公开(公告)号：US10011918B2

公开(公告)日：2018-07-03

申请号：US14581876

申请日：2014-12-23

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ying-Hsueh Changchien ,  Yu-Ming Lee ,  Chi-Ming Yang

IPC: C25D5/00 ,  C25D3/02 ,  C25D21/06 ,  C25D21/02 ,  C25D21/18

CPC classification number: C25D21/06 ,  C25D3/02 ,  C25D5/00 ,  C25D5/003 ,  C25D21/02 ,  C25D21/18

Abstract: An electro-chemical plating process begins with supplying a supercritical fluid into an electroplating solution to be deposited, and a bias is applied between a substrate and an electrode, which is located in the electroplating solution. The substrate is placed into the electroplating solution to deposit a material on the substrate.

公开(公告)号：US09818514B2

公开(公告)日：2017-11-14

申请号：US14904887

申请日：2014-07-25

Applicant: University of Florida Research Foundation, Incorporated

Inventor： David P. Arnold ,  Jennifer S. Andrew

IPC: H01F1/01 ,  H01F1/057 ,  H01F10/00 ,  H01F41/26 ,  B22F3/02 ,  B22F3/26 ,  C23C18/16 ,  C23C18/31 ,  C25D7/00 ,  H01F1/047 ,  H01F1/055 ,  H01F1/147 ,  H01F41/00 ,  H01L21/288 ,  H01L49/02 ,  H01F1/00

CPC classification number: H01F1/0576 ,  B22F3/02 ,  B22F3/26 ,  B22F2998/10 ,  C22C1/1036 ,  C22C32/00 ,  C22C33/02 ,  C22C2202/02 ,  C23C18/1637 ,  C23C18/1644 ,  C23C18/1648 ,  C23C18/31 ,  C23C18/50 ,  C25D5/00 ,  C25D7/00 ,  C25D7/001 ,  H01F1/0054 ,  H01F1/047 ,  H01F1/0556 ,  H01F1/14733 ,  H01F10/007 ,  H01F41/005 ,  H01F41/26 ,  H01L21/2885 ,  H01L28/10

Abstract: Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

公开(公告)号：US09587322B2

公开(公告)日：2017-03-07

申请号：US14686479

申请日：2015-04-14

Applicant: Novellus Systems, Inc.

Inventor： Manish Ranjan ,  Shantinath Ghongadi ,  Frederick Dean Wilmot ,  Douglas Hill ,  Bryan L. Buckalew

IPC: C25D17/06 ,  C25D7/12 ,  C25D5/00 ,  C25D17/00 ,  H01L21/288

CPC classification number: C25D21/12 ,  C25D5/00 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  G03F7/16 ,  G03F7/20 ,  H01L21/0206 ,  H01L21/0273 ,  H01L21/2885 ,  H01L21/76802 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/5226 ,  H01L23/53228

Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

Abstract translation: 本文描述的方法将晶片进入电解质，使得由于晶片和/或晶片保持器与电解质的初始冲击而引起的空气滞留减少，并且晶片以这样的方式移动，使得在浸渍期间保持电解质润湿波前 该晶片还使空气截留最小化。

公开(公告)号：US09534308B2

公开(公告)日：2017-01-03

申请号：US13902517

申请日：2013-05-24

Applicant: Novellus Systems, Inc.

Inventor： Lee Peng Chua ,  Steven T. Mayer ,  David W. Porter ,  Thomas A. Ponnuswamy

IPC: C25D21/18 ,  C25D5/00 ,  C25D21/06 ,  C25D17/00 ,  C25D17/10 ,  C25D3/60

CPC classification number: C25D21/18 ,  C25D3/60 ,  C25D5/00 ,  C25D17/001 ,  C25D17/002 ,  C25D17/10 ,  C25D21/06

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract translation: 用于连续同时电镀具有基本上不同的标准电沉积电位（例如，用于沉积Sn-Ag合金）的两种金属的装置包括阳极室，用于容纳包含第一少量贵金属（例如锡）的离子的阳极电解液， 但不是第二个，更高贵的金属（例如银）和活性阳极; 阴极室，用于容纳包含第一金属（例如锡）的离子，第二，更贵金属（例如银）的离子和底物的阴极电解液; 位于阳极室和阴极室之间的分离结构，其中分离结构基本上防止更贵族金属从阴极电解液转移到阳极电解液; 流体特征和相关联的控制器，其耦合到所述装置并且被配置为执行连续电镀，同时在延长的使用期限内保持基本恒定的电镀浴组分的浓度。

公开(公告)号：US09469911B2

公开(公告)日：2016-10-18

申请号：US14601989

申请日：2015-01-21

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Roey Shaviv

IPC: C25D5/00

CPC classification number: C25D17/008 ,  C25D5/00 ,  C25D17/001 ,  C25D17/007 ,  C25D17/12

Abstract: An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.

