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1.发明授权Composite-forming method, composites formed thereby, and printed circuit boards incorporating them 有权复合成型方法，由此形成的复合材料，以及包含它们的印刷电路板公开(公告)号：US08053077B2
公开(公告)日：2011-11-08
申请号：US12617033
申请日：2009-11-12
IPC分类号： B32B27/38
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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2.发明授权Composite-forming method, composites formed thereby, and printed circuit boards incorporating them 有权复合成型方法，由此形成的复合材料，以及包含它们的印刷电路板公开(公告)号：US07655278B2
公开(公告)日：2010-02-02
申请号：US11670813
申请日：2007-02-02
IPC分类号： B05D5/00
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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3.发明申请COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM 有权复合成型方法，与其合成的复合材料和印制电路板公开(公告)号：US20080178983A1
公开(公告)日：2008-07-31
申请号：US11670813
申请日：2007-02-02
IPC分类号： C09J9/00
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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4.发明申请COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM 有权复合成型方法，与其合成的复合材料和印制电路板公开(公告)号：US20100084170A1
公开(公告)日：2010-04-08
申请号：US12617033
申请日：2009-11-12
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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公开(公告)号：US20080071000A1
公开(公告)日：2008-03-20
申请号：US11532164
申请日：2006-09-15
IPC分类号： C08J9/00
CPC分类号： C08L51/08 , C08F283/08 , C08F290/06 , C08F290/062 , C08J9/32 , C08J2201/024 , C08J2371/12 , C08L71/126 , C08L2666/02 , C08L2666/04
摘要： A cured composition is prepared by curing a composition that includes an alkyl styrene and a low molecular weight, bifunctional poly(arylene ether). The curable composition can be prepared and processed at substantially lower temperatures than prior art poly(arylene ether) thermosets. The cured composition exhibits an improved balance of heat resistance, impact strength, and dielectric properties, making it particularly suitable for the fabrication of electronic components.
摘要翻译： 通过固化包含烷基苯乙烯和低分子量双官能聚（亚芳基醚）的组合物来制备固化的组合物。 可固化组合物可以在比现有技术的聚（亚芳基醚）热固性材料低得多的温度下制备和加工。 固化的组合物表现出改善的耐热性，冲击强度和介电性能的平衡，使其特别适用于电子部件的制造。
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6.发明申请METHOD OF SEPARATING A POLY(ARYLENE ETHER) COMPOSITION FROM A SOLVENT, AND POLY(ARYLENE ETHER) COMPOSITION PREPARED THEREBY 有权从溶剂中分离聚（亚乙基醚）组合物的方法和制备的聚（亚乙基醚）组合物公开(公告)号：US20120277399A1
公开(公告)日：2012-11-01
申请号：US13282649
申请日：2011-10-27
IPC分类号： C08G65/00
CPC分类号： C08G65/44 , B29C47/0014 , B29C47/8845 , B29C47/8895 , C08G65/46 , C08G65/485 , C08L71/00 , C08L71/12 , C08L2205/05 , C08L2666/22
摘要： A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.
摘要翻译： 从溶剂中分离聚（亚芳基醚）的方法包括用脱挥发分挤出机处理含聚芳醚的溶液以形成挤出的组合物，并用不浸渍挤出的组合物的冷却装置冷却挤出的组合物 在水里。 该组合物可用于从其制备的含溶剂的反应混合物中分离聚（亚芳基醚），或从多组分聚（亚芳基醚）的热塑性组合物中除去溶剂。
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公开(公告)号：US20080103238A1
公开(公告)日：2008-05-01
申请号：US11554246
申请日：2006-10-30
CPC分类号： C08G65/485 , C08L71/126
摘要： A composition includes at least 15 weight percent of a low intrinsic viscosity, bifunctional poly(arylene ether) and at least 20 weight percent of a nonhalogenated solvent. The bifunctional poly(arylene ether)s are substantially and unexpectedly more soluble than their monofunctional analogs. The compositions are useful as concentrates to add bifunctional poly(arylene ether)s to thermosets.
摘要翻译： 组合物包含至少15重量％的低特性粘度，双官能聚（亚芳基醚）和至少20重量％的非卤化溶剂。 双官能聚（亚芳基醚）比其单官能类似物基本上和意想不到的更易溶解。 该组合物可用作浓缩物以将双官能聚（亚芳基醚）加成到热固性材料中。
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公开(公告)号：US07638566B2
公开(公告)日：2009-12-29
申请号：US11554246
申请日：2006-10-30
IPC分类号： C08G18/08
CPC分类号： C08G65/485 , C08L71/126
摘要： A composition includes at least 15 weight percent of a low intrinsic viscosity, bifunctional poly(arylene ether) and at least 20 weight percent of a nonhalogenated solvent. The bifunctional poly(arylene ether)s are substantially and unexpectedly more soluble than their monofunctional analogs. The compositions are useful as concentrates to add bifunctional poly(arylene ether)s to thermosets.
摘要翻译： 组合物包含至少15重量％的低特性粘度，双官能聚（亚芳基醚）和至少20重量％的非卤化溶剂。 双官能聚（亚芳基醚）比其单官能类似物基本上和意想不到的更易溶解。 该组合物可用作浓缩物以将双官能聚（亚芳基醚）加成到热固性材料中。
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9.发明申请METHOD OF SEPARATING A POLY(ARYLENE ETHER) COMPOSITION FROM A SOLVENT, AND POLY(ARYLENE ETHER) COMPOSITION PREPARED THEREBY 有权从溶剂中分离聚（亚乙基醚）组合物的方法和制备的聚（亚乙基醚）组合物公开(公告)号：US20080246173A1
公开(公告)日：2008-10-09
申请号：US11696539
申请日：2007-04-04
CPC分类号： C08G65/44 , B29C47/0014 , B29C47/8845 , B29C47/8895 , C08G65/46 , C08G65/485 , C08L71/00 , C08L71/12 , C08L2205/05 , C08L2666/22
摘要： A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.
摘要翻译： 从溶剂中分离聚（亚芳基醚）的方法包括用脱挥发分挤出机处理含聚芳醚的溶液以形成挤出的组合物，并用不浸渍挤出的组合物的冷却装置冷却挤出的组合物 在水里。 该组合物可用于从其制备的含溶剂的反应混合物中分离聚（亚芳基醚），或从多组分聚（亚芳基醚）的热塑性组合物中除去溶剂。
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公开(公告)号：US20080071034A1
公开(公告)日：2008-03-20
申请号：US11532153
申请日：2006-09-15
IPC分类号： C08F283/08
CPC分类号： C08F290/062 , C08F283/085 , C08F212/12
摘要： A curable composition includes an alkyl styrene and a low molecular weight, bifunctional poly(arylene ether). The composition can be prepared and processed at substantially lower temperatures than prior art poly(arylene ether) thermosets. After curing, the composition exhibits an improved balance of heat resistance, impact strength, and dielectric properties, making it particularly suitable for the fabrication of electronic components.
摘要翻译： 可固化组合物包括烷基苯乙烯和低分子量的双官能聚（亚芳基醚）。 可以在比现有技术的聚（亚芳基醚）热固性材料低得多的温度下制备和处理组合物。 固化后，组合物的耐热性，冲击强度和介电性能的平衡得到改善，特别适用于电子部件的制造。
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