公开(公告)号：US09939580B2

公开(公告)日：2018-04-10

申请号：US15203571

申请日：2016-07-06

Applicant: Cisco Technology, Inc.

Inventor： Stefan Martin Pfnuer ,  Matthew Joseph Traverso ,  Vipulkumar Patel

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12002 ,  G02B6/423 ,  G02B6/4238 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/121 ,  G02B2006/12102 ,  G02B2006/12121

Abstract: Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member.

公开(公告)号：US10209464B2

公开(公告)日：2019-02-19

申请号：US14517477

申请日：2014-10-17

Applicant: Cisco Technology, Inc.

Inventor： Stefan Martin Pfnuer ,  Matthew Joseph Traverso ,  Bipin Dama

IPC: G02B6/42 ,  H05K1/18 ,  G02F1/01

Abstract: An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.

公开(公告)号：US09628185B2

公开(公告)日：2017-04-18

申请号：US14517414

申请日：2014-10-17

Applicant: Cisco Technology, Inc.

Inventor： Stefan Martin Pfnuer ,  Matthew Joseph Traverso

IPC: H04B10/50 ,  H01S5/022 ,  H04B10/516 ,  G02B6/42

CPC classification number: H04B10/503 ,  G02B6/4248 ,  G02B6/4281 ,  H01S5/02276 ,  H01S5/0228 ,  H04B10/516

Abstract: Described herein is an optical transmitter that includes an RF signal path that is, at least partially, parallel with an optical signal path. In one embodiment, an electrical transmission element, which defines the RF signal path, is disposed between a laser emitting the optical signal and a side wall of a package containing the optical transmitter. Although the RF and optical signals may propagate along different planes within the optical transmitter, both signals are received at an optical modulator. Using the RF signal, the optical modulator modulates the optical signal (e.g., a continuous wave) to generate a modulated optical signal. The optical modulator then outputs the modulated signal to a receptacle coupled to a light carrying medium such as a fiber optic cable.