公开(公告)号：US20170130300A1

公开(公告)日：2017-05-11

申请号：US15318138

申请日：2015-07-03

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Shinya NARITA

IPC: C22C26/00 ,  C22C21/02 ,  C22C45/04 ,  C22C1/05

CPC classification number: C22C26/00 ,  B22F1/0003 ,  B22F1/0059 ,  B22F2998/10 ,  B22F2999/00 ,  B32B15/01 ,  C22C1/05 ,  C22C5/02 ,  C22C19/03 ,  C22C21/00 ,  C22C21/02 ,  C22C45/04 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/12083 ,  Y10T428/12889 ,  Y10T428/12944 ,  B22F7/04 ,  B22F2003/026 ,  B22F2003/145 ,  C22C1/051 ,  C23C14/00 ,  C25D5/00

Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

公开(公告)号：US20170045314A1

公开(公告)日：2017-02-16

申请号：US15305262

申请日：2015-04-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hideo TSUKAMOTO ,  Shinya NARITA

IPC: F28F13/18 ,  F28F21/08 ,  C01B31/06 ,  C22C26/00 ,  H01L23/373

CPC classification number: F28F13/18 ,  C01B32/28 ,  C01B32/914 ,  C22C1/05 ,  C22C1/10 ,  C22C26/00 ,  C22C2026/008 ,  F28F21/084 ,  F28F21/089 ,  F28F2255/06 ,  H01L23/373 ,  H01L23/3732 ,  H01L2924/0002 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/12083 ,  Y10T428/12889 ,  Y10T428/12944 ,  H01L2924/00

Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 μm and the area of the volumetric distribution of grain sizes of 45-205 μm is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

Abstract translation: 具有接近于半导体器件的高热导率和热膨胀系数的铝 - 金刚石复合材料，并且即使在高负载下实际使用也可以抑制表面金属层部分的膨胀等的发生 。 铝 - 金刚石复合材料包括65-80vol％的圆形度至少为0.94的金刚石粉末，其中晶粒尺寸的体积分布中的第一个峰位于5-25μm，第二个峰位于55- 195μm，晶粒尺寸为1-35μm的体积分布面积与45-205μm粒径的体积分布面积之比为1:9〜4:6; 余量由含铝的金属组成。