CONNECTING MULTI-CONDUCTOR CABLES WITH SURFACE CONTACTS

    公开(公告)号:US20230010397A1

    公开(公告)日:2023-01-12

    申请号:US17644999

    申请日:2021-12-17

    IPC分类号: H01R12/72 H01R13/6594

    摘要: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.

    CONNECTING MULTI-CONDUCTOR CABLES WITH SURFACE CONTACTS

    公开(公告)号:US20230178915A1

    公开(公告)日:2023-06-08

    申请号:US18163125

    申请日:2023-02-01

    IPC分类号: H01R12/72 H01R13/6594

    CPC分类号: H01R12/721 H01R13/6594

    摘要: A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.

    INTEGRATED CIRCUIT INTERCONNECT TECHNIQUES

    公开(公告)号:US20230050002A1

    公开(公告)日:2023-02-16

    申请号:US17445054

    申请日:2021-08-13

    摘要: Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.