公开(公告)号：US20240248331A1

公开(公告)日：2024-07-25

申请号：US18296676

申请日：2023-04-06

Applicant: CIENA CORPORATION

Inventor： Maxime Jacques ,  Gregory Brookes ,  Michael Vitic ,  Alexandre Simard ,  Douglas McGhan ,  Ying Gao

IPC: G02F1/03 ,  G02F1/035

CPC classification number: G02F1/0311 ,  G02F1/0316 ,  G02F1/0327 ,  G02F1/035

Abstract: Disclosed are differential-drive electro-optic modulator structures for linear electro-optic (Pockels) platforms such as thin-film LiNbO3 (TFLN), directly compatible with traditional differential-output analog drivers, such as a linear electro-optic modulator, including: a first signal trace; a second signal trace, wherein the first signal trace and the second signal trace are driven by a differential signal; a first optical arm; and a second optical arm, wherein a geometry of the first signal trace and the second signal trace causes the differential signal to modulate optical signals in the first optical arm and the second optical arm, such that when the optical signals are combined to create a resultant optical signal, the geometry mitigates chirp in the resultant optical signal. Other embodiments are disclosed.

公开(公告)号：US20240431022A1

公开(公告)日：2024-12-26

申请号：US18337572

申请日：2023-06-20

Applicant: CIENA CORPORATION

Inventor： Maxime Jacques ,  Michael Vitic ,  Jean-Frédéric Gagné ,  Simon Paradis

IPC: H05K1/02

Abstract: Aspects of the subject disclosure may include, for example, a flexible printed circuit (FPC) for interconnecting an optical device and an application specific integrated circuit (ASIC), wherein the FPC includes a first section that is configured with a first plurality of electrically conductive traces and a second section over which one or more components are disposed, and wherein the second section is configured with a second plurality of electrically conductive traces that extend from the first plurality of electrically conductive traces to the one or more components. Other embodiments are disclosed.

公开(公告)号：US20240297105A1

公开(公告)日：2024-09-05

申请号：US18177805

申请日：2023-03-03

Applicant: CIENA CORPORATION

Inventor： Michael Vitic ,  Maxime Jacques ,  Raphaël Beaupré-Laflamme

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/48 ,  H01L25/00 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L24/32 ,  H01L2224/13025 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49113 ,  H01L2224/49176 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/1426

Abstract: Aspects of the subject disclosure may include, for example, system, comprising a substrate having an interconnect in or on a surface of the substrate, a riser disposed over the surface, the riser being configured with one or more through riser vias for coupling to the interconnect, a device positioned over the surface, the device having one or more conductive contacts residing in a plane of the device, and one or more wire bonds coupling the one or more through riser vias with the one or more conductive contacts thereby enabling connectivity of the interconnect to be raised toward or to the plane of the device such that at least one of the one or more wire bonds has a limited physical length. Other embodiments are disclosed.

公开(公告)号：US12001116B2

公开(公告)日：2024-06-04

申请号：US17352538

申请日：2021-06-21

Applicant: Ciena Corporation

Inventor： Maxime Jacques ,  Jean-Frédéric Gagné ,  Michael Vitic

IPC: G02F1/225

CPC classification number: G02F1/2255 ,  G02F2201/127

Abstract: An optical waveguide structure forms an MZI in proximity to an electro-optic material. A first (second) electrical input port is configured to receive a first (second) drive signal. The second drive signal has a negative amplitude relative to the first drive signal. A first (second) transmission line is configured to propagate a first (second) electromagnetic wave over at least a portion of a first (second) optical waveguide arm to apply an optical phase modulation. A drive signal interconnection structure is configured to provide a first electrical connection between the first electrical input port and an electrode shared by the transmission lines, and a second electrical connection between the second electrical input port and respective electrodes of the transmission lines; and is configured to preserve relative phase shifts between the drive signals. Input impedances at the first and second electrical input ports are substantially equal to each other.

公开(公告)号：US20230305356A1

公开(公告)日：2023-09-28

申请号：US18323018

申请日：2023-05-24

Applicant: Ciena Corporation

Inventor： Maxime Jacques ,  Gregory Brookes ,  Michael Vitic ,  Jean-Frédéric Gagné

IPC: G02F1/225 ,  G02F1/21 ,  G02F1/03

CPC classification number: G02F1/2257 ,  G02F1/212 ,  G02F1/0316

Abstract: A first (second) electrical input port receives a first (second) drive signal. A first (second) transmission line is configured to propagate a first (second) electromagnetic wave over at least a portion of a first (second) optical waveguide arm of an MZI to apply an optical phase modulation. A drive signal interconnection structure is configured to provide a first electrical connection between the first electrical input port and an inner electrode shared by the transmission lines, and a second electrical connection between the second electrical input port and respective outer electrodes of the transmission lines; and is configured to preserve relative phase shifts between the drive signals. An impedance associated with a first electric field distribution between the inner electrode and a first of the outer electrodes is substantially equal to an impedance associated with a second electric field distribution between the inner electrode and a second of the outer electrodes.

公开(公告)号：US20220404680A1

公开(公告)日：2022-12-22

申请号：US17352538

申请日：2021-06-21

Applicant: Ciena Corporation

Inventor： Maxime Jacques ,  Jean-Frédéric Gagné ,  Michael Vitic

IPC: G02F1/225 ,  G02F1/21

Abstract: An optical waveguide structure forms an MZI in proximity to an electro-optic material. A first (second) electrical input port is configured to receive a first (second) drive signal. The second drive signal has a negative amplitude relative to the first drive signal. A first (second) transmission line is configured to propagate a first (second) electromagnetic wave over at least a portion of a first (second) optical waveguide arm to apply an optical phase modulation. A drive signal interconnection structure is configured to provide a first electrical connection between the first electrical input port and an electrode shared by the transmission lines, and a second electrical connection between the second electrical input port and respective electrodes of the transmission lines; and is configured to preserve relative phase shifts between the drive signals. Input impedances at the first and second electrical input ports are substantially equal to each other.