Method and apparatus for performing field-to-field compensation
    1.
    发明授权
    Method and apparatus for performing field-to-field compensation 有权
    用于执行现场补偿的方法和装置

    公开(公告)号:US07120514B1

    公开(公告)日:2006-10-10

    申请号:US09815446

    申请日:2001-03-22

    IPC分类号: G06F19/00 G06F7/48

    CPC分类号: G03F9/7034 G03F7/70633

    摘要: The present invention provides for a method and an apparatus for performing field-to-field compensation during semiconductor manufacturing. At least one semiconductor device is processed. Metrology data is collected from the processed semiconductor device. A field-to-field metrology analysis is performed based upon the metrology data. Residual-error analysis is performed based upon the field-to-field analysis.

    摘要翻译: 本发明提供一种用于在半导体制造期间执行场到场补偿的方法和装置。 至少一个半导体器件被处理。 从被处理的半导体器件收集测量数据。 基于测量数据进行现场测量分析。 基于现场分析进行残差分析。

    Method and apparatus for controlling process target values based on manufacturing metrics
    5.
    发明授权
    Method and apparatus for controlling process target values based on manufacturing metrics 失效
    基于制造指标控制过程目标值的方法和装置

    公开(公告)号:US06937914B1

    公开(公告)日:2005-08-30

    申请号:US09789872

    申请日:2001-02-21

    IPC分类号: G05B19/418 G06F19/00

    摘要: A method for controlling a tool adapted to process workpieces in accordance with an operating recipe based on a process target value is provided. The method includes collecting manufacturing characteristic data associated with the workpieces; correlating the manufacturing characteristic data with a first manufacturing metric to generate a first manufacturing metric distribution for the workpieces; and adjusting the process target value based on the first manufacturing metric distribution. A manufacturing system includes a processing tool and a target monitor. The processing tool is adapted to process workpieces in accordance with an operating recipe based on a process target value. The target monitor is adapted to collect manufacturing characteristic data associated with the workpieces, correlate the manufacturing characteristic data with a first manufacturing metric to generate a first manufacturing metric distribution for the workpieces, and adjust the process target value based on the first manufacturing metric distribution.

    摘要翻译: 提供了一种用于控制适于根据基于过程目标值的操作配方来处理工件的工具的方法。 该方法包括收集与工件相关联的制造特性数据; 将所述制造特征数据与第一制造度量相关联,以产生所述工件的第一制造度量分布; 以及基于所述第一制造度量分布来调整所述过程目标值。 制造系统包括处理工具和目标监视器。 处理工具适于根据基于过程目标值的操作配方来处理工件。 目标监视器适于收集与工件相关联的制造特性数据,将制造特性数据与第一制造度量相关联,以产生工件的第一制造度量分布,并且基于第一制造度量分布来调整过程目标值。

    Method and apparatus for controlling a tool using a baseline control script
    6.
    发明授权
    Method and apparatus for controlling a tool using a baseline control script 有权
    使用基线控制脚本控制工具的方法和装置

    公开(公告)号:US06615098B1

    公开(公告)日:2003-09-02

    申请号:US09789871

    申请日:2001-02-21

    IPC分类号: G06F1760

    摘要: A method for controlling a manufacturing system includes processing workpieces in a plurality of tools; initiating a baseline control script for a selected tool of the plurality of tools; providing context information for the baseline control script; determining a tool type based on the context information; selecting a control routine for the selected tool based on the tool type; and executing the control routine to generate a control action for the selected tool. A manufacturing system includes a plurality of tools adapted to process workpieces, a control execution manager, and a control executor. The control execution manager is adapted to initiate a baseline control script for a selected tool of the plurality of tools and provide context information for the baseline control script. The control executor is adapted to execute the baseline control script, determine a tool type based on the context information, select a control routine for the selected tool based on the tool type, and execute the control routine to generate a control action for the selected tool.

    摘要翻译: 一种用于控制制造系统的方法包括:处理多个工具中的工件; 为所述多个工具的所选择的工具启动基线控制脚本; 提供基线控制脚本的上下文信息; 基于上下文信息确定工具类型; 根据刀具类型选择所选刀具的控制程序; 以及执行所述控制程序以产生所选择的工具的控制动作。 制造系统包括适于处理工件的多个工具,控制执行管理器和控制执行器。 所述控制执行管理器适于启动用于所述多个工具的所选工具的基线控制脚本并提供所述基线控制脚本的上下文信息。 控制执行器适于执行基线控制脚本,基于上下文信息确定工具类型,基于工具类型选择所选刀具的控制程序,并执行控制程序以生成所选刀具的控制动作 。

    Automated method of controlling photoresist develop time to control critical dimensions, and system for accomplishing same
    7.
    发明授权
    Automated method of controlling photoresist develop time to control critical dimensions, and system for accomplishing same 有权
    控制光刻胶的自动化方法开发时间来控制关键尺寸,并实现相同的系统

    公开(公告)号:US06569692B1

    公开(公告)日:2003-05-27

    申请号:US09776087

    申请日:2001-02-02

    IPC分类号: G01R3126

    摘要: The present invention is directed to an automated method of controlling photoresist develop time to control critical dimensions, and a system for accomplishing same. In one embodiment, the method comprises measuring a critical dimension of each of a plurality of features formed in a layer of photoresist, providing the measured critical dimensions of the features, in the layer of photoresist to a controller that determines, based upon the measured critical dimensions, a duration of a photoresist develop process to be performed on a layer of photoresist formed above a subsequently processed wafer, and performing a photoresist develop process on the subsequently processed wafer for the determined duration.

