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    Carrier module
    1.
    发明授权
    Carrier module 失效
    运营商模块

    公开(公告)号：US07061101B2

    公开(公告)日：2006-06-13

    申请号：US10797073

    申请日：2004-03-11

    申请人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

    发明人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

    IPC分类号： H01L29/74

    CPC分类号： G01R31/2893

    摘要： Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch to move, and a second elastic member for elastic supporting of the latch buttons on the carrier module body, thereby, when the semiconductor device is brought into contact with the test socket, and tested, holding the semiconductor device with a vacuum formed through the pass through hole in the carrier module body and the vacuum tube in a state the latch releases the semiconductor device.

    摘要翻译： 载体模块包括用于将半导体器件放置在其下侧上的载体模块体，其具有从半部装置所在的上部到下侧的通孔，载体模块主体上的壳体，安装在其中的辅助壳体 壳体的下部能够在上下方向上移动，通过安装在壳体内部的第一弹性构件与载体模块主体弹性接触，辅助壳体中的真空管与通孔连通 载体模块主体中的至少一个闩锁，载体模块主体的下部中的至少一对闩锁，用于在外侧或内侧上分开或关闭，用于保持或释放位于载体模块主体上的半导体器件，闩锁 按钮装配在载体模块主体的上部，以便能够在上/下方向上移动，并且通过一个连接销连接到闩锁上，该连接销通过一个外部的forc在上/下方向上移动 e，使闩锁移动;以及第二弹性构件，用于弹性地支撑载体模块主体上的闩锁按钮，由此当半导体器件与测试插座接触并进行测试时，将半导体器件保持在 在闩锁释放半导体器件的状态下通过载体模块体中的通孔形成的真空和真空管。

    Carrier module for semiconductor device test handler
    2.
    发明授权
    Carrier module for semiconductor device test handler 失效
    半导体器件测试处理器的载体模块

    公开(公告)号：US06873169B1

    公开(公告)日：2005-03-29

    申请号：US10797072

    申请日：2004-03-11

    申请人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

    发明人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

    IPC分类号： G01R1/04 ,  G01R31/02

    CPC分类号： G01R1/0433

    摘要： Carrier module for a semiconductor device test handler including a carrier module body, a device seating part in an underside part of the carrier module body, at least one pair of first latches at opposite sides of the device seating part arranged opposite to, and movable away from, or close to, each other, for holding, or releasing opposite side parts of the semiconductor device seated on the device seating part, at least one pair of second latches rotatably fitted on opposite sides of the first latch, for holding an underside part of the semiconductor device seated on the device seating part, and releasing the semiconductor device interlocked with a releasing action of the first latch, a latch button fitted in an upper part of the carrier module to move in up/down directions and coupled to one end of the first latch, for moving up and down to make the first latch to move, and a first elastic member, and a second elastic member for elastic supporting of the first latch, and the second latch, thereby securely holding, transferring, and bringing the semiconductor device into contact with the test socket, for testing.

    摘要翻译： 一种用于半导体器件测试处理器的载体模块，包括载体模块主体，载体模块主体的下侧部分中的装置安置部分，在装置座部分的相对侧的至少一对第一闩锁，其布置成相对并移动 从或彼此靠近，用于保持或释放位于设备安置部分上的半导体器件的相对侧部分，至少一对可旋转地安装在第一闩锁的相对侧上的第二闩锁，用于保持下侧部分 并且释放与第一闩锁的释放动作互锁的半导体装置，安装在载体模块的上部中的闩锁按钮，以在上/下方向上移动并耦合到一端 的第一闩锁，用于上下移动以使第一闩锁移动;以及第一弹性构件和用于弹性支撑第一闩锁的第二弹性构件，第二闩锁的第二弹性构件 从而牢固地保持，传送和使半导体器件与测试插座接触以进行测试。

    Device test handler and method for operating the same
    4.
    发明授权
    Device test handler and method for operating the same 失效

    公开(公告)号：US06518745B2

    公开(公告)日：2003-02-11

    申请号：US09805214

    申请日：2001-03-14

    申请人： Seong Bong Kim ,  Yang Hee Kim ,  Won Hee Jo ,  Byoung Dae Lee ,  Hyun Soo Oh

    发明人： Seong Bong Kim ,  Yang Hee Kim ,  Won Hee Jo ,  Byoung Dae Lee ,  Hyun Soo Oh

    IPC分类号： G01R3102

    CPC分类号： G01R31/01

    摘要： A device test handler and a method for operating the same provide a significant reduction of the picking up and placing time periods, and reduce possible damage to the devices being tested. Devices and methods embodying the invention facilitate room temperature and high temperature testing within one device test handler to maximize testing efficiency. A test handler embodying the invention may include a pre-heater for pre-heating the devices on a loading shuttle as the loading shuttle passes to a test chamber. An indexing device in a test chamber of the device is used for successively transferring the devices from a loading shuttle to the test socket, and tested devices from the test socket to an unloading shuttle. Heat supply means may be provided for supplying a high temperature heat to the test chamber when the devices are required to be tested in a hot state. An unloading part having a plurality of trays movably fitted on the base is used to transfer devices from an unloading shuttle to output trays based on the testing results.