公开(公告)号：US20170268834A1

公开(公告)日：2017-09-21

申请号：US15508187

申请日：2015-09-01

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Kazunori KOYANAGI

IPC: F28F21/02 ,  C22C49/06 ,  H01L23/373 ,  C22C21/02 ,  F28F21/08 ,  C22C26/00 ,  C22C47/12

Abstract: A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

公开(公告)号：US20190341330A1

公开(公告)日：2019-11-07

申请号：US16474690

申请日：2017-11-24

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hiroaki OTA ,  Hideo TSUKAMOTO

IPC: H01L23/373 ,  C22C26/00 ,  C25D7/12 ,  C23C18/32

Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 μm and 55-195 μm, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 μm and 45-205 μm is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.

公开(公告)号：US20180281230A1

公开(公告)日：2018-10-04

申请号：US15765931

申请日：2016-10-11

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Takeshi MIYAKAWA ,  Yosuke ISHIHARA

IPC: B28B19/00 ,  C09K5/14 ,  H01L23/373 ,  F28F21/08 ,  B28B11/24

Abstract: The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor clement, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element. Provided is a flat plate-shaped aluminum-diamond composite that has an aluminum-diamond composite part and a surface layer that coats both surfaces of the composite part and includes a metal that has aluminum as a principal component, Wherein: the composite part is composed of a composite material that is composed of an aluminum or aluminum alloy matrix and diamond particles dispersed in said matrix; the composite material is composed of a diamond powder in which diamond particles having a particle size of 1-20 μm, inclusive, make up 10-40 vol of the diamond particles and diamond particles having a particle size of 100-250 μm, inclusive, make up 50-80 vol %, said powder not containing diamond particles having a particle size of less than 1 μm or diamond particles having a particle size of more than 250 μm; and the average value for the differences in in-plane thickness per 50 mm×50 mm is 100 μm or less.

公开(公告)号：US20240226997A1

公开(公告)日：2024-07-11

申请号：US18562539

申请日：2022-05-16

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Yosuke ISHIHARA ,  Daisuke GOTO

IPC: B22D19/14 ,  B22D18/02 ,  C22C1/10 ,  C22C26/00 ,  H01L21/48 ,  H01L23/373

CPC classification number: B22D19/14 ,  B22D18/02 ,  C22C1/1073 ,  C22C26/00 ,  H01L21/4871 ,  H01L23/3733

Abstract: A production method for an aluminum-diamond composite having a step of providing a laminate structure including a composition layer containing a diamond powder in an opening of a flat plate-like porous material having the opening so as to be separated from an inner circumferential surface of the opening and a step of press-fitting a melt of a metal containing aluminum into a space between the porous material and the laminate structure and impregnating the composition layer with the melt to form a composited part containing aluminum and diamond and forming metal layers on at least side surfaces of the laminate structure, in which the laminate structure includes a first mold release plate, a first inorganic layer, the composition layer, a second inorganic layer and a second mold release plate in this order.

公开(公告)号：US20220124936A1

公开(公告)日：2022-04-21

申请号：US17298169

申请日：2019-11-19

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Daisuke GOTO

IPC: H05K7/20

Abstract: A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.

公开(公告)号：US20170130300A1

公开(公告)日：2017-05-11

申请号：US15318138

申请日：2015-07-03

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Shinya NARITA

IPC: C22C26/00 ,  C22C21/02 ,  C22C45/04 ,  C22C1/05

CPC classification number: C22C26/00 ,  B22F1/0003 ,  B22F1/0059 ,  B22F2998/10 ,  B22F2999/00 ,  B32B15/01 ,  C22C1/05 ,  C22C5/02 ,  C22C19/03 ,  C22C21/00 ,  C22C21/02 ,  C22C45/04 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/12083 ,  Y10T428/12889 ,  Y10T428/12944 ,  B22F7/04 ,  B22F2003/026 ,  B22F2003/145 ,  C22C1/051 ,  C23C14/00 ,  C25D5/00

Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

公开(公告)号：US20170092560A1

公开(公告)日：2017-03-30

申请号：US15311268

申请日：2015-05-26

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO ,  Yosuke ISHIHARA

IPC: H01L23/373 ,  B23K35/30 ,  H01L21/48 ,  B22F1/02 ,  B22F1/00 ,  H01L23/367 ,  B23K1/00 ,  B23K35/36

CPC classification number: H01L23/3737 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/064 ,  B22F2301/255 ,  B22F2302/25 ,  B23K1/0016 ,  B23K35/3006 ,  B23K35/3602 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C30/02 ,  C22C30/06 ,  H01L21/4882 ,  H01L23/047 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/40 ,  H01L2924/16195

Abstract: A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member has an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material having silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 μm.

公开(公告)号：US20170045314A1

公开(公告)日：2017-02-16

申请号：US15305262

申请日：2015-04-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hideo TSUKAMOTO ,  Shinya NARITA

IPC: F28F13/18 ,  F28F21/08 ,  C01B31/06 ,  C22C26/00 ,  H01L23/373

CPC classification number: F28F13/18 ,  C01B32/28 ,  C01B32/914 ,  C22C1/05 ,  C22C1/10 ,  C22C26/00 ,  C22C2026/008 ,  F28F21/084 ,  F28F21/089 ,  F28F2255/06 ,  H01L23/373 ,  H01L23/3732 ,  H01L2924/0002 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/12083 ,  Y10T428/12889 ,  Y10T428/12944 ,  H01L2924/00

Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 μm and the area of the volumetric distribution of grain sizes of 45-205 μm is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

Abstract translation: 具有接近于半导体器件的高热导率和热膨胀系数的铝 - 金刚石复合材料，并且即使在高负载下实际使用也可以抑制表面金属层部分的膨胀等的发生 。 铝 - 金刚石复合材料包括65-80vol％的圆形度至少为0.94的金刚石粉末，其中晶粒尺寸的体积分布中的第一个峰位于5-25μm，第二个峰位于55- 195μm，晶粒尺寸为1-35μm的体积分布面积与45-205μm粒径的体积分布面积之比为1:9〜4:6; 余量由含铝的金属组成。

公开(公告)号：US20220017282A1

公开(公告)日：2022-01-20

申请号：US17292473

申请日：2019-11-06

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Yosuke ISHIHARA ,  Daisuke GOTO

IPC: B65D81/26 ,  B65D57/00 ,  B65D81/20

Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.

公开(公告)号：US20200335415A1

公开(公告)日：2020-10-22

申请号：US16822225

申请日：2020-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Takeshi MIYAKAWA ,  Yosuke ISHIHARA

IPC: H01L23/373 ,  H01L23/14 ,  H01L23/12 ,  H01L23/36 ,  C22F1/04 ,  H01L21/48 ,  H01L23/367

Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.