公开(公告)号：US09138737B2

公开(公告)日：2015-09-22

申请号：US13818773

申请日：2011-05-03

申请人： Bingcai Pan ,  Zhenmao Jiang ,  Weiming Zhang ,  Lu Lv ,  Yingmei Xie ,  Quanxing Zhang

发明人： Bingcai Pan ,  Zhenmao Jiang ,  Weiming Zhang ,  Lu Lv ,  Yingmei Xie ,  Quanxing Zhang

IPC分类号： B01J37/30 ,  B01J35/00 ,  B01J37/16 ,  C23C18/12 ,  C23C18/16 ,  B01J31/08 ,  B01J45/00 ,  B01J41/14 ,  B01J47/00

CPC分类号： B01J37/30 ,  B01J31/08 ,  B01J35/004 ,  B01J37/16 ,  B01J41/14 ,  B01J45/00 ,  B01J47/016 ,  C23C18/1216 ,  C23C18/1233 ,  C23C18/1287 ,  C23C18/1644 ,  C23C18/1658 ,  C23C18/1666

摘要： A method for regulating the distribution of metallic nanoparticles within the resin support is provided. This method uses the ion exchange or absorption resin bearing basic functional groups as the support; firstly introducing the metal in the form of anionic complexes onto the resin support through the ion exchange process, then realizing the purpose of regulating the distribution of the metal and its compound within the resin support by means of changing the concentration of the reductive or deposition agent in water solution and the reaction time. The regulated distribution of metallic nanoparticles within the resin support is in the form of rings with different depths and densities. The different distribution patterns result in improvements upon properties of the inorganic-organic composite material, such as reaction activity, reaction selectivity and metallic stability, and has significant referential value for preparation and structural regulation of other inorganic-organic composite materials of the same kind.

摘要翻译： 提供了一种用于调节树脂载体内金属纳米粒子分布的方法。 该方法采用离子交换或吸附树脂作为载体的基础官能团; 首先通过离子交换法将阴离子配合物形式的金属引入到树脂载体上，然后通过改变还原或沉积剂的浓度来实现调节金属及其化合物在树脂载体内的分布的目的 在水溶液中和反应时间。 金属纳米粒子在树脂载体内的调节分布呈不同深度和密度的环形。 不同的分布模式导致无机 - 有机复合材料的性能的改善，如反应活性，反应选择性和金属稳定性，并且具有相同类型的其他无机 - 有机复合材料的制备和结构调节的重要参考价值。

公开(公告)号：US20040127025A1

公开(公告)日：2004-07-01

申请号：US10647430

申请日：2003-08-26

发明人： Percy Vandorn Crocker JR. ,  Linette Demers ,  Nabil A. Amro

IPC分类号： H01L021/44 ,  B05D005/12

CPC分类号： C23C18/06 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/08 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1658 ,  C23C18/1666 ,  C23C18/1667 ,  C23C18/1678 ,  G03F7/0002 ,  H01L21/288 ,  H01L21/76838 ,  H05K3/105 ,  H05K3/1241 ,  Y10S438/929

摘要： Nanolithographic deposition of metallic nanostructures using coated tips for use in microelectronics, catalysis, and diagnostics. AFM tips can be coated with metallic precursors and the precursors patterned on substrates. The patterned precursors can be converted to the metallic state with application of heat. High resolution and excellent alignment can be achieved.

摘要翻译： 使用涂覆尖端的金属纳米结构的纳米光刻沉积用于微电子学，催化和诊断。 AFM尖端可以用金属前体涂覆，并且前体在基底上图案化。 图案化的前体可以通过加热转化成金属状态。 可以实现高分辨率和优异的对准。

公开(公告)号：US06720499B2

公开(公告)日：2004-04-13

申请号：US10002714

申请日：2001-11-01

申请人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

发明人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

IPC分类号： H05K109

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1669 ,  C23C18/31 ,  C23C18/48 ,  C23C18/54 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12722

摘要： A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

摘要翻译： 一种印刷电路板，包括形成在印刷电路板的外表面上的电路，该电路包括铜或铜合金; 在电路上进行了最后的完成，最后完成包括在铜或铜合金电路上镀锡; 以及锡涂层上的合金盖层，所述合金盖层包括至少两个可浸镀金属。 合金盖层中的浸渍金属可以是选自锡，银，铋，铜，镍，铅，锌，铟，钯，铂，金，镉，钌和钴中的至少两种金属。 该电路保持无须且可焊接。

