摘要:
The burst mode memory architecture using interleaved memory arrays provides even and odd EPROM arrays with data having even addresses stored in the even array and data having odd addresses stored in the odd array. A control circuit receives an initial address from a memory system controller and then accesses all data from the even and odd arrays within a burst address space containing the initial address. A pair of out-of-phase counters generate even and odd addresses, respectively, for accessing the even and odd arrays. Each counter increments addresses sequentially until a burst address space boundary is reached, then the counters wrap around to a beginning of a burst address space to generate any remaining addresses within a burst address space. The burst mode control circuitry is capable of processing a variety of burst sequencing modes. The burst address space size and the burst sequencing mode are selectable. A particular embodiment for generating an aligned sequential burst address sequence is described.
摘要:
A memory is described that includes a main memory array having a plurality of main memory locations and a redundant memory array having a plurality of redundant memory locations. A main decoding circuit is coupled to the main memory array for decoding an address received from an external circuit to access a selected one of the plurality of main memory locations. A storage circuit is provided for pre-storing the address of the selected one of the plurality of main memory locations when the selected one of the plurality of main memory locations is defective. A redundant comparison circuit is coupled to the redundant memory array and the storage circuit for comparing the external address with the address stored in the storage circuit in order to access a selected one of the plurality of redundant memory locations. A static decoding circuit is coupled to the storage circuit and the main select circuit for decoding the address received from the storage circuit and for disabling the main select circuit from accessing the selected one of the plurality of main memory locations such that when the redundant comparison circuit accesses the selected one of the plurality of redundant memory locations, the main select circuit has already been disabled from accessing the selected one of the plurality of main memory locations.
摘要:
The burst mode memory architecture using interleaved memory arrays provides even and odd EPROM arrays with data having even addresses stored in the even array and data having odd addresses stored in the odd array. A control circuit receives an initial address from a memory system controller and then accesses all data from the even and odd arrays within a burst address space containing the initial address. A pair of out-of-phase counters generate even and odd addresses, respectively, for accessing the even and odd arrays. Each counter increments addresses sequentially until a burst address space boundary is reached, then the counters wrap around to a beginning of a burst address space to generate any remaining addresses within a burst address space. The burst mode control circuitry is capable of processing a variety of burst sequencing modes. The burst address space size and the burst sequencing mode are selectable. A particular embodiment for generating an aligned sequential burst address sequence is described.
摘要:
The burst mode memory architecture using interleaved memory arrays provides even and odd EPROM arrays with data having even addresses stored in the even array and data having odd addresses stored in the odd array. A control circuit receives an initial address from a memory system controller and then accesses all data from the even and odd arrays within a burst address space containing the initial address. A pair of out-of-phase counters generate even and odd addresses, respectively, for accessing the even and odd arrays. Each counter increments addresses sequentially until a burst address space boundary is reached, then the counters wrap around to a beginning of a burst address space to generate any remaining addresses within a burst address space. The burst mode control circuitry is capable of processing a variety of burst sequencing modes. The burst address space size and the burst sequencing mode are selectable. A particular embodiment for generating an aligned sequential burst address sequence is described.
摘要:
The present invention provides a circuit for supplying a verifying reference and measurement voltage for use in verifying the programming of a programmable cell. The present invention provides the verifying reference and measurement voltage through internal circuitry on the cell and eliminate any requirement for an externally provided reference voltage. The verifying voltage is provided by modifying the programming voltage. The programming voltage is stepped down or stepped up through the use of internal circuitry to provide the reference and measurement voltage.
摘要:
A fast, fieldless flash memory cell includes an erase node having a control gate and a floating gate, both formed of polycrystalline silicon, a program transistor sharing the floating gate and control gate with the erase node, and a read transistor sharing the floating gate and control gate with the erase node and program transistor. The inventive memory cell is suitable for use in fast Programmable Logic Devices (PLDs) in the sub 5 nS range (2-5 nS), and other logic and memory parts. The erase node includes a buried N+ drain region in a P-type substrate, a buried implant plate doped N-type adjacent the drain region in the substrate, a tunnel oxide disposed over at least a portion of the plate and the drain region, the tunnel oxide extending into and abutting a gate oxide region, and thence to a field oxide region in a relaxed fashion, a polycrystalline silicon floating gate disposed over the field oxide, gate oxide, and tunnel oxide regions, a sandwich of ONO on the floating gate, and a polycrystalline silicon control gate (poly 2) disposed on the ONO. Programming occurs through the programming transistor. Reading occurs through a read path including the read transistor. During programming, coupling is improved at the gate of the programming transistor by an erase node boosting technique. This technique involves applying a relatively "boosted" voltage level to the drain region of the erase node which reduces the backbias threshold effect of erase node capacitors. Similarly, during a read operation, a relatively "boosted" voltage is applied to the drain region of the erase node, which, by way of the buried implant plate, reduces the backbias threshold effect of the erase node capacitors wherein coupling at the control gate of the read transistor is improved.
摘要:
A fast, fieldless flash memory cell includes an erase node having a control gate and a floating gate, both formed of polycrystalline silicon, a program transistor sharing the floating gate and control gate with the erase node, and a read transistor sharing the floating gate and control gate with the erase node and program transistor. The inventive memory cell is suitable for use in fast Programmable Logic Devices (PLDs) in the sub 5 nS range (2-5 nS), and other logic and memory parts. The erase node includes a buried N+ drain region in a P-type substrate, a buried implant plate doped N-type adjacent the drain region in the substrate, a tunnel oxide disposed over at least a portion of the plate and the drain region, the tunnel oxide extending into and abutting a gate oxide region, and thence to a field oxide region in a relaxed fashion, a polycrystalline silicon floating gate disposed over the field oxide, gate oxide, and tunnel oxide regions, a sandwich of ONO on the floating gate, and a polycrystalline silicon control gate (poly 2) disposed on the ONO. Programming occurs through the programming transistor. Reading occurs through a read path including the read transistor. During programming, coupling is improved at the gate of the programming transistor by an erase node boosting technique. This technique involves applying a relatively "boosted" voltage level to the drain region of the erase node which reduces the backbias threshold effect of erase node capacitors. Similarly, during a read operation, a relatively "boosted" voltage is applied to the drain region of the erase node, which, by way of the buried implant plate, reduces the backbias threshold effect of the erase node capacitors wherein coupling at the control gate of the read transistor is improved.