公开(公告)号：US20210253527A1

公开(公告)日：2021-08-19

申请号：US17254053

申请日：2019-06-10

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Tsukasa YOSHIDA ,  Toshihiro TAI ,  Hitomi TAMAOKI ,  Satoru SUMIMOTO

IPC: C07D209/48 ,  C09D139/04 ,  C09D149/00 ,  C09D4/00 ,  C09J139/04 ,  C09J149/00 ,  C09J4/00 ,  C07C225/22 ,  C07D207/452 ,  C09K3/10

Abstract: Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (Td5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

公开(公告)号：US20210269593A1

公开(公告)日：2021-09-02

申请号：US17254076

申请日：2019-06-10

Applicant: DAICEL CORPORATION

Inventor： Daisuke ITO ,  Tsukasa YOSHIDA ,  Toshihiro TAI ,  Hitomi TAMAOKI ,  Satoru SUMIMOTO

IPC: C08G65/40 ,  C09D171/10 ,  C09D7/20 ,  C09J171/10 ,  B32B27/08 ,  B32B27/28 ,  B32B37/12

Abstract: Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar1 to Ar3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

公开(公告)号：US20200079726A1

公开(公告)日：2020-03-12

申请号：US16470057

申请日：2017-11-10

Applicant: DAICEL CORPORATION

Inventor： Fei YANG ,  Yoshimichi OKANO ,  Kouji NAKATANI ,  Feng LIU ,  Michiyo NAKAI ,  Takayuki YAEGASHI ,  Yusuke OKAMOTO ,  Tsukasa YOSHIDA

IPC: C07C225/22 ,  C07D209/50 ,  C07D207/452

Abstract: There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R1 and R2 each represent a curable functional group; D1 and D2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar1 to Ar3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO2—; each Y represents —S—, —SO2—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more):