    摘要翻译: 本发明涉及控制光刻胶显影时间以控制关键尺寸的自动化方法,以及用于实现其的系统。 在一个实施例中,该方法包括测量在光致抗蚀剂层中形成的多个特征中的每一个的临界尺寸,将光刻胶层中的特征的测量临界尺寸提供给控制器,所述控制器基于所测量的临界值 尺寸,光致抗蚀剂的持续时间将在随后处理的晶片上形成的光致抗蚀剂层上进行,并对所确定的持续时间在随后处理的晶片上进行光刻胶显影处理。

    Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thickness
    8.
    发明授权
    Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thickness 失效
    改变步进曝光剂量以补偿光致抗蚀剂厚度的跨晶片变化的方法

    公开(公告)号:US06576385B2

    公开(公告)日:2003-06-10

    申请号:US09776206

    申请日:2001-02-02

    IPC分类号: G03F900

    CPC分类号: G03F7/70558

    摘要: A method of compensating for across-wafer variations in photoresist thickness is provided. The method comprises providing a wafer having a process layer formed there-above, forming a layer of photoresist above the process layer, measuring a thickness of the layer of photoresist at a plurality of locations to result in a plurality of thickness measurements, providing the thickness measurements to a controller that determines, based upon the thickness measurements, an exposure dose of an exposure process to be performed on the layer of photoresist, and performing the exposure process on the layer of photoresist using the determined exposure dose. This exposure dose may be varied on a flash-by-flash basis as the stepper tool “steps” across the surface of wafers. That is, the exposure dose for a group of flashes, or for each flash, may be varied in response to the thickness measurements.

    摘要翻译: 提供了补偿光致抗蚀剂厚度的跨晶片变化的方法。 该方法包括提供具有在其上形成的处理层的晶片,在处理层上方形成光致抗蚀剂层,测量多个位置处的光致抗蚀剂层的厚度,以产生多个厚度测量值,从而提供厚度 控制器的测量,其基于厚度测量确定将在光致抗蚀剂层上进行的曝光处理的曝光剂量,以及使用确定的曝光剂量对光致抗蚀剂层进行曝光处理。 当步进工具跨越晶片表面“步进”时,该曝光剂量可以在逐闪的基础上变化。 也就是说,一组闪光或每个闪光灯的曝光剂量可以响应于厚度测量而变化。

    Method for prioritizing production lots based on grade estimates and output requirements
    9.
    发明授权
    Method for prioritizing production lots based on grade estimates and output requirements 有权
    根据年龄估计和产出要求确定生产批次的方法

    公开(公告)号:US06699727B1

    公开(公告)日:2004-03-02

    申请号:US09821675

    申请日:2001-03-29

    IPC分类号: G01R3126

    摘要: A method for prioritizing production flow includes processing a plurality of manufactured items in a process flow; measuring characteristics of a plurality of manufactured items in the process flow; estimating performance grades for the plurality of manufactured items based on the measured characteristics; grouping the manufactured items with like estimated performance grades; assigning priorities to groups of manufactured items with like estimated performance grades; and directing the plurality of manufactured items through the process flow based on the assigned priorities. A manufacturing system includes a plurality of processing tools adapted to process a plurality of manufactured items in a process flow, a metrology tool, and a process control server. The metrology tool is adapted to measure characteristics of a plurality of manufactured items in the process flow. The process control server is adapted to estimate performance grades for the plurality of manufactured items based on the measured characteristics, group the manufactured items with like estimated performance grades, assign priorities to groups of manufactured items with like estimated performance grades, and direct the plurality of manufactured items through the process flow based on the assigned priorities.

    摘要翻译: 一种用于确定生产流程优先级的方法包括在处理流程中处理多个制造的物品; 测量处理流程中的多个制成品的特性; 基于所测量的特性来估计所述多个制造物品的性能等级; 对具有相似估计性能等级的制成品进行分组; 将优先事项分配给具有类似估计绩效等级的制成品组; 以及基于所分配的优先级,通过所述处理流程来引导所述多个制造的物品。 制造系统包括多个处理工具,其适用于处理流程中的多个制造物品,计量工具和过程控制服务器。 计量工具适于测量处理流程中的多个制造物品的特性。 过程控制服务器适于基于测量的特性来估计多个制造物品的性能等级,将具有相似估计性能等级的制造物品分组,将具有相似估计性能等级的制造商品组的优先级分配给多个 基于分配的优先级,通过流程流程制造出的物品。