公开(公告)号：US20140270611A1

公开(公告)日：2014-09-18

申请号：US14196140

申请日：2014-03-04

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Kazuaki TODA

IPC: F16C33/06 ,  F16C17/04

CPC classification number: F16C17/04 ,  C22C38/00 ,  C22C38/16 ,  F16C33/121 ,  F16C33/122

Abstract: The disclosed is a thrust bearing including: a back metal layer; and a sliding layer joined to a front face of the back metal layer, the thrust bearing having a thickness T, wherein the back metal layer includes an intermediate sub-layer and a buffer sub-layer disposed on a back face of the back metal layer, the sliding layer being joined to the intermediate sub-layer, both of the sub-layers include iron or an iron alloy, and the buffer sub-layer has the thickness of 2 to 20% relative to a thickness T of the thrust bearing, and has a porosity ratio of 10 to 50%.

Abstract translation: 所公开的是推力轴承，包括：后金属层; 以及与所述背面金属层的正面接合的滑动层，所述推力轴承具有厚度T，其中所述背面金属层包括中间子层和设置在所述背面金属层的背面上的缓冲子层 ，所述滑动层与所述中间子层接合，所述两个子层包括铁或铁合金，并且所述缓冲层的层厚相对于所述推力轴承的厚度T为2〜20％ 孔隙率为10〜50％。

公开(公告)号：US20200300297A1

公开(公告)日：2020-09-24

申请号：US16088369

申请日：2017-03-28

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Kei ISHIKURA ,  Akihiro KOSE ,  Kazuaki TODA ,  Eisaku INOUE

IPC: F16C33/12

Abstract: An Al-based bearing alloy and a slide bearing incorporating the alloy exhibit high corrosion resistance and maintain high strength for a long period of time even in a high temperature environment. The Al-based bearing alloy and slide bearing includes an Al matrix, and acicular compounds which are needle-shaped that precipitate at a plurality of sites in a structure of the Al matrix, and that have a minor diameter and a major diameter.

公开(公告)号：US20190218646A1

公开(公告)日：2019-07-18

申请号：US16336534

申请日：2017-06-08

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Kazuaki TODA

IPC: C22C9/00 ,  B32B15/01 ,  B22D19/16 ,  B22D27/04 ,  F16C33/12 ,  F16C33/14

CPC classification number: C22C9/00 ,  B22D13/02 ,  B22D19/00 ,  B22D19/16 ,  B22D27/04 ,  B22D27/045 ,  B32B15/015 ,  C22C1/00 ,  C22C1/02 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06 ,  C22C9/10 ,  F16C33/12 ,  F16C33/121 ,  F16C33/14 ,  F16C2204/18

Abstract: Provided are a slide material in which the joining strength between a Bi-containing copper alloy layer and a substrate is improved, and a method for manufacturing the slide material. The slide material according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The contact area ratio of Bi phases of the copper alloy layer at the joining interface with the substrate is not more than 2.0%. The slide material is manufactured by casting a molten copper alloy onto a substrate and causing the copper alloy to solidify unidirectionally.

公开(公告)号：US20180258991A1

公开(公告)日：2018-09-13

申请号：US15915150

申请日：2018-03-08

Applicant: DAIDO METAL COMPANY LTD.

Inventor： Kazuaki TODA

IPC: F16C33/12 ,  B32B15/01 ,  B32B15/18 ,  B32B15/20 ,  B22D19/08 ,  B22D27/04 ,  C22C9/02 ,  C22C9/00 ,  F16C17/10

CPC classification number: F16C33/121 ,  B22D13/023 ,  B22D19/085 ,  B22D27/045 ,  B32B15/015 ,  B32B15/18 ,  B32B15/20 ,  C22C9/00 ,  C22C9/02 ,  F16C17/10 ,  F16C33/124 ,  F16C33/14 ,  F16C2202/50 ,  F16C2204/10 ,  F16C2204/12 ,  F16C2204/18 ,  F16C2223/44 ,  F16C2240/60 ,  F16C2360/22

Abstract: Provided is a sliding material including a substrate; and a copper alloy layer bonded to the substrate. The copper alloy includes 2.0 to 15.0% by mass of tin. The copper alloy layer includes a sliding body part including a sliding surface, and a gradient region including a bond surface with the substrate. A tin concentration in the gradient region reduces from the sliding body part toward the bond surface. A method for producing the siding material is also provided. The method includes preparing the substrate having a first surface and a second surface opposite to the first surface; melting the copper alloy; casting the molten copper alloy on the first surface of the substrate; and solidifying the copper alloy unidirectionally by cooling the substrate from the second surface by a coolant.