公开(公告)号：US07408338B2

公开(公告)日：2008-08-05

申请号：US11713683

申请日：2007-03-05

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/28

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

摘要翻译： 公开了一种用于测试半导体器件的处理器，其能够简化在交换台中执行的处理，即，在测试托盘中加载/卸载半导体器件的过程，并且大大增加了同时可测试的半导体器件的数量。 处理机包括装载站，卸载站，测试盘，交换站，其包括水平移动单元，用于在工作场所水平移动所选择的一个测试托盘预定间距;测试站，其中至少一个测试 安装具有与半导体器件电连接的多个测试插座的板，测试台在将从交换台馈送到测试站的测试托盘之一连接半导体器件到测试站时进行测试 插座，用于在加载站和交换站之间以及交换站和卸载站之间分别传送半导体器件的设备传送单元和用于在更换站和测试站之间传送测试盘的托盘传送单元。

公开(公告)号：US07008804B2

公开(公告)日：2006-03-07

申请号：US10366576

申请日：2003-02-14

申请人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Byeng Gi Lee

发明人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Byeng Gi Lee

IPC分类号： H01L21/66 ,  H05K7/20 ,  G01R31/02

CPC分类号： G01R31/2874 ,  G01K15/00 ,  G01R1/44 ,  G01R31/2875

摘要： Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature. The method includes fitting at least one semiconductor device to at least one test socket and starting a test, measuring in real time a temperature of the semiconductor device using a temperature sensor, detecting a measured temperature change rate and comparing the measured temperature change rate to a preset value, spraying cooling fluid onto the semiconductor device by controlling a cooling fluid supplying apparatus if the measured value change rate is higher than a preset value, and stopping spray of the cooling fluid onto the semiconductor device by controlling the cooling fluid supplying apparatus if the measured value change rate is below the preset value, thereby optimizing a test environment and improving yield.

摘要翻译： 提供了用于补偿半导体器件处理器中的测试温度偏差的方法，其中补偿了在半导体器件在预设温度下的测试期间由半导体器件本身产生的热引起的半导体器件的测试温度偏差。 这允许半导体器件的测试在精确的温度下进行。 该方法包括将至少一个半导体器件装配到至少一个测试插座并开始测试，使用温度传感器实时测量半导体器件的温度，检测测量的温度变化率并将测得的温度变化率与 如果测量值变化率高于预设值，则通过控制冷却流体供应装置将冷却流体喷射到半导体器件上，并且通过控制冷却流体供应装置来停止将冷却流体喷射到半导体器件上，如果 测量值变化率低于预设值，从而优化了测试环境，提高了产量。

公开(公告)号：US06873169B1

公开(公告)日：2005-03-29

申请号：US10797072

申请日：2004-03-11

申请人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

发明人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

IPC分类号： G01R1/04 ,  G01R31/02

CPC分类号： G01R1/0433

摘要： Carrier module for a semiconductor device test handler including a carrier module body, a device seating part in an underside part of the carrier module body, at least one pair of first latches at opposite sides of the device seating part arranged opposite to, and movable away from, or close to, each other, for holding, or releasing opposite side parts of the semiconductor device seated on the device seating part, at least one pair of second latches rotatably fitted on opposite sides of the first latch, for holding an underside part of the semiconductor device seated on the device seating part, and releasing the semiconductor device interlocked with a releasing action of the first latch, a latch button fitted in an upper part of the carrier module to move in up/down directions and coupled to one end of the first latch, for moving up and down to make the first latch to move, and a first elastic member, and a second elastic member for elastic supporting of the first latch, and the second latch, thereby securely holding, transferring, and bringing the semiconductor device into contact with the test socket, for testing.

摘要翻译： 一种用于半导体器件测试处理器的载体模块，包括载体模块主体，载体模块主体的下侧部分中的装置安置部分，在装置座部分的相对侧的至少一对第一闩锁，其布置成相对并移动 从或彼此靠近，用于保持或释放位于设备安置部分上的半导体器件的相对侧部分，至少一对可旋转地安装在第一闩锁的相对侧上的第二闩锁，用于保持下侧部分 并且释放与第一闩锁的释放动作互锁的半导体装置，安装在载体模块的上部中的闩锁按钮，以在上/下方向上移动并耦合到一端 的第一闩锁，用于上下移动以使第一闩锁移动;以及第一弹性构件和用于弹性支撑第一闩锁的第二弹性构件，第二闩锁的第二弹性构件 从而牢固地保持，传送和使半导体器件与测试插座接触以进行测试。

