公开(公告)号：US20190120709A1

公开(公告)日：2019-04-25

申请号：US16226998

申请日：2018-12-20

申请人： DENSO CORPORATION

发明人： Takeru KANAZAWA ,  Kazuyuki ONO ,  Shinji KAWANO

IPC分类号： G01L9/00

摘要： The present disclosure provides a pressure sensor configured to generate an electrical output according to a fluid pressure in a detection space applied to a diaphragm. The diaphragm is flexibly deformable in a thickness direction. The pressure sensor includes a pressure receiving recess defining the detection space and a protection film covering the pressure receiving recess. The protection film has a corner portion provided in an inner corner area of the pressure receiving recess. The corner portion is located outside the diaphragm in an in-plane direction orthogonal to the thickness direction.

公开(公告)号：US20220132711A1

公开(公告)日：2022-04-28

申请号：US17646788

申请日：2022-01-03

申请人： DENSO CORPORATION

发明人： Yusuke TAINAKA ,  Akira SHINTAI ,  Shinji KAWANO

IPC分类号： H05K9/00 ,  H05K7/20 ,  G01S13/931 ,  G01S7/02

摘要： A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

公开(公告)号：US20220128650A1

公开(公告)日：2022-04-28

申请号：US17646786

申请日：2022-01-03

申请人： DENSO CORPORATION

发明人： Yusuke TAINAKA ,  Akira SHINTAI ,  Shinji KAWANO

IPC分类号： G01S7/03 ,  H01Q1/22 ,  H01Q9/04

摘要： In a radar apparatus, a high-frequency integrated circuit is mounted to a board, and a shielding case encloses the high-frequency integrated circuit. A radio-absorbing and heat-dissipative gel is arranged to cover at least part of the high-frequency integrated circuit and to be in contact with the shielding case.

公开(公告)号：US20210335740A1

公开(公告)日：2021-10-28

申请号：US17371586

申请日：2021-07-09

申请人： DENSO CORPORATION

发明人： Mariko FUJIEDA ,  Kazuaki MAWATARI ,  Shinji KAWANO

IPC分类号： H01L23/00 ,  H01L29/84 ,  G01L9/00 ,  G01L19/06

摘要： A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

公开(公告)号：US20190252336A1

公开(公告)日：2019-08-15

申请号：US16392881

申请日：2019-04-24

申请人： DENSO CORPORATION

发明人： Mariko FUJIEDA ,  Kazuaki MAWATARI ,  Ryuta IKOMA ,  Kazuya HIRASAWA ,  Shinji KAWANO

IPC分类号： H01L23/00 ,  G01L19/06 ,  H01L29/84 ,  G01L9/00

CPC分类号： H01L24/08 ,  G01L9/00 ,  G01L19/06 ,  H01L24/03 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L29/84 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2224/8592

摘要： A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

公开(公告)号：US20230299030A1

公开(公告)日：2023-09-21

申请号：US18323241

申请日：2023-05-24

申请人： DENSO CORPORATION

发明人： Kazuaki MAWATARI ,  Shinji KAWANO

IPC分类号： H01L23/00 ,  G01L19/06 ,  H01L29/84 ,  G01L9/00

CPC分类号： H01L24/08 ,  G01L19/06 ,  H01L29/84 ,  H01L24/03 ,  H01L24/32 ,  H01L24/73 ,  G01L9/00 ,  H01L24/48 ,  H01L2224/8592 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/73215

摘要： A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

公开(公告)号：US20190178738A1

公开(公告)日：2019-06-13

申请号：US16273740

申请日：2019-02-12

申请人： DENSO CORPORATION

发明人： Shinji KAWANO ,  Kazuaki MAWATARI

IPC分类号： G01L9/00 ,  G01L19/06 ,  G01L19/14 ,  H01L29/84 ,  G01L9/02

摘要： A pressure sensor detects a pressure of a pressure transmitting medium. The pressure sensor includes a sensor substrate and a protection film. The sensor substrate includes a recess recessed relative to a periphery thereof and a thin portion thinner than the periphery due to the recess. The protection film is provided on a bottom surface of the recess that is one side of the thin portion and a part of a lateral surface of the recess, and the protection film suppresses an adhesion of a contamination contained in the pressure transmitting medium. The pressure sensor includes an adhesion suppressing portion that includes an uneven section formed in at least a part of the lateral surface, and a liquid repellent film repellent to liquid in the pressure transmitting medium and provided as the protection film on the uneven section to exhibit a lotus effect.