摘要:
The invention concerns a reagent kit designed to produce elements of synthetic resin for anchoring fixation elements in place by bonding them in multi-cavity plugs. The reagent kit comprises (a) a reagent mixture containing 2,2-bis-[4-(methacryloxyethoxy)phenyl]propane and an optionally unsaturated polyester resin, vinyl resin or acrylic resin or a mixture of these, (b) an accelerator component comprises an organic peroxide and (c) a filler component, the accelerator component (b) being kept separate from the reagent mixture (a) before use.
摘要:
A multi-component kit for a curable composition for fixing purposes, comprising an epoxy component (a), which comprises curable epoxides, and a hardener component (b), which comprises a Mannich base formulation, and the use of Mannich base formulations and, especially, further additives in hardener components for epoxy resins, the Mannich base formulation having specific properties (viscosity, H equivalents, content of free phenol derivatives). The multi-component kits according to the invention can be used within a broad temperature range and enable mortar compositions to be produced which, after curing, exhibit a particularly large tolerance range for temperatures and exhibit particularly high bond stress values at low temperatures and, especially, also at high temperatures.
摘要:
A multi-component kit for a curable composition for fixing purposes, comprising an epoxy component (a), which comprises curable epoxides, and a hardener component (b), which comprises a Mannich base formulation, and the use of Mannich base formulations and, especially, further additives in hardener components for epoxy resins, the Mannich base formulation having specific properties (viscosity, H equivalents, content of free phenol derivatives). The multi-component kits according to the invention can be used within a broad temperature range and enable mortar compositions to be produced which, after curing, exhibit a particularly large tolerance range for temperatures and exhibit particularly high bond stress values at low temperatures and, especially, also at high temperatures.