Abstract translation: 电镀设备具有一个或多个膜管环，其作为电场屏蔽，以在工件的周边提供有利的电镀特性。 膜管环可以填充具有不同导电性的流体，以根据需要改变电镀不同类型的基底的屏蔽效果。 膜管环可以可选地设置在装置的容器中的扩散器板中或其上。

公开(公告)号：US20160281255A1

公开(公告)日：2016-09-29

申请号：US15181150

申请日：2016-06-13

Applicant: Novellus Systems, Inc.

Inventor： Bryan L. Buckalew ,  Steven T. Mayer ,  Thomas A. Ponnuswamy ,  Robert Rash ,  Brian Paul Blackman ,  Doug Higley

IPC: C25D7/12 ,  H01L21/67 ,  H01L21/768 ,  C25D5/56 ,  C25D21/12 ,  C25D3/30 ,  C25D5/02 ,  C25D5/12 ,  C25D21/04 ,  H01L21/288 ,  C25D3/12

CPC classification number: C25D7/123 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/00 ,  C25D5/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/56 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  H01L21/02307 ,  H01L21/2885 ,  H01L21/321 ,  H01L21/67051 ,  H01L21/67138 ,  H01L21/76861 ,  H01L21/76877 ,  H01L21/76879 ,  H01L21/76885 ,  H01L21/76898

Abstract: Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute.

公开(公告)号：US20160194760A1

公开(公告)日：2016-07-07

申请号：US14906370

申请日：2014-09-11

Applicant: ATOTECH DEUTSCHLAND GMBH

Inventor： Matthias DAMMASCH ,  Marco HARYONO ,  Sengül KARASAHIN ,  Hans-Jürgen SCHREIER

IPC: C23C18/40 ,  C25D5/00 ,  C25D7/12 ,  C23C18/16 ,  C25D3/38

CPC classification number: C23C18/40 ,  C23C18/1633 ,  C23C18/1653 ,  C23C18/1683 ,  C25D3/38 ,  C25D5/00 ,  C25D7/12 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76898

Abstract: The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.

Abstract translation: 本发明涉及一种在阻挡层的顶部上提供铜籽晶层的方法，其中所述种子层由包含Cu（II）离子的水溶性源的水性无电镀铜浴沉积到所述阻挡层上， 用于Cu（II）离子的还原剂，用于Cu（II）离子的至少一种络合剂和至少一种选自RbOH，CsOH及其混合物的氢氧根离子源。 所得到的铜种子层具有均匀的厚度分布和光滑的外表面，它们都是期望的性质。

公开(公告)号：US20160172085A1

公开(公告)日：2016-06-16

申请号：US14904887

申请日：2014-07-25

Applicant: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED

Inventor： David P. Arnold ,  Jennifer S. Andrew

IPC: H01F1/057 ,  H01F1/047 ,  H01F1/055 ,  H01F41/00 ,  C25D7/00 ,  H01L21/288 ,  C23C18/31 ,  B22F3/02 ,  B22F3/26 ,  H01F41/26 ,  H01F10/00 ,  H01L49/02 ,  H01F1/147 ,  C23C18/16

CPC classification number: H01F1/0576 ,  B22F3/02 ,  B22F3/26 ,  B22F2998/10 ,  C22C1/1036 ,  C22C32/00 ,  C22C33/02 ,  C22C2202/02 ,  C23C18/1637 ,  C23C18/1644 ,  C23C18/1648 ,  C23C18/31 ,  C23C18/50 ,  C25D5/00 ,  C25D7/00 ,  C25D7/001 ,  H01F1/0054 ,  H01F1/047 ,  H01F1/0556 ,  H01F1/14733 ,  H01F10/007 ,  H01F41/005 ,  H01F41/26 ,  H01L21/2885 ,  H01L28/10

