VERTICAL DIODE USING SILICON FORMED BY SELECTIVE EPITAXIAL GROWTH
    1.
    发明申请
    VERTICAL DIODE USING SILICON FORMED BY SELECTIVE EPITAXIAL GROWTH 有权
    通过选择性外延生长形成硅的垂直二极管

    公开(公告)号:US20090085163A1

    公开(公告)日:2009-04-02

    申请号:US11862964

    申请日:2007-09-27

    IPC分类号: H01L29/861 H01L21/329

    摘要: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

    摘要翻译: 一些实施例涉及在半导体本体和设置在半导体本体的掺杂区域上的外延膜之间出现垂直二极管活性的装置。 一些实施例包括引起垂直和横向二极管活动的装置。 一些实施例包括用于翅片半导体装置的门控垂直二极管。 工艺实施例包括形成垂直二极管装置。

    Vertical diode using silicon formed by selective epitaxial growth
    2.
    发明授权
    Vertical diode using silicon formed by selective epitaxial growth 有权
    使用通过选择性外延生长形成的硅的垂直二极管

    公开(公告)号:US08318553B2

    公开(公告)日:2012-11-27

    申请号:US12986875

    申请日:2011-01-07

    IPC分类号: H01L21/36 H01L21/329

    摘要: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

    摘要翻译: 一些实施例涉及在半导体本体和设置在半导体本体的掺杂区域上的外延膜之间出现垂直二极管活性的装置。 一些实施例包括引起垂直和横向二极管活动的装置。 一些实施例包括用于翅片半导体装置的门控垂直二极管。 工艺实施例包括形成垂直二极管装置。

    Electronic device and manufacturing method thereof
    3.
    发明授权
    Electronic device and manufacturing method thereof 有权
    电子装置及其制造方法

    公开(公告)号:US08310027B2

    公开(公告)日:2012-11-13

    申请号:US12138319

    申请日:2008-06-12

    IPC分类号: H01L29/73

    摘要: Embodiments relate to a bipolar transistor that includes a body region having a fin structure. At least one terminal region may be formed over at least a portion of the body region. The at least one terminal region may be formed as an epitaxially grown region. Embodiments also relate to a vertically integrated electronic device that includes a first terminal region, a second terminal region and a third terminal region. The second terminal region may be arranged over at least a portion of the third terminal region, and at least two of the first, second and third terminal regions may be formed as epitaxially grown regions.

    摘要翻译: 实施例涉及一种双极晶体管,其包括具有翅片结构的主体区域。 可以在身体区域的至少一部分上形成至少一个末端区域。 至少一个末端区域可以形成为外延生长区域。 实施例还涉及一种垂直集成的电子设备,其包括第一端子区域,第二端子区域和第三端子区域。 第二端子区域可以布置在第三端子区域的至少一部分上,并且第一,第二和第三端子区域中的至少两个可以形成为外延生长区域。

    VERTICAL DIODE USING SILICON FORMED BY SELECTIVE EPITAXIAL GROWTH
    4.
    发明申请
    VERTICAL DIODE USING SILICON FORMED BY SELECTIVE EPITAXIAL GROWTH 有权
    通过选择性外延生长形成硅的垂直二极管

    公开(公告)号:US20110095347A1

    公开(公告)日:2011-04-28

    申请号:US12986875

    申请日:2011-01-07

    IPC分类号: H01L29/78 H01L21/36

    摘要: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

    摘要翻译: 一些实施例涉及在半导体本体和设置在半导体本体的掺杂区域上的外延膜之间出现垂直二极管活性的装置。 一些实施例包括引起垂直和横向二极管活动的装置。 一些实施例包括用于翅片半导体装置的门控垂直二极管。 工艺实施例包括形成垂直二极管装置。

    Vertical diode using silicon formed by selective epitaxial growth
    6.
    发明授权
    Vertical diode using silicon formed by selective epitaxial growth 有权
    使用通过选择性外延生长形成的硅的垂直二极管

    公开(公告)号:US07888775B2

    公开(公告)日:2011-02-15

    申请号:US11862964

    申请日:2007-09-27

    IPC分类号: H01L27/08

    摘要: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

    摘要翻译: 一些实施例涉及在半导体本体和设置在半导体本体的掺杂区域上的外延膜之间出现垂直二极管活性的装置。 一些实施例包括引起垂直和横向二极管活动的装置。 一些实施例包括用于翅片半导体装置的门控垂直二极管。 工艺实施例包括形成垂直二极管装置。

    Multi-Fin Component Arrangement and Method for Manufacturing a Multi-Fin Component Arrangement
    8.
    发明申请
    Multi-Fin Component Arrangement and Method for Manufacturing a Multi-Fin Component Arrangement 审中-公开
    多翅片组件布置和制造多鳍组件布置的方法

    公开(公告)号:US20080283925A1

    公开(公告)日:2008-11-20

    申请号:US12124369

    申请日:2008-05-21

    IPC分类号: H01L27/088 H01L21/82

    摘要: In a first embodiment, a multi-fin component arrangement has a plurality of multi-fin component partial arrangements. Each of the multi-fin component partial arrangements has a plurality of electronic components, which electronic components have a multi-fin structure. At least one multi-fin component partial arrangement has at least one dummy structure, which at least one dummy structure is formed between at least two of the electronic components formed in the at least one multi-fin component partial arrangement. The dummy structure is formed in such a way that electrical characteristics of the electronic components formed in the multi-fin component partial arrangements are adapted to one another.

    摘要翻译: 在第一实施例中,多翅片部件布置具有多个多翅片部件部分布置。 多片组件部分布置中的每一个具有多个电子部件,该电子部件具有多鳍结构。 至少一个多翅片部件部分布置具有至少一个虚拟结构,在形成于至少一个多翅片部件部分布置中的至少两个电子部件之间形成至少一个虚拟结构。 虚拟结构形成为使得形成在多翅片部件部分布置中的电子部件的电特性彼此适配。