公开(公告)号：US20210335740A1

公开(公告)日：2021-10-28

申请号：US17371586

申请日：2021-07-09

Applicant: DENSO CORPORATION

Inventor： Mariko FUJIEDA ,  Kazuaki MAWATARI ,  Shinji KAWANO

IPC: H01L23/00 ,  H01L29/84 ,  G01L9/00 ,  G01L19/06

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

公开(公告)号：US20190252336A1

公开(公告)日：2019-08-15

申请号：US16392881

申请日：2019-04-24

Applicant: DENSO CORPORATION

Inventor： Mariko FUJIEDA ,  Kazuaki MAWATARI ,  Ryuta IKOMA ,  Kazuya HIRASAWA ,  Shinji KAWANO

IPC: H01L23/00 ,  G01L19/06 ,  H01L29/84 ,  G01L9/00

CPC classification number: H01L24/08 ,  G01L9/00 ,  G01L19/06 ,  H01L24/03 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L29/84 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2224/8592

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.