公开(公告)号：US20170229685A1

公开(公告)日：2017-08-10

申请号：US15514655

申请日：2015-09-28

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Youhei HASHIMOTO ,  Rikiya YAMASHITA ,  Shunsuke UEDA

IPC: H01M2/02

CPC classification number: H01M2/0287 ,  B32B7/02 ,  B32B7/04 ,  B32B7/12 ,  B32B15/06 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/092 ,  B32B15/095 ,  B32B15/098 ,  B32B15/18 ,  B32B15/20 ,  B32B23/042 ,  B32B25/14 ,  B32B25/16 ,  B32B25/18 ,  B32B25/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/285 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2270/00 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/31 ,  B32B2307/50 ,  B32B2307/71 ,  B32B2307/714 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2307/746 ,  B32B2307/752 ,  B32B2457/10 ,  B32B2457/16 ,  B32B2553/00 ,  B65D65/40 ,  H01M2/0277 ,  H01M2/0285

Abstract: A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead time to be reduced. The packaging material is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer including a single- or multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.