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公开(公告)号：US5641944A
公开(公告)日：1997-06-24
申请号：US536736
申请日：1995-09-29
CPC分类号： H05K1/183 , H05K1/0204 , H05K1/021 , H05K7/209 , H05K2201/10166 , H05K2201/10416
摘要： A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs. The layers are advantageously thermally matched such that heat generated during operation is evenly dissipated by the mounting area and causes uniform expansion of all layers.
摘要翻译： 描述用于电动机控制器的多层电路板或层压电路板。 多层电路板优选用作功率基板模块。 功率基板模块包括设置在凹槽，窗口或电路板的部分中的安装区域，其中电路板仅为单层厚度。 绝缘安装区域设置在多层电路板中的盲孔中。 在安装区域的单个电路板层提供用于接收散热器的导热但高度电绝缘的安装区域。 散热器可以安装在与电气设备相对的一侧。 散热器可以是标准散热器或直接焊接到电路板的铜线圈。 多层电路板包括用于接收表面安装器件的增强导电层。 增强导电层优选地包括保持铜片的绝缘框架。 这些层有利地是热匹配的，使得在操作期间产生的热量被安装区域均匀消散，并引起所有层的均匀膨胀。
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2.发明授权Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area 失效制造多层电路板的方法，所述多层电路板具有暴露出用于绝缘安装区域的增强导电层的窗口公开(公告)号：US06200407B1
公开(公告)日：2001-03-13
申请号：US08878488
申请日：1997-06-18
IPC分类号： B32B3116
CPC分类号： H05K1/021 , H05K1/182 , H05K2201/10166 , H05K2201/10416 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T156/1056 , Y10T156/1057
摘要： A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.
摘要翻译： 描述用于电动机控制器的多层电路板或层压电路板。 多层电路板优选用作功率基板模块。 功率基板模块包括设置在凹槽，窗口或电路板的部分中的安装区域，其中电路板仅为单层厚度。 绝缘安装区域设置在多层电路板中的盲孔中。 在安装区域的单个电路板层提供用于接收散热器的导热但高度电绝缘的安装区域。 散热器可以安装在与电气设备相对的一侧。 散热器可以是标准散热器或直接焊接到电路板的铜线圈。 多层电路板包括用于接收表面安装器件的增强导电层。 增强导电层优选地包括保持铜片的绝缘框架。
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公开(公告)号：US5835356A
公开(公告)日：1998-11-10
申请号：US536877
申请日：1995-09-29
CPC分类号： H05K1/021 , H05K7/209 , H05K1/182 , H05K2201/10166 , H05K2201/10416
摘要： A power substrate module having a multilayer circuit board or laminated circuit board for use in a motor controller is described. The power substrate module includes pair of switching devices coupled across a direct current bus for converting direct current power from the bus to controlled alternating current power in response to control signals. The circuit board includes a first conductive layer, a second conductive layer and an insulative layer separating the conductive layers. The first and second conductive layers each include a conductive bus region, one of which is coupled to the first switching device and forms a high side of the direct current bus, and the other of which is coupled to the second switching device and forms the low side of the direct current bus.
摘要翻译： 描述了具有用于电动机控制器的多层电路板或层压电路板的电源基板模块。 功率基板模块包括一对开关装置，其跨越直流总线耦合，用于响应于控制信号将来自总线的直流电力转换成受控的交流电力。 电路板包括第一导电层，第二导电层和分离导电层的绝缘层。 第一和第二导电层各自包括导电总线区域，其中一个导体总线区域耦合到第一开关装置并形成直流母线的高侧，而另一个连接到第二开关装置并形成低电平 一侧的直流母线。
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4.发明授权Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area 失效具有窗口的多层电路板暴露出用作绝缘安装区域的增强导电层
公开(公告)号：US5670749A
公开(公告)日：1997-09-23
申请号：US536839
申请日：1995-09-29
CPC分类号： H05K1/021 , H05K1/0204 , H05K1/182 , H05K2201/10166 , H05K2201/10416
摘要： A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.