公开(公告)号：US5705230A

公开(公告)日：1998-01-06

申请号：US324460

申请日：1994-10-17

申请人： Toru Matanabe ,  Hirokazu Ezawa ,  Masahiro Miyata ,  Yukio Ikeda ,  Manabu Tsujimura ,  Hiroaki Inoue ,  Takeyuki Odaira ,  Naoaki Ogure

发明人： Toru Matanabe ,  Hirokazu Ezawa ,  Masahiro Miyata ,  Yukio Ikeda ,  Manabu Tsujimura ,  Hiroaki Inoue ,  Takeyuki Odaira ,  Naoaki Ogure

IPC分类号： C23C18/34 ,  C23C18/16 ,  C23C26/00 ,  C25D5/18 ,  C25D5/20 ,  H01L21/48 ,  H01L21/768 ,  H05K3/42 ,  B05D1/18

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1831 ,  H01L21/486 ,  H01L21/76877 ,  H05K3/422

摘要： The improved method comprises contacting a substrate 5 at least once by a liquid containing the elements that compose a pure metal or an alloy with which the small holes or recesses 3a in the substrate 5 are to be filled or covered, whereby the liquid wets the inner surfaces of said small holes or recesses 3a while, at the same time, said pure metal or said alloy is deposited on the surface of said substrate 5. The method is capable of filling small holes or covering small recesses in the surface of the substrate 5 with improved efficiency while, at the same time, it improves the heat resistance and materials stability of the part that contains the formed filling or covering layer.

摘要翻译： 改进的方法包括使基底5至少一次由含有构成纯金属的元素的液体或与基底5中的小孔或凹槽3a填充或覆盖的合金相接触，由此液体润湿内部 所述小孔或凹部3a的表面，同时所述纯金属或所述合金沉积在所述基板5的表面上。该方法能够填充小孔或覆盖基板5的表面中的小凹槽 同时提高了包含形成的填充或覆盖层的部件的耐热性和材料稳定性。

公开(公告)号：US20240304355A1

公开(公告)日：2024-09-12

申请号：US18275827

申请日：2022-02-04

申请人： MONASH UNIVERSITY

发明人： Wenlong CHENG ,  Lim Wei YAP ,  Fenge LIN ,  Kaixuan WANG

IPC分类号： H01B1/22 ,  A61B5/00 ,  A61B5/257 ,  A61B5/28 ,  C23C18/16 ,  C23C18/20 ,  C23C18/44 ,  C25B3/07 ,  C25B3/09 ,  C25B11/031 ,  C25B11/052 ,  C25B11/057 ,  C25B11/081 ,  H01Q1/36

CPC分类号： H01B1/22 ,  A61B5/0006 ,  A61B5/257 ,  A61B5/28 ,  C23C18/1641 ,  C23C18/1644 ,  C23C18/1666 ,  C23C18/2086 ,  C23C18/44 ,  C25B11/031 ,  C25B11/052 ,  C25B11/057 ,  C25B11/081 ,  H01Q1/364 ,  A61B2560/0214 ,  C25B3/07 ,  C25B3/09

摘要： Deformable porous elastic conductors and fabrication methods thereof, as well as their use in a broad range of applications including electrodes, supercapacitors, antennae, and electrocatalysts, medical devices, soft electronic devices and wearable sensors.

公开(公告)号：US11713510B2

公开(公告)日：2023-08-01

申请号：US17147947

申请日：2021-01-13

申请人： Beijing Institute of Technology

发明人： Hongmei Zhang ,  Yuxin Ge ,  Hongnian Cai ,  Xingwang Cheng ,  Ying Liu ,  Qunbo Fan

IPC分类号： C23C18/34 ,  C23C18/36 ,  C23C18/16

CPC分类号： C23C18/36 ,  C23C18/1639 ,  C23C18/1666 ,  C23C18/1689 ,  C23C18/34

摘要： A method for forming a nickel plated graphene hollow sphere is based on self assembly of graphene under the actions of a rotation force and the van der Waals force, and an electroless nickel plating process performed on the exposed surface of the graphene by means of a hydrothermal method. The method is simple to implement at low cost, and the nickel plated graphene hollow sphere product can be produced with good reproducibility and a high yield. The nickel plated graphene hollow sphere formed by the present method can exhibit good electromagnetic wave absorbing performances of both nickel and graphene, and may have a lower overall density.

