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公开(公告)号：US09611385B2
公开(公告)日：2017-04-04
申请号：US13538295
申请日：2012-06-29
摘要： Disclosed are compositions comprising: (a) 10 to 40 percent by weight of the ultrafine particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 9 microns or less; (b) 60 to 90 percent by weight of an epoxy resin; wherein the weight percents are based on the total weight of the composition. Also disclosed are processes for preparing such compositions as well as articles derived therefrom.
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2.发明申请COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM 有权复合成型方法，与其合成的复合材料和印制电路板公开(公告)号：US20100084170A1
公开(公告)日：2010-04-08
申请号：US12617033
申请日：2009-11-12
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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公开(公告)号：US20090062478A1
公开(公告)日：2009-03-05
申请号：US11845823
申请日：2007-08-28
申请人： Alvaro Carrillo , Hua Guo , Alexey Kruglov , Edward Norman Peters
发明人： Alvaro Carrillo , Hua Guo , Alexey Kruglov , Edward Norman Peters
IPC分类号： C08G65/48
CPC分类号： C08G65/44 , C08G65/485 , C08L2205/05
摘要： Capped poly(arylene ether)s are prepared by a method that includes reacting a poly(arylene ether) with a capping agent to form a capping reaction mixture, washing the capping reaction mixture with a concentrated basic aqueous solution, and isolating the capped poly(arylene ether) by a total isolation method. The washing method is effective for removal of capping-related impurities, and surprisingly does not result in decomposition of the capped poly(arylene ether).
摘要翻译： 通过包括使聚（亚芳基醚）与封端剂反应形成封端反应混合物，用浓缩的碱性水溶液洗涤封端反应混合物并分离封端的聚（亚芳基醚）的聚（亚芳基醚） 亚芳基醚）。 洗涤方法对于去除封端相关杂质是有效的，并且令人惊奇地不会导致封端的聚（亚芳基醚）的分解。
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公开(公告)号：US20080171817A1
公开(公告)日：2008-07-17
申请号：US11623900
申请日：2007-01-17
IPC分类号： C08K5/34
CPC分类号： C08G65/485 , C08L71/126 , H05K1/0373 , C08L2666/04
摘要： A curable composition includes a functionalized poly(arylene ether), a vinyl thermoset resin, and a flame retardant composition. The flame retardant composition includes a trihydrocarbylphosphine oxide and a nitrogen-containing flame retardant that may be melamine phosphate, melamine pyrophosphate, or melamine polyphosphate. The combination of the trihydrocarbylphosphine oxide and the nitrogen-containing flame retardant is particularly effective at improving the flame retardancy of the cured composition at relatively low levels of total flame retardant. A method of preparing the curable composition and articles including the cured composition are also described.
摘要翻译： 可固化组合物包括官能化聚（亚芳基醚），乙烯基热固性树脂和阻燃组合物。 阻燃剂组合物包括三烃基氧化膦和可以是磷酸三聚氰胺，焦磷酸三聚氰胺或多磷酸三聚氰胺的含氮阻燃剂。 三烃基氧化膦和含氮阻燃剂的组合对于提高固化组合物的阻燃性在相对低的总阻燃剂水平下是特别有效的。 还描述了制备可固化组合物的方法和包含固化的组合物的制品。
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5.发明申请EPOXYBENZYL-TERMINATED POLY(ARYLENE ETHER)S, METHOD FOR PREPARATION THEREOF, AND CURABLE COMPOSITIONS COMPRISING SAME 有权环氧乙烷封端的聚（亚乙基醚）S，其制备方法和包含其的可固化组合物公开(公告)号：US20140058014A1
公开(公告)日：2014-02-27
申请号：US14071742
申请日：2013-11-05
申请人： Edward Norman Peters
发明人： Edward Norman Peters
IPC分类号： C08L63/00
CPC分类号： C08L63/00 , B32B27/04 , B32B27/38 , B32B37/18 , B32B2260/023 , B32B2260/046 , B32B2305/076 , B32B2457/08 , C08G59/4215 , C08G59/4223 , C08G59/4276 , C08G59/54 , C08G59/686 , C08G65/485 , C08J5/24 , C08J2371/12 , C08K3/013 , C08K3/28 , C08K3/38 , C08K5/01 , C08K5/02 , C08K5/06 , C08K5/07 , C08K5/101 , C08K5/315 , C08K7/14 , C08K2003/2217 , C08K2003/2227 , C08K2003/382 , C08L63/04 , C08L63/06 , C08L71/126 , H05K1/0366 , H05K1/0373 , Y10T156/10 , Y10T428/24802 , Y10T428/24994 , Y10T428/31511
摘要： An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.