摘要翻译： 描述用于电动机控制器的多层电路板或层压电路板。 多层电路板优选用作功率基板模块。 功率基板模块包括设置在凹槽，窗口或电路板的部分中的安装区域，其中电路板仅为单层厚度。 绝缘安装区域设置在多层电路板中的盲孔中。 在安装区域的单个电路板层提供用于接收散热器的导热但高度电绝缘的安装区域。 散热器可以安装在与电气设备相对的一侧。 散热器可以是标准散热器或直接焊接到电路板的铜线圈。 多层电路板包括用于接收表面安装器件的增强导电层。 增强导电层优选地包括保持铜片的绝缘框架。
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公开(公告)号：US5648892A
公开(公告)日：1997-07-15
申请号：US536224
申请日：1995-09-29
申请人： Christopher J. Wieloch , Thomas E. Babinski , John C. Mather , Gerard A. Woychik , Steven R. McLaughlin
发明人： Christopher J. Wieloch , Thomas E. Babinski , John C. Mather , Gerard A. Woychik , Steven R. McLaughlin
CPC分类号： H05K7/20918 , H02M7/003 , H05K1/14 , H05K1/148
摘要： A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM.TM. interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.
摘要翻译： 用于电动机控制器的多层电路板系统或层压电路板系统包括主板，至少一个电源基板电路板和电容器电路板。 功率基板模块包括设置在凹槽，窗口或电路板的部分中的安装区域，其中电路板仅为单层厚度。 在安装区域的单个电路板层提供用于接收散热器的导热但高度电绝缘的安装区域。 散热器可以安装在与电气设备相对的一侧。 电容器电路板，电源基板电路板和母电路板互不连接而不使用外部连接器或电线。 柔性电路板层或SCM TM互连接口允许电路板仅由印刷电路（PC）线连接。
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6.发明授权
公开(公告)号：US5616888A
公开(公告)日：1997-04-01
申请号：US537216
申请日：1995-09-29
CPC分类号： H05K1/183 , H05K7/205 , H05K1/0201
摘要： A rigid-flex multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single flexible circuit board layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single flexible circuit board layer is less than 2.0 mils thick and includes polyimide. The single flexible circuit board layer provides a heat conductive yet highly electrically insulative mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting area eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.
摘要翻译： 刚性柔性多层电路板或层压电路板包括用于表面安装封装的绝缘安装区域。 安装区域设置在电路板的凹部或部分中，其中电路板仅是单个柔性电路板层厚的。 绝缘安装区域设置在多层电路板中的盲孔中。 与单个柔性电路板层相关的绝缘介质的厚度小于2.0密耳，并且包括聚酰亚胺。 单个柔性电路板层提供用于接收散热器的导热但高度电绝缘的安装区域。 散热器可以安装在与电气设备相对的一侧。 散热器可以是直接焊接到电路板的标准散热器或铜线圈。 散热器安装区域不需要螺栓，螺母，支架和隔离功率半导体部件所需的附加绝缘层。
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公开(公告)号：US06995726B1
公开(公告)日：2006-02-07
申请号：US10891724
申请日：2004-07-15
申请人： James B. West , John C. Mather
发明人： James B. West , John C. Mather
IPC分类号： H01Q13/00
CPC分类号： H01Q21/061 , H01Q13/06 , H01Q21/0006
摘要： A phased array antenna is made up of linear arrays. Each of the linear arrays has a printed circuit board spine. Split waveguides are formed from two symmetrical portions conductively joined to ground on opposite sides of the printed circuit board spine. Planar transmission line-to-waveguide transitions are mounted on the printed circuit board spine within the split waveguides. Phase shifter/TTD devices are mounted on the circuit board spine within the split waveguides for steering the phased array antenna beam. Bias and control circuitry is etched on the circuit board spine for biasing and controlling the phase shifter/TTD devices. The phased array antenna may be made up of the linear arrays combined into a two-dimensional array and fed with a waveguide feed or a printed feed manifold attached to the printed wiring board spine.
摘要翻译： 相控阵天线由线性阵列组成。 每个线性阵列都具有印刷电路板脊柱。 分离波导由在印刷电路板脊的相对侧导电连接到地面上的两个对称部分形成。 平面传输线到波导的转换安装在分立波导内的印刷电路板脊上。 移相器/ TTD器件安装在分立波导内的电路板脊上，用于转向相控阵天线波束。 偏置和控制电路蚀刻在电路板脊上，用于偏移和控制移相器/ TTD器件。 相控阵天线可以由组合成二维阵列的线性阵列组成，并且馈送有连接到印刷线路板脊柱的波导馈送或印刷馈送歧管。
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8.发明授权Method and structure for phased array antenna interconnect using an array of substrate slats 有权使用衬底板阵列的相控阵天线互连的方法和结构公开(公告)号：US06950062B1
公开(公告)日：2005-09-27
申请号：US10273459
申请日：2002-10-18
CPC分类号： H01P1/185 , H01P1/19 , H01P1/2005 , H01Q3/34 , H01Q21/0087
摘要： A phased array antenna is formed from an array of apertures having walls containing phase shifter devices for phase shifting and beam steering a radiated beam of the phased array antenna. The phase shifter devices are interconnected with an interconnect structure formed from substrate slats that form the walls of the apertures. The substrate slats may be thin film circuitized column slats having a metal substrate, dielectric layers, metal bias/control circuitry, a shielding layer, and circuit terminations to connect to a phase shifter device attached to the substrate slat.
