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Patent Agency Ranking
公开(公告)号：US11024785B2
公开(公告)日：2021-06-01
申请号：US16118747
申请日：2018-08-31
Applicant: Cree, Inc.
Inventor： Roshan Murthy , Kenneth M. Davis , Jae-Hyung Park , Xiameng Shi
IPC: H01L33/62 , H01L25/075 , H01L25/16 , H01L33/64 , H01L21/66 , H01L33/50 , H01L33/60 , H01L27/02 , G02B5/02 , G02B27/09 , H01L23/00 , H01L33/10
Abstract: Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.
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公开(公告)号：US11121298B2
公开(公告)日：2021-09-14
申请号：US16118762
申请日：2018-08-31
Applicant: Cree, Inc.
Inventor： Roshan Murthy , Kenneth M. Davis , Jae-Hyung Park , Xiameng Shi
IPC: H01L33/62 , H01L25/075 , H01L25/16 , H01L33/64 , H01L21/66 , H01L33/50 , H01L33/60 , H01L27/02 , G02B5/02 , G02B27/09 , H01L23/00 , H01L33/10
Abstract: Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs that include individually controllable LED chips are disclosed. In some embodiments, an LED package includes electrical connections configured to reduce corrosion of metals within the package; or decrease the overall forward voltage of the LED package; or provide an electrical path for electrostatic discharge (ESD) chips. In some embodiments, an LED package includes an array of LED chips, each of which is individually controllable such that individual LED chips or subgroups of LED chips may be selectively activated or deactivated. A single wavelength conversion element may be provided over the array of LED chips, or separate wavelength conversion elements may be provided over one or more individual LED chips of the array. Representative LED packages may be beneficial for applications where a high luminous intensity with a controllable brightness or adaptable emission pattern is desired.
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公开(公告)号：US10991862B2
公开(公告)日：2021-04-27
申请号：US16118747
申请日：2018-08-31
Applicant: Cree, Inc.
Inventor： Roshan Murthy , Kenneth M. Davis , Jae-Hyung Park , Xiameng Shi
IPC: H01L33/62 , H01L25/075 , H01L25/16 , H01L33/64 , H01L21/66 , H01L33/50 , H01L33/60 , H01L27/02 , G02B5/02 , G02B27/09 , H01L23/00 , H01L33/10
Abstract: Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.
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