摘要翻译： 环氧苄基封端的聚（亚芳基醚）具有结构R-W-R，其中W是用酚氧原子封端的二价聚（亚芳基醚）残基，R是环氧苄基，其中R出现相同或不同。 环氧苄基封端的聚（亚芳基醚）通过使含过氧化物的试剂与乙烯基封端的聚（亚芳基醚）反应形成。 还公开了包含环氧苄基封端的聚（亚芳基醚），固化促进剂和任选的辅助环氧树脂的可固化组合物。 可固化组合物可用于制备复合材料，特别是用于制造印刷电路板的复合材料。
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6.发明申请公开(公告)号：US20130274393A1
公开(公告)日：2013-10-17
申请号：US13446162
申请日：2012-04-13
申请人： Edward Norman Peters
发明人： Edward Norman Peters
摘要： A poly(phenylene ether)-poly(hydroxy ether) block copolymer is used to compatibilize blends of non-polar polymers with polar fillers. The resulting compatibilized blends exhibit physical property improvements relative to blends without a compatibilizer and blends with a poly(hydroxy ether).
摘要翻译： 聚（苯醚） - 聚（羟基醚）嵌段共聚物用于使非极性聚合物与极性填料的共混物相容化。 相对于没有增容剂的共混物和与聚（羟基醚）的共混物，所得到的相容化共混物显示物理性能改进。
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7.发明申请公开(公告)号：US20130237648A1
公开(公告)日：2013-09-12
申请号：US13415016
申请日：2012-03-08
申请人： Edward Norman Peters
发明人： Edward Norman Peters
CPC分类号： C08L1/10 , C08L67/02 , C08L67/04 , C08L71/12 , C08L77/00 , C08L2205/02 , C08L53/02 , C08L53/00 , C08L71/10
摘要： A poly(phenylene ether)-poly(hydroxy ether) block copolymer is used to compatibilize blends of polar polymers and non-polar polymers. The resulting compatibilized blends exhibit physical property improvements relative to blends without a compatibilizer and blends with a poly(hydroxy ether).
摘要翻译： 聚（亚苯基醚） - 聚（羟基醚）嵌段共聚物用于使极性聚合物和非极性聚合物的共混物相容化。 相对于没有增容剂的共混物和与聚（羟基醚）的共混物，所得到的相容化共混物显示物理性能改进。
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8.发明授权Composite-forming method, composites formed thereby, and printed circuit boards incorporating them 有权复合成型方法，由此形成的复合材料，以及包含它们的印刷电路板公开(公告)号：US07655278B2
公开(公告)日：2010-02-02
申请号：US11670813
申请日：2007-02-02
IPC分类号： B05D5/00
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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公开(公告)号：US07595367B2
公开(公告)日：2009-09-29
申请号：US11845823
申请日：2007-08-28
申请人： Alvaro Carrillo , Hua Guo , Alexey Kruglov , Edward Norman Peters
发明人： Alvaro Carrillo , Hua Guo , Alexey Kruglov , Edward Norman Peters
IPC分类号： C08F283/08
CPC分类号： C08G65/44 , C08G65/485 , C08L2205/05
摘要： Capped poly(arylene ether)s are prepared by a method that includes reacting a poly(arylene ether) with a capping agent to form a capping reaction mixture, washing the capping reaction mixture with a concentrated basic aqueous solution, and isolating the capped poly(arylene ether) by a total isolation method. The washing method is effective for removal of capping-related impurities, and surprisingly does not result in decomposition of the capped poly(arylene ether).
摘要翻译： 通过包括使聚（亚芳基醚）与封端剂反应形成封端反应混合物，用浓缩的碱性水溶液洗涤封端反应混合物并分离封端的聚（亚芳基醚）的聚（亚芳基醚） 亚芳基醚）。 洗涤方法对于除去封盖相关杂质是有效的，并且令人惊讶地不会导致封端的聚（亚芳基醚）的分解。
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10.发明申请COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM 有权复合成型方法，与其合成的复合材料和印制电路板公开(公告)号：US20080178983A1
公开(公告)日：2008-07-31
申请号：US11670813
申请日：2007-02-02
IPC分类号： C09J9/00
CPC分类号： H05K1/0326 , C08L63/00 , C08L71/12 , H05K1/0366 , Y10S428/901 , Y10T428/31511 , C08L2666/22
摘要： A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.
摘要翻译： 复合成型方法包括在约10至约40℃的温度下用可固化组合物浸渍增强结构。可固化组合物包括特定量的环氧树脂，聚（亚芳基醚），溶剂和固化 启动子。 聚（亚芳基醚）每分子平均包含约1.6至约2.4个酚羟基，并且其分子量指数小于或等于2.2，特性粘度为约0.03至约0.2分升每克。 这些特征大大提高了聚（亚芳基醚）在可固化组合物中的溶解度，并使得可固化组合物在室温或室温附近形成和使用。 还描述了由包括复合材料的工艺和电路板形成的复合材料。
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