公开(公告)号：US06418393B1

公开(公告)日：2002-07-09

申请号：US09221648

申请日：1998-12-28

申请人： Chun-Hsin Lu ,  Pao-Lung Lin ,  Nien-Tien Cheng

发明人： Chun-Hsin Lu ,  Pao-Lung Lin ,  Nien-Tien Cheng

IPC分类号： G01K100

CPC分类号： G01M99/002

摘要： An inspecting device for a thermal module for cooling a CPU of a computer to decide whether the module can work properly is disclosed. The device includes a computer stored with preset data. A measuring unit has a heater generating heat with a predetermined temperature. A converter electrically connects the heater with the computer and converts an analogous signal corresponding to the temperature of the heater to a digital signal which is sent to the computer. A force generating mechanism is provided on the measuring unit which can generate a pressing force toward the heater. When the heater is contact with a heat-generating component contact part of the thermal module and the force generating mechanism is activated to press the part against the heater, the computer compares the data stored therein and the signal received from the converter to determine whether the thermal module can attain its required performance.

摘要翻译： 公开了一种用于冷却计算机的CPU以确定模块是否能正常工作的热模块的检查装置。 该设备包括存储有预设数据的计算机。 测量单元具有产生具有预定温度的热量的加热器。 A转换器将加热器与计算机电连接并将对应于加热器的温度的类似信号转换为发送到计算机的数字信号。 力产生机构设置在测量单元上，该力可以产生朝向加热器的按压力。 当加热器与热模块的发热部件接触部分接触并且力产生机构被激活以将部件压靠在加热器上时，计算机将存储在其中的数据和从转换器接收的信号进行比较，以确定是否 热模块可以达到要求的性能。

公开(公告)号：USD419979S

公开(公告)日：2000-02-01

申请号：US98376

申请日：1998-12-28

申请人： Chun-Hsin Lu ,  Pao-Lung Lin ,  Nien-Tien Cheng

设计人： Chun-Hsin Lu ,  Pao-Lung Lin ,  Nien-Tien Cheng

公开(公告)号：US06233150B1

公开(公告)日：2001-05-15

申请号：US09427144

申请日：1999-10-25

申请人： Pao-Lung Lin ,  Nien-Tien Cheng ,  Eric Liu

发明人： Pao-Lung Lin ,  Nien-Tien Cheng ,  Eric Liu

IPC分类号： H05K720

CPC分类号： H05K9/0039

摘要： A memory module assembly comprises a memory card having a circuit board and a number of electronic components mounted on the circuit board, a pair of shells attached on opposite surfaces of the circuit board and a pair of clips securing the card and the shells together. The circuit board forms a grounding pad around three edges thereof. Correspondingly, each shell has an electrically conductive area contacting the grounding pad of the circuit board for preventing electromagnetic interference. The circuit board forms a number of openings, and each shell have a number of projections and apertures corresponding to the openings of the circuit board. The shells are positioned on the card with the projections of one shell received in the openings of the circuit board and apertures of the other shell. The clips secure the card and the shells together.

摘要翻译： 存储器模块组件包括存储卡，该存储卡具有安装在电路板上的电路板和多个电子部件，附接在电路板的相对表面上的一对壳体和将卡和壳固定在一起的一对夹子。 电路板在其三个边缘周围形成接地垫。 相应地，每个壳体具有接触电路板的接地焊盘的导电区域，以防止电磁干扰。 电路板形成多个开口，并且每个壳体具有与电路板的开口对应的多个突起和孔。 壳体定位在卡上，其中一个壳体的突起容纳在电路板的开口和另一个壳体的孔中。 夹子将卡片和贝壳固定在一起。

公开(公告)号：US06343020B1

公开(公告)日：2002-01-29

申请号：US09356481

申请日：1999-07-19

申请人： Pao-Lung Lin ,  Nien-Tien Cheng ,  Heng-Chih Liu

发明人： Pao-Lung Lin ,  Nien-Tien Cheng ,  Heng-Chih Liu

IPC分类号： H05K900

CPC分类号： G11C5/005 ,  G11C5/04

摘要： A memory module includes a circuit board on which memory chips are mounted and a metal casing attached to the circuit board for shielding the memory chips. Conductive traces are formed on the circuit board for electrically engaging corresponding portions of the casing to ground the casing. The casing forms a raised portion defining a space for accommodating the memory chips. A recess is formed on the raised portion and a bottom surface of the recess contacts the memory chips to conduct and remove heat from the memory chips. Ventilation holes are defined in the raised portion for facilitating heat removal. The casing forms two positioning pins inserted into corresponding positioning holes defined in the circuit board for properly positioning the casing with respect to the circuit board. The casing also forms two latching arms engaging with corresponding latching holes defined in the circuit board for securing the casing to the circuit board.

摘要翻译： 存储器模块包括其上安装有存储器芯片的电路板和附接到电路板的用于屏蔽存储器芯片的金属外壳。 导电迹线形成在电路板上，用于电耦合壳体的相应部分以使壳体接地。 壳体形成限定用于容纳存储器芯片的空间的凸起部分。 凹部形成在凸起部分上，并且凹部的底表面与存储芯片接触，以便从存储器芯片导入和去除热量。 通风孔被限定在凸起部分中以便于除热。 壳体形成插入到电路板中限定的相应定位孔中的两个定位销，用于使壳体相对于电路板正确定位。 壳体还形成与电路板中限定的相应的锁定孔接合的两个锁定臂，用于将壳体固定到电路板。

公开(公告)号：US07381346B2

公开(公告)日：2008-06-03

申请号：US11521918

申请日：2006-09-15

申请人： Ching-Tai Cheng ,  Nien-Tien Cheng

发明人： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC分类号： C09K5/08 ,  H05K7/20 ,  F28F7/00

CPC分类号： H01L23/42 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.