Abstract: Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

Abstract translation: 描述纳米复合磁性材料，制造纳米复合磁性材料的方法，以及使用这些纳米复合磁性材料的磁性器件和系统。 可以使用电渗入法形成纳米复合磁性材料，其中将纳米材料固结到平面基底上的多孔微结构中之后，通过电镀磁性金属渗透纳米材料（具有调整尺寸，形状，磁性能和表面化学性质）。 纳米材料可以被认为是包含相，并且磁性金属可以被认为是多相纳米复合材料的基体相。

公开(公告)号：US09358765B2

公开(公告)日：2016-06-07

申请号：US14429960

申请日：2012-09-28

Applicant: EV GROUP E. THALLNER GMBH

Inventor： Markus Wimplinger ,  Bernhard Rebhan

IPC: B23K20/00 ,  H01L23/00 ,  B32B37/16 ,  B23K20/02 ,  B23K20/16 ,  B23K20/24 ,  B32B37/10 ,  B32B37/12 ,  B32B38/00 ,  C23C14/24 ,  C23C16/44 ,  C23C28/02 ,  C25D5/00

CPC classification number: B32B37/16 ,  B23K20/02 ,  B23K20/023 ,  B23K20/026 ,  B23K20/16 ,  B23K20/24 ,  B32B37/10 ,  B32B37/12 ,  B32B38/0036 ,  B32B2309/025 ,  B32B2309/12 ,  B32B2311/12 ,  C23C14/24 ,  C23C16/44 ,  C23C28/02 ,  C25D5/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29147 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29664 ,  H01L2224/29666 ,  H01L2224/29684 ,  H01L2224/83013 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8382 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T156/10 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/20111 ,  H01L2924/2011 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 μm. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates.

Abstract translation: 一种通过在第一基板的第一表面上沉积形成第一扩散接合层的第一材料的第一扩散接合层来涂覆第一基板的方法，使得第一扩散接合层形成具有平均晶粒的晶粒表面 平行于第一表面的直径H小于1μm。 本发明还涉及一种如上所述将已经涂覆的第一衬底接合到具有第二扩散接合层的第二衬底上的方法，所述接合方法包括以下步骤：使第一扩散接合层 第一衬底与第二衬底的第二扩散接合层接触，将衬底压在一起以在第一和第二衬底之间形成永久性金属扩散接合。

公开(公告)号：US09345294B2

公开(公告)日：2016-05-24

申请号：US13503757

申请日：2010-11-09

Applicant: Pascal Grossenbacher ,  Julien Meier ,  Michel Caillaud ,  Stéphane Lauper ,  Arlette-Elsa Emch

Inventor： Pascal Grossenbacher ,  Julien Meier ,  Michel Caillaud ,  Stéphane Lauper ,  Arlette-Elsa Emch

IPC: A44C17/02 ,  A44C17/00 ,  A44C17/04

CPC classification number: A44C17/005 ,  A44C17/02 ,  A44C17/04 ,  C25D5/00 ,  C25D7/00 ,  Y10T428/12389 ,  Y10T428/12535

Abstract: The invention relates to a decorative part (1, 3, 5) including several stones (2) and a device (7, 7′, 47, 47′) for securing the stones (2) in relation to each other. According to the invention, the securing device (7, 7′, 47, 47′) includes a single electrodeposited base (9, 9′, 49, 49′) whose shape matches one part of the stones, thus allowing all the stones (2) to be attached in relation to each other without any stress, and the girdles (6) of the stones (2) are mounted edge-to-edge in relation to each other so that the single base is concealed. The invention also relates to the method for manufacturing a part (1, 3, 5) of this type.

Abstract translation: 本发明涉及一种包括几块石头（2）的装饰部件（1,3,5）和用于将石块（2）相互固定的装置（7,7'，47,47'）。 根据本发明，固定装置（7,7'，47,47'）包括一个电沉积基座（9,9'，49,49'），其形状与一部分石头相匹配，从而允许所有的石块 2）相互连接而没有任何应力，并且石块（2）的带（6）相对于彼此边缘到边缘安装，使得单个基座被隐藏。 本发明还涉及这种类型的部件（1,3,5）的制造方法。