摘要翻译： 相控阵天线由具有包含用于相移的移相器装置的壁的孔阵列形成，并且对相控阵天线的辐射束进行波束导向。 移相器件与由形成孔壁的衬底板形成的互连结构互连。 衬底板可以是具有金属衬底，电介质层，金属偏压/控制电路，屏蔽层和电路端子的薄膜电路化柱板，以连接到连接到衬底板条的移相器件。
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9.发明授权Stripline-to-waveguide transition including metamaterial layers and an aperture ground plane 有权包括超材料层和孔径接地平面的平行至波导过渡公开(公告)号：US08576023B1
公开(公告)日：2013-11-05
申请号：US12763683
申请日：2010-04-20
IPC分类号： H01P5/107
CPC分类号： H01P3/121 , H01P5/107 , H01Q15/0086
摘要： The present invention is directed to an interface for connecting a waveguide manifold of a transition to a stripline manifold of the transition. The interface may include a plurality of metamaterial layers, each including a metamaterial(s). The interface may further include a ground plane layer which may be connected to both the plurality of metamaterial layers and to the stripline manifold. Further, the interface may include a plurality of ground vias which may form channels through each of the layers of the interface and through the stripline manifold for providing a ground structure for the interface. The interface is further configured for forming a resonant structure which provides a low-loss, broadband conversion between a stripline mode and a waveguide mode for electromagnetic energy traversing through the interface between the waveguide manifold and the stripline manifold.
摘要翻译： 本发明涉及一种用于将过渡的波导歧管连接到过渡段的带状排歧管的接口。 界面可以包括多个超材料层，每个超材料层包括超材料。 界面还可以包括可以连接到多个超材料层和带状线歧管两者的接地平面层。 此外，接口可以包括多个接地通孔，其可以形成通过接口的每个层的通道并且通过带状线歧管，用于为接口提供接地结构。 该界面还被配置用于形成谐振结构，该谐振结构在带状线模式和波导模式之间提供低损耗的宽带转换，以使电磁能量穿过波导歧管和带状线歧管之间的界面。
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公开(公告)号：US07170446B1
公开(公告)日：2007-01-30
申请号：US10949842
申请日：2004-09-24
申请人： James B. West , John C. Mather
发明人： James B. West , John C. Mather
CPC分类号： H01Q13/085 , H01Q3/30
摘要： A phased array antenna is provided having a plurality of phase shifter devices for phase shifting and beam steering a radiated beam of the phased array antenna. The plurality of phase shifter devices are interconnected with an interconnect structure comprising a plurality of linear array substrate slats. Each linear array substrate slat includes a plurality of radiating elements formed using first and second metal layers of the substrate slat, a plurality of phase shifter devices and a common RF feed conductor for the plurality of radiating elements. The common RF feed conductor is formed on a third metal layer of the substrate slat that is disposed between the first and second metal layers. The common RF feed conductor is configured to include a single location for electrical connections to receive RF signals for the plurality of radiating elements. The phased array antenna also includes bias/control conductors applied to selected areas of the third metal layer, a fourth metal layer applied over the second metal layer and a shielding metal layer applied on the fourth metal layer. The bias/control conductors are configured to include a single location for electrical connections to receive bias voltages and control signals. The fourth metal layer includes circuit connections from the bias/control circuitry to the plurality of phase shifter devices. Each phase shifter device is attached to a radiating element via a mounting location on the shielding metal layer. Accordingly, a phased array antenna interconnect structure is provided that reduces the number of electrical connections required to provide RF signals and bias/control signals to multiple radiating elements and phase shifters, respectively, of the phased array antenna and provides a cost effective phased array antenna architecture that has a single locus of electrical connection for RF and bias control signals embedded in a multi-layer linear array or slat substrate of the phased array antenna.
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