

摘要： A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.

摘要翻译： 一种用于发光装置的感测模块包括具有至少一个保持区域的电路板，该保持区域被配置为保持光学传感器，至少一个电路被配置为将光学传感器电连接到电路板的前端处的输出接口， 位于所述电路板上并具有暴露所述保持区域的至少一个孔的衬底，以及定位在所述孔上并被配置为收集从发光器件通过所述孔将光发射到所述保持区域的光学器件。

公开(公告)号：US07675307B2

公开(公告)日：2010-03-09

申请号：US12050204

申请日：2008-03-18

申请人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

发明人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

IPC分类号： G01R31/28

CPC分类号： F27B17/0025 ,  G01R31/2862 ,  G01R31/2875

摘要： A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.

摘要翻译： 一种用于半导体器件的加热装置包括一个烤箱，其包括具有多个前开口的前壁和具有多个后开口的后壁，每个后开口均具有隔离自闭门，载体模块配置成通过 可拆卸方式的前开口，配置成控制烤箱温度的温度控制模块和位于烤箱后侧的测试模块，并且被配置为产生，接收或切换烤箱中半导体器件的电测试信号 。

公开(公告)号：US20090237102A1

公开(公告)日：2009-09-24

申请号：US12050204

申请日：2008-03-18

申请人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

发明人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

IPC分类号： F27B9/02 ,  G01R33/26

CPC分类号： F27B17/0025 ,  G01R31/2862 ,  G01R31/2875

摘要： A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.

摘要翻译： 一种用于半导体器件的加热装置包括一个烤箱，其包括具有多个前开口的前壁和具有多个后开口的后壁，每个后开口均具有隔离自闭门，载体模块配置成通过 可拆卸方式的前开口，配置成控制烤箱温度的温度控制模块和位于烤箱后侧的测试模块，并且被配置为产生，接收或切换烤箱中半导体器件的电测试信号 。

公开(公告)号：US07616018B2

公开(公告)日：2009-11-10

申请号：US12046818

申请日：2008-03-12

申请人： Choon Leong Lou ,  Li Min Wang

发明人： Choon Leong Lou ,  Li Min Wang

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2874

摘要： A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

摘要翻译： 用于集成电路装置的探测装置包括探针卡，用于保持探针卡的探针支架，测试头和温度调节机构。 探针卡包括至少一个能够与集成电路装置形成与探针卡的第一表面电连接的探针，并且温度调节机构可位于探针卡的第二表面上/上。 温度调节机构可位于探针卡内，探头支架内或探头支架上。 测试头包括多个引脚，其被配置为与探针卡的连接部位和测试和测量单元和设备形成电连接。 温度调节机构可以位于测试头的内部或内部。 温度调节机构包括具有至少一个入口和多个出口的流动管线，并且出口可以定位在探针卡的第二表面上。

公开(公告)号：US07576553B2

公开(公告)日：2009-08-18

申请号：US11609558

申请日：2006-12-12

申请人： Choon-Leong Lou ,  Li Min Wang

发明人： Choon-Leong Lou ,  Li Min Wang

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2874

摘要： A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

公开(公告)号：US09885746B2

公开(公告)日：2018-02-06

申请号：US13425987

申请日：2012-03-21

申请人： Choon Leong Lou ,  Li Min Wang

发明人： Choon Leong Lou ,  Li Min Wang

IPC分类号： G01R31/28

CPC分类号： G01R31/2844

摘要： A switching matrix includes a plurality of input ports, a plurality of output ports, a plurality of switching devices configured to open and close, an electrical connection between the input ports and the output ports, and an electrical sensor configured to generate a signal by measuring a predetermined electrical property of the electrical connection, the open and close of switching devices is pre-determined by status read from the electrical sensor.

公开(公告)号：US20080048700A1

公开(公告)日：2008-02-28

申请号：US11609558

申请日：2006-12-12

申请人： Choon Leong Lou ,  Li Min Wang

发明人： Choon Leong Lou ,  Li Min Wang

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2874

摘要： A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

摘要翻译： 用于集成电路装置的探测装置包括探针卡，用于保持探针卡的探针支架，测试头和温度调节机构。 探针卡包括至少一个能够与集成电路装置形成与探针卡的第一表面电连接的探针，并且温度调节机构可位于探针卡的第二表面上/上。 温度调节机构可位于探针卡内，探头支架内或探头支架上。 测试头包括多个引脚，其被配置为与探针卡的连接部位和测试和测量单元和设备形成电连接。 温度调节机构可以位于测试头的内部或内部。 温度调节机构包括具有至少一个入口和多个出口的流动管线，并且出口可以定位在探针卡的第二表面上。