公开(公告)号：US20180030609A1

公开(公告)日：2018-02-01

申请号：US15723822

申请日：2017-10-03

申请人： City University of Hong Kong

发明人： Christopher Michael Lee ,  Yang Yang Li ,  Jian Lu

IPC分类号： C25D11/00 ,  C23C16/56 ,  C23C18/16 ,  C23C16/44 ,  C25D11/26

CPC分类号： C25D11/005 ,  C23C16/4415 ,  C23C16/56 ,  C23C18/1666 ,  C25D11/26

摘要： Described herein are systems and methods for performing a surface mechanical attrition treatment (SMAT) to the surface of a variety of materials including thin films, nanomaterials, and other delicate and brittle materials. In an aspect, a surface of a material is modified to a modified surface and from an original state to a modified state, wherein the modified state comprises a physical modification, a chemical modification, or a biological modification. In another aspect, a surface mechanical attrition treatment (SMAT) is applied to the modified surface of the material for a defined duration of time, wherein a condition associated with the SMAT is adjusted based on a structural composition of the material. In yet another aspect, a defined strain is imposed on the structural composition of the material based on the SMAT.

公开(公告)号：US20080311400A1

公开(公告)日：2008-12-18

申请号：US12198053

申请日：2008-08-25

申请人： Valery M. Dubin ,  Juan E. Dominguez ,  Chin-Chang Cheng

发明人： Valery M. Dubin ,  Juan E. Dominguez ,  Chin-Chang Cheng

IPC分类号： B32B1/08 ,  B05D1/12 ,  B05C3/00

CPC分类号： B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B2202/02 ,  C01B2202/06 ,  C23C18/1646 ,  C23C18/1666 ,  C23C18/1669 ,  C23C18/1882 ,  Y10S977/742 ,  Y10T428/2982

摘要： An apparatus and method for forming catalyst particles to grow nanotubes is disclosed. In addition, an apparatus and method for forming nanotubes using the catalytic particles is also disclosed. The particles formed may have different diameters depending upon how they are formed. Once formed, the particles are deposited on a substrate. Once deposited, the mobility of the particles is restricted and nanotubes and/or nanotube portions are grown on the particles. Nanotube portions having different diameters may be formed and the portions may be connected to form nanotubes with different diameters along the length of the nanotube.

摘要翻译： 公开了一种用于形成催化剂颗粒以生长纳米管的装置和方法。 此外，还公开了使用催化剂颗粒形成纳米管的装置和方法。 形成的颗粒可以具有不同的直径，这取决于它们的形成方式。 一旦形成，颗粒沉积在基底上。 一旦沉积，颗粒的迁移率受到限制，纳米管和/或纳米管部分在颗粒上生长。 可以形成具有不同直径的纳米管部分，并且可以将部分连接以形成沿着纳米管的长度具有不同直径的纳米管。

公开(公告)号：US06669997B2

公开(公告)日：2003-12-30

申请号：US10105223

申请日：2002-03-26

申请人： Ben Li Luan ,  Joy Elizabeth Gray

发明人： Ben Li Luan ,  Joy Elizabeth Gray

IPC分类号： B05D118

CPC分类号： C23C18/1844 ,  C23C2/32 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1666 ,  C23C18/36 ,  C23C18/38 ,  C23C18/54 ,  C23C28/023 ,  C25D5/42 ,  Y10T428/12729

摘要： A process for coating an object formed of magnesium or a magnesium alloy comprising the steps of: immersion coating the object in a sonicated bath to form an undercoat and topcoating the object to form a topcoat. When desirable to protect against topcoat failure, the undercoat may be equally noble or more noble than the topcoat. If topcoat failure is not a concern, the nobility of the topcoat relative to the undercoat need not be considered. The process promotes uniform coating of a magnesium and its alloys.

摘要翻译： 一种用于涂覆由镁或镁合金形成的物体的方法，包括以下步骤：将物体浸没在超声处理的浴中以形成底涂层并且顶涂该物体以形成顶涂层。 当需要防止顶涂层破坏时，底涂层可以与顶涂层同样高贵或更高贵。 如果面层失效不是一个问题，面层相对于底漆的贵族不需要考虑。 该方法促进镁及其合金的均匀涂布。

公开(公告)号：US20020064676A1

公开(公告)日：2002-05-30

申请号：US10002714

申请日：2001-11-01

发明人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

IPC分类号： B32B015/00 ,  B32B015/01 ,  C25D001/00

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1669 ,  C23C18/31 ,  C23C18/48 ,  C23C18/54 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12722

摘要： A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

摘要翻译： 一种印刷电路板，包括形成在印刷电路板的外表面上的电路，该电路包括铜或铜合金; 在电路上进行了最后的完成，最后完成包括在铜或铜合金电路上镀锡; 以及在锡涂层上的合金盖层，所述合金盖层包括至少两个可浸镀金属。 合金盖层中的浸渍金属可以是选自锡，银，铋，铜，镍，铅，锌，铟，钯，铂，金，镉，钌和钴中的至少两种金属。 该电路保持无须且可焊接。