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    LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE
    1.
    发明申请
    LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE 有权
    发光二极管封装，照明装置和发光二极管封装基板

    公开(公告)号：US20110248289A1

    公开(公告)日：2011-10-13

    申请号：US13078933

    申请日：2011-04-02

    申请人： Chung-Chuan Hsieh ,  Yi-Chun Chen ,  Yi-Ting Chiu

    发明人： Chung-Chuan Hsieh ,  Yi-Chun Chen ,  Yi-Ting Chiu

    IPC分类号： H01L33/08 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.

    摘要翻译： 发光二极管（LED）封装包括LED封装基板，第一LED芯片和第二LED芯片。 LED封装衬底包括衬底，第一焊盘，第二接合焊盘和第三接合焊盘。 第一，第二和第三接合焊盘设置在基板上。 第二接合焊盘被布置成阵列。 第一和第三接合焊盘分别位于阵列的第一列和最后一列。 第一LED芯片在第一焊盘上被芯片焊接并分别引线接合到布置在阵列的第一列中的第二焊盘。 第二LED芯片分别在第二焊盘上进行裸片焊接。 在除了最后一列之外的每行中，每个第二LED芯片被引线键合到布置在下一列中的第二焊盘。 位于最后一列的第二LED芯片被引线接合到第三焊盘。

    Light emitting diode package, lighting device and light emitting diode package substrate
    2.
    发明授权
    Light emitting diode package, lighting device and light emitting diode package substrate 有权
    发光二极管封装，照明器件和发光二极管封装衬底

    公开(公告)号：US08492777B2

    公开(公告)日：2013-07-23

    申请号：US13078933

    申请日：2011-04-02

    申请人： Chung-Chuan Hsieh ,  Yi-Chun Chen ,  Yi-Ting Chiu

    发明人： Chung-Chuan Hsieh ,  Yi-Chun Chen ,  Yi-Ting Chiu

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.

    摘要翻译： 发光二极管（LED）封装包括LED封装基板，第一LED芯片和第二LED芯片。 LED封装衬底包括衬底，第一焊盘，第二接合焊盘和第三接合焊盘。 第一，第二和第三接合焊盘设置在基板上。 第二接合焊盘被布置成阵列。 第一和第三接合焊盘分别位于阵列的第一列和最后一列。 第一LED芯片在第一焊盘上被芯片焊接并分别引线接合到布置在阵列的第一列中的第二焊盘。 第二LED芯片分别在第二焊盘上进行裸片焊接。 在除了最后一列之外的每行中，每个第二LED芯片被引线键合到布置在下一列中的第二焊盘。 位于最后一列的第二LED芯片被引线接合到第三焊盘。

    Method of fabricating a light emitting diode chip having phosphor coating layer
    6.
    发明授权
    Method of fabricating a light emitting diode chip having phosphor coating layer 有权
    制造具有荧光体涂层的发光二极管芯片的方法

    公开(公告)号：US08030105B1

    公开(公告)日：2011-10-04

    申请号：US12729721

    申请日：2010-03-23

    申请人： Chung-Chuan Hsieh

    发明人： Chung-Chuan Hsieh

    IPC分类号： H01L21/00

    CPC分类号： H01L33/508 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： A method of fabricating light emitting diode chips having a phosphor coating layer comprises providing a substrate having a plurality of light emitting diodes formed thereon; forming a conductive bump on at least one of the plurality of light emitting diodes; forming a phosphor coating layer over the substrate and the light emitting diodes; cutting the phosphor coating layer by a point cutter to remove an upper portion of the phosphor coating layer, so as to reduce a thickness of the phosphor coating layer and expose the conductive bump; and forming a plurality of individual light emitting diode chips having the phosphor coating layer by separating the plurality of light emitting diodes.

    摘要翻译： 一种制造具有荧光体涂层的发光二极管芯片的方法包括：提供其上形成有多个发光二极管的基板; 在所述多个发光二极管中的至少一个上形成导电凸块; 在衬底和发光二极管上形成磷光体涂层; 通过点切割器切割荧光体涂层以去除荧光体涂层的上部，从而减小荧光体涂层的厚度并暴露导电凸块; 以及通过分离所述多个发光二极管来形成具有所述荧光体涂层的多个单独的发光二极管芯片。

    METHOD OF FABRICATING A LIGHT EMITTING DIODE CHIP HAVING PHOSPHOR COATING LAYER
    7.
    发明申请
    METHOD OF FABRICATING A LIGHT EMITTING DIODE CHIP HAVING PHOSPHOR COATING LAYER 有权
    制造具有磷光涂层的发光二极管芯片的方法

    公开(公告)号：US20110229993A1

    公开(公告)日：2011-09-22

    申请号：US12729721

    申请日：2010-03-23

    申请人： Chung-Chuan Hsieh

    发明人： Chung-Chuan Hsieh

    IPC分类号： H01L33/00 ,  H01L21/78

    CPC分类号： H01L33/508 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： A method of fabricating light emitting diode chips having a phosphor coating layer comprises providing a substrate having a plurality of light emitting diodes formed thereon; forming a conductive bump on at least one of the plurality of light emitting diodes; forming a phosphor coating layer over the substrate and the light emitting diodes; cutting the phosphor coating layer by a point cutter to remove an upper portion of the phosphor coating layer, so as to reduce a thickness of the phosphor coating layer and expose the conductive bump; and forming a plurality of individual light emitting diode chips having the phosphor coating layer by separating the plurality of light emitting diodes.

    摘要翻译： 一种制造具有荧光体涂层的发光二极管芯片的方法包括：提供其上形成有多个发光二极管的基板; 在所述多个发光二极管中的至少一个上形成导电凸块; 在衬底和发光二极管上形成磷光体涂层; 通过点切割器切割荧光体涂层以去除荧光体涂层的上部，从而减小荧光体涂层的厚度并暴露导电凸块; 以及通过分离所述多个发光二极管来形成具有所述荧光体涂层的多个单独的发光二极管芯片。