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公开(公告)号：US08069908B2
公开(公告)日：2011-12-06
申请号：US11964899
申请日：2007-12-27
申请人： Chun-Chi Chen , Hong-Cheng Yang , He-Ping Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , He-Ping Liu
IPC分类号： F28F7/00 , F24H3/02 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a heat sink, a fan holder, and a fan secured on a front side of the fan holder. The heat sink includes a base having two first fixing ears at its two lateral sides, and fins on the base. An engaging notch is defined in a top end of four of the fins. The fan holder includes a top panel, and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has a pair of inserting protrusions at a bottom surface thereof. The two sidewalls have two fixing flanges at lower ends thereof. The top panel is partially placed on the front portion of the top ends of the fins, and the inserting protrusions are inserted into the engaging notches of the fins. The two sidewalls abut against two lateral sides of the heat sink, and the two fixing flanges are disposed on the two first fixing ears.
摘要翻译： 示例性散热装置包括散热器，风扇支架和固定在风扇支架前侧的风扇。 散热器包括在其两个侧面具有两个第一固定耳的底座和底座上的翅片。 在四个翅片的顶端中限定了接合凹口。 风扇架包括顶板，以及从顶板的两个侧边缘向下延伸的两个侧壁。 顶板在其底面具有一对插入突起。 两个侧壁在其下端具有两个固定凸缘。 顶板部分地放置在翅片的顶端的前部，并且插入突起插入翅片的接合凹口中。 两个侧壁抵靠散热片的两个侧面，两个固定凸缘设置在两个第一固定耳上。
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公开(公告)号：US07869217B2
公开(公告)日：2011-01-11
申请号：US12202391
申请日：2008-09-01
申请人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
摘要翻译： 锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。 散热片在其中限定第二个孔。 锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分， 头部和脚部。 脚部包括抵靠印刷电路板的第二面的压曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。 当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。
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公开(公告)号：US08047271B2
公开(公告)日：2011-11-01
申请号：US11961357
申请日：2007-12-20
申请人： Chun-Chi Chen , Hong-Cheng Yang , He-Ping Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , He-Ping Liu
IPC分类号： F24H3/02 , H01L23/467
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a fan holder, and a fan secured on a front side of the fan holder. The heat sink includes a base and fins on the base. An engaging groove is defined in top ends of the fins. The fan holder includes a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has an inserting protrusion at a bottom surface thereof. The two sidewalls have two latching legs at lower ends thereof. The top panel is partially placed on a front portion of the top ends of the fins, and the inserting protrusion is inserted into the engaging groove of the fins. The two sidewalls abut against two lateral sides of the heat sink, and the two latching legs fasten to two lateral sides of the base of the heat sink.
摘要翻译： 散热装置包括散热器，风扇支架和固定在风扇支架前侧的风扇。 散热器包括底座和底座上的散热片。 接合槽限定在翅片的顶端。 风扇架包括顶板和从顶板的两个侧边缘向下延伸的两个侧壁。 顶板在其底面具有插入突起。 两个侧壁在其下端具有两个闩锁腿。 顶板部分地放置在翅片的顶端的前部，并且插入突起插入翅片的接合槽中。 两个侧壁抵靠散热片的两个侧面，并且两个闩锁腿固定在散热器底座的两个侧面。
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公开(公告)号：US08050038B2
公开(公告)日：2011-11-01
申请号：US12504681
申请日：2009-07-17
申请人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及 设置在热管上的夹子。 两个接合部分从导热板的顶面朝向彼此向上突出。 热管在两个接合部分之间延伸。 两个接合部分向下按压夹子的两个相对端，从而将热管固定到导热板的顶面。
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公开(公告)号：US07990713B2
公开(公告)日：2011-08-02
申请号：US12500615
申请日：2009-07-10
申请人： Xin-Lei Liu , Jin-Biao Liu , Hong-Cheng Yang , Chun-Chi Chen
发明人： Xin-Lei Liu , Jin-Biao Liu , Hong-Cheng Yang , Chun-Chi Chen
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，邻近翅片单元的离心风扇，附着在电子部件上的导热板，以及热连接 翅片单元和电子部件。 接合部从导热板的顶面向上突出。 热管具有延伸穿过接合部分并且固定到导热板的顶面的蒸发部分和连接到散热片单元的冷凝部分。
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公开(公告)号：US20100258276A1
公开(公告)日：2010-10-14
申请号：US12504681
申请日：2009-07-17
申请人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及 设置在热管上的夹子。 两个接合部分从导热板的顶面朝向彼此向上突出。 热管在两个接合部分之间延伸。 两个接合部分向下按压夹子的两个相对端，从而将热管固定到导热板的顶面。
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公开(公告)号：US07697297B2
公开(公告)日：2010-04-13
申请号：US11947091
申请日：2007-11-29
申请人： Chun-Chi Chen , Min Li , Hong-Cheng Yang
发明人： Chun-Chi Chen , Min Li , Hong-Cheng Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.