公开(公告)号：US06861861B2

公开(公告)日：2005-03-01

申请号：US10366368

申请日：2003-02-14

申请人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Eui Sung Hwang ,  Woo Young Lim ,  Jae Bong Seo ,  Eung Yong Lee ,  Byeng Gi Lee

发明人： Jae Myeong Song ,  Chul Ho Ham ,  Chan Ho Park ,  Eui Sung Hwang ,  Woo Young Lim ,  Jae Bong Seo ,  Eung Yong Lee ,  Byeng Gi Lee

IPC分类号： G01R31/26 ,  G01R1/44 ,  G01R31/28 ,  G01R31/02

CPC分类号： G01R31/2877 ,  G01R31/2862 ,  G01R31/2867

摘要： A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range. The semiconductor device handler includes at least one enclosed chamber, a heating/cooling apparatus configured to bring an inside of the at least one chamber to a low or high temperature state, a pushing unit provided within the at least one chamber and configured to push a plurality of semiconductor devices mounted on a test tray into test sockets of a test board located within the at least one chamber for testing, a cooling fluid supplying apparatus configured to supply cooling fluid, a nozzle assembly configured to spray cooling fluid received from the cooling fluid supplying apparatus onto the semiconductor devices fitted to the test sockets, and a control unit configured to control spraying of cooling fluid onto the semiconductor devices during testing to compensate for temperature changes of the semiconductor devices that occur during testing.

摘要翻译： 提供一种半导体器件处理器，其中补偿由半导体器件本身在测试期间产生的热引起的半导体器件的测试温度偏差，允许半导体器件的测试在精确温度或内部进行 精确的温度范围。 所述半导体器件处理器包括至少一个封闭室，被配置为使所述至少一个室的内部达到低温或高温状态的加热/冷却装置;设置在所述至少一个室内的推动单元， 将安装在测试托盘上的多个半导体器件安装在位于至少一个室内的用于测试的测试板的测试插座中;冷却流体供应装置，其构造成供应冷却流体;喷嘴组件，其构造成喷射从冷却流体接收的冷却流体 将供应装置供应到装配到测试插座的半导体器件上;以及控制单元，被配置为在测试期间控制将冷却流体喷射到半导体器件上，以补偿在测试期间发生的半导体器件的温度变化。

公开(公告)号：US07429868B2

公开(公告)日：2008-09-30

申请号：US11196238

申请日：2005-08-04

申请人： Chan Ho Park ,  Chul Ho Ham ,  Young Geun Park ,  Ho Keun Song ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chan Ho Park ,  Chul Ho Ham ,  Young Geun Park ,  Ho Keun Song ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/26

CPC分类号： G01R1/0433

摘要： A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

摘要翻译： 用于测试半导体器件的插座组件包括电连接到外部测试装置的插座板和覆盖插座板的插座引导件。 插座引导件具有开放部分以接收半导体器件，并允许半导体器件上的引脚与插座板上的连接引脚耦合。 间隔件可以插入在插座板和插座引导件之间，以保持半导体器件和插座板之间的预定距离。 以这种方式，即使当半导体器件具有不同的厚度时，也可以将每个半导体器件的球或引线按压到插座的连接销上至预定的深度。

公开(公告)号：US07253653B2

公开(公告)日：2007-08-07

申请号：US11235248

申请日：2005-09-27

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Jae Bong Seo

IPC分类号： G01R31/26

CPC分类号： G01R1/04 ,  G01R31/2893

摘要： A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability. The test tray includes a frame, pockets mounted to the frame while being uniformly spaced apart from one another, each of the pockets including a seat on which a semiconductor device is to be seated, latches mounted to the frame to be arranged in pairs for respective pockets such that the latches of each latch pair face each other at opposite sides of an associated one of the pockets, respectively, each of the latches being movable between a first position where the latch holds a semiconductor device seated in the seat of the associated pocket and a second position where the latch releases the held state of the semiconductor device, and latch operating members each mounted to the frame, and adapted to move an associated one of the latches between the first position and the second position, each of the latch operating members being separate from the associated latch.

