CURABLE COMPOUND
    1.
    发明申请
    CURABLE COMPOUND 审中-公开

    公开(公告)号:US20200079726A1

    公开(公告)日:2020-03-12

    申请号:US16470057

    申请日:2017-11-10

    Abstract: There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R1 and R2 each represent a curable functional group; D1 and D2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar1 to Ar3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents —CO—, —S— or —SO2—; each Y represents —S—, —SO2—, —O—, —CO—, —COO— or —CONH—; and n represents an integer of 0 or more):

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