摘要翻译： 一种用于从安装在印刷电路板上的电子部件移除热量的散热装置，包括将散热器和将散热器安装到印刷电路板上的夹子。 散热器具有矩形基部和从基部向上延伸的多个翅片。 散热片限定了其中的接收通道，其倾斜于散热器的两个相对侧。 夹子包括放置在接收通道中的主体和从主体的两个相对端倾斜地相对延伸的两个闩锁腿。 两个锁定腿分别位于散热器的两个相对侧的前面和后面，并且与其平行。
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公开(公告)号：US08059410B2
公开(公告)日：2011-11-15
申请号：US12504682
申请日：2009-07-17
申请人： Chun-Chi Chen , Hong-Cheng Yang , Cheng Kong , Wei-Cheng Nie
发明人： Chun-Chi Chen , Hong-Cheng Yang , Cheng Kong , Wei-Cheng Nie
CPC分类号： H01L23/467 , F28D15/0233 , F28D15/0266 , H01L23/4093 , H01L23/427 , H01L2924/0002 , Y10S292/16 , Y10T24/44538 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.
摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及 设置在热管上的夹子。 一对接合部从导热板的顶面朝向彼此突出。 夹子将热管固定到导热板的顶面。 夹子包括枢转地固定到导热板的枢转部分，可拆卸地与接合部分接合的夹紧部分，以及将枢转部分和夹紧部分相互连接并与导热管抵接导热的主体 板。
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公开(公告)号：US20100258277A1
公开(公告)日：2010-10-14
申请号：US12504682
申请日：2009-07-17
申请人： Chun-Chi Chen , Hong-Cheng Yang , Cheng Kong , Wei-Cheng Nie
发明人： Chun-Chi Chen , Hong-Cheng Yang , Cheng Kong , Wei-Cheng Nie
CPC分类号： H01L23/467 , F28D15/0233 , F28D15/0266 , H01L23/4093 , H01L23/427 , H01L2924/0002 , Y10S292/16 , Y10T24/44538 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.
摘要翻译： 一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及 设置在热管上的夹子。 一对接合部从导热板的顶面朝向彼此突出。 夹子将热管固定到导热板的顶面。 夹子包括枢转地固定到导热板的枢转部分，可拆卸地与接合部分接合的夹紧部分，以及将枢转部分和夹紧部分相互连接并与导热管抵接导热的主体 板。
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公开(公告)号：US07613001B1
公开(公告)日：2009-11-03
申请号：US12118757
申请日：2008-05-12
申请人： Jin-Biao Liu , Hong-Cheng Yang , Chun-Chi Chen
发明人： Jin-Biao Liu , Hong-Cheng Yang , Chun-Chi Chen
CPC分类号： H05K7/20336
摘要： A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
摘要翻译： 散热装置用于从计算机外壳中的至少两个相邻的第一和第二电子装置移除热量。 散热装置包括安装在第一电子装置上的第一散热器和安装在第二电子装置上的第二散热器。 第一散热器包括底座，安装在基座上的第一翅片单元和从底座向外延伸的两根热管。 第二和第三鳍单元分别与两根热管接合。 第一，第二和第三鳍单元分别位于计算机机箱的第一，第二和第三开口附近。 第二散热器位于第一散热器的第一，第二和第三散热片之间。
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