摘要翻译： 公开了一种用于测试半导体器件的处理器的测试盘，其能够降低更换载体模块所需的成本和时间，并且实现可加工性的提高。 测试托盘包括框架，在彼此均匀间隔地安装到框架上的袋子，每个凹穴包括座，半导体装置将要安置在其上，安装到框架的闩锁成对布置成相应的 每个闩锁组的闩锁分别在相关联的一个凹穴的相对侧彼此面对，每个闩锁可在第一位置和第二位置之间移动，该第一位置之间闩锁保持坐在相关联的口袋的座中的半导体器件 以及第二位置，其中所述闩锁释放所述半导体器件的保持状态，以及锁定每个安装到所述框架的操作构件，并且适于在所述第一位置和所述第二位置之间移动相关联的一个闩锁，所述闩锁操作 构件与相关联的闩锁分离。

公开(公告)号：US07196508B2

公开(公告)日：2007-03-27

申请号：US11196266

申请日：2005-08-04

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

摘要翻译： 公开了一种用于测试半导体器件的处理器，其能够简化在交换台中执行的处理，即，在测试托盘中加载/卸载半导体器件的过程，并且大大增加了同时可测试的半导体器件的数量。 处理机包括装载站，卸载站，测试盘，交换站，其包括水平移动单元，用于在工作场所水平移动所选择的一个测试托盘预定间距;测试站，其中至少一个测试 安装具有与半导体器件电连接的多个测试插座的板，测试台在将从交换台馈送到测试站的测试托盘之一连接半导体器件到测试站时进行测试 插座，用于在加载站和交换站之间以及交换站和卸载站之间分别传送半导体器件的设备传送单元和用于在更换站和测试站之间传送测试盘的托盘传送单元。

公开(公告)号：US07061101B2

公开(公告)日：2006-06-13

申请号：US10797073

申请日：2004-03-11

申请人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

发明人： Chul Ho Ham ,  Byoung Dae Lee ,  Ho Keun Song ,  Young Geun Park

IPC分类号： H01L29/74

CPC分类号： G01R31/2893

摘要： Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch to move, and a second elastic member for elastic supporting of the latch buttons on the carrier module body, thereby, when the semiconductor device is brought into contact with the test socket, and tested, holding the semiconductor device with a vacuum formed through the pass through hole in the carrier module body and the vacuum tube in a state the latch releases the semiconductor device.

摘要翻译： 载体模块包括用于将半导体器件放置在其下侧上的载体模块体，其具有从半部装置所在的上部到下侧的通孔，载体模块主体上的壳体，安装在其中的辅助壳体 壳体的下部能够在上下方向上移动，通过安装在壳体内部的第一弹性构件与载体模块主体弹性接触，辅助壳体中的真空管与通孔连通 载体模块主体中的至少一个闩锁，载体模块主体的下部中的至少一对闩锁，用于在外侧或内侧上分开或关闭，用于保持或释放位于载体模块主体上的半导体器件，闩锁 按钮装配在载体模块主体的上部，以便能够在上/下方向上移动，并且通过一个连接销连接到闩锁上，该连接销通过一个外部的forc在上/下方向上移动 e，使闩锁移动;以及第二弹性构件，用于弹性地支撑载体模块主体上的闩锁按钮，由此当半导体器件与测试插座接触并进行测试时，将半导体器件保持在 在闩锁释放半导体器件的状态下通过载体模块体中的通孔形成的真空和真空管。

公开(公告)号：US07135703B2

公开(公告)日：2006-11-14

申请号：US10366618

申请日：2003-02-14

申请人： Chul Ho Ham ,  Chan Ho Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Chan Ho Park ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： B65D73/02

CPC分类号： G01R31/2867 ,  G01R31/2877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

摘要翻译： 一种用于半导体器件处理器的载体模块，其中用于冷却流体流动的沟槽形成在用于半导体器件的载体模块的安置表面中。 凹槽通过将从测试温度偏差补偿系统喷射的冷却流体强制到载体模块上以在半导体器件的基本上整个表面上扩散并且在放电之前保持在载体模块中一段时间​​来提高冷却效率。

公开(公告)号：US20060214655A1

公开(公告)日：2006-09-28

申请号：US11196266

申请日：2005-08-04

申请人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

发明人： Chul Ho Ham ,  Ho Keun Song ,  Young Geun Park ,  Woo Young Lim ,  Jae Bong Seo

IPC分类号： G01R31/28

CPC分类号： G01R31/2893 ,  G01R31/2867

摘要： A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

摘要翻译： 公开了一种用于测试半导体器件的处理器，其能够简化在交换台中执行的处理，即，在测试托盘中加载/卸载半导体器件的过程，并且大大增加了同时可测试的半导体器件的数量。 处理机包括装载站，卸载站，测试盘，交换站，其包括水平移动单元，用于在工作场所水平移动所选择的一个测试托盘预定间距;测试站，其中至少一个测试 安装具有与半导体器件电连接的多个测试插座的板，测试台在将从交换台馈送到测试站的测试托盘之一连接半导体器件到测试站时进行测试 插座，用于在加载站和交换站之间以及交换站和卸载站之间分别传送半导体器件的设备传送单元和用于在更换站和测试站之间传送测试盘的托盘传送单元。