摘要翻译： 热界面材料用于施加到接触表面以消除散热装置和电子部件之间的空气间隙，以便改善电子部件的散热。 热界面材料包括作为基础油的季戊四醇油酸酯和填充在油酸季戊四醇酯中的填料，用于改善热界面材料的导热性。 油酸季戊四醇用于保持其中的填料并填充空气间隙以实现散热装置和电子部件之间的紧密接触。 填料包括铝粉，氧化锌粉和氧化锌纳米颗粒。

公开(公告)号：US08622117B2

公开(公告)日：2014-01-07

申请号：US12491246

申请日：2009-06-25

申请人： Sheng-Lin Wu ,  Yu-Liang Lo ,  Wen-Hu Chen ,  Yue Liu ,  Nien-Tien Cheng

发明人： Sheng-Lin Wu ,  Yu-Liang Lo ,  Wen-Hu Chen ,  Yue Liu ,  Nien-Tien Cheng

IPC分类号： F28D15/00

CPC分类号： B21D53/02 ,  B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/046

摘要： A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.

摘要翻译： 热管包括壳体，容纳在壳体中的主芯结构，容纳在主芯结构中的辅助芯结构以及容纳在壳体中的工作流体。 主芯结构附接到壳体的内表面。 主芯结构的内周表面和辅助芯结构的外周表面协同地限定蒸气通道。 辅助油绳结构是中空的，并且沿壳体的纵向方向延伸。 在辅助油绳结构中限定了液体通道。 辅助油绳结构的两端都固定在壳体的两端。 工作油在主油芯结构和辅助油绳结构中饱和。

公开(公告)号：US08578605B2

公开(公告)日：2013-11-12

申请号：US13487274

申请日：2012-06-04

申请人： Ming-Tang Zhang ,  Wei-Hsiang Chang ,  Nien-Tien Cheng

发明人： Ming-Tang Zhang ,  Wei-Hsiang Chang ,  Nien-Tien Cheng

IPC分类号： B21D53/02

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20318 ,  Y10T29/4935 ,  H01L2924/00

摘要： An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

摘要翻译： 制造散热装置的一个典型的方法包括：首先，提供一种包括具有平坦外表面的冷凝器部分的热管，以及提供包括限定引导线的支撑表面的散热器。 引导线的宽度小于冷凝器部分的外表面的宽度。 接下来，沿着引导线在支撑表面上扩展焊料量，以在支撑表面上形成焊料层。 焊料层的尺寸不大于冷凝器部分的外表面的尺寸。 然后将热管的冷凝器部分的外表面附着在散热片的支撑表面上的焊料层上。

公开(公告)号：US07869215B2

公开(公告)日：2011-01-11

申请号：US12506214

申请日：2009-07-20

申请人： Jui-Wen Hung ,  Nien-Tien Cheng ,  Ping-Yang Chuang

发明人： Jui-Wen Hung ,  Nien-Tien Cheng ,  Ping-Yang Chuang

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： G06F1/203

摘要： An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

摘要翻译： 电子设备包括壳体，容纳在壳体中的电子部件和固定部件。 壳体包括限定在其侧壁中的切口，用于将散热构件组装或拆卸到电子设备中或从电子设备排出。 固定构件连接到壳体的顶壁。 固定构件包括细长杆，连接到细长杆的外端并邻近切口定位的引导杆，以及位于细长杆的内端处并位于电子部件上方的弹性元件。 当散热构件组装到电子设备中以与电子部件接触时，弹性元件被压缩并邻接散热构件。

公开(公告)号：US07541403B2

公开(公告)日：2009-06-02

申请号：US11309611

申请日：2006-08-31

申请人： Ching-Tai Cheng ,  Nien-Tien Cheng

发明人： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC分类号： C08K3/22

CPC分类号： C08L83/08 ,  C08K3/10 ,  C08K3/22 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2982 ,  Y10T428/31663 ,  C08L83/00

摘要： A thermal interface material includes 100 parts by weight of base oil including amino-modified silicone fluid and at least one of methylphenylsilicone fluid and fluorosilicone fluid, and 800 to 1200 parts by weight of fillers filled in the base oil. The fillers have an average particle size of 0.1 to 5 um and are selected from the group consisting of zinc oxide powder, alumina powder and metallic aluminum powder.

摘要翻译： 热界面材料包括100重量份的基础油，包括氨基改性的硅氧烷流体和甲基苯基硅酮流体和氟硅酮流体中的至少一种，以及填充在基础油中的800至1200重量份的填料。 填料的平均粒径为0.1-5μm，选自氧化锌粉末，氧化铝粉末和金属铝粉末。

公开(公告)号：US07537049B2

公开(公告)日：2009-05-26

申请号：US11309817

申请日：2006-10-03

申请人： Nien-Tien Cheng ,  Chen-Shen Lin

发明人： Nien-Tien Cheng ,  Chen-Shen Lin

IPC分类号： F28D15/02 ,  F28F7/02 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation apparatus (10) includes a computer enclosure (110) made of thermally conductive material, a fin assembly (140) secured to the computer enclosure, and a heat pipe (130) having an evaporating section (131) thermally connecting with a heat generating electronic component and a condensing section (132) thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members (111) clamping the fin assembly therebetween.

摘要翻译： 散热装置（10）包括由导热材料制成的计算机外壳（110），固定到计算机外壳的翅片组件（140），以及具有与 发热电子部件和与散热片组件热连接的冷凝部分（132）。 翅片组件具有与外壳的底盘接触的底面，从而将热量从翅片组件传递到底盘以便耗散。 外壳形成一对夹紧翅片组件的夹紧件（111）。