公开(公告)号：US20190078955A1

公开(公告)日：2019-03-14

申请号：US16080410

申请日：2017-04-06

Applicant: DENSO CORPORATION

Inventor： Kazuya HIRASAWA ,  Takuya SATO

IPC: G01L19/14 ,  G01L19/00

CPC classification number: G01L19/142 ,  G01L19/0061 ,  G01L19/14 ,  G01L19/147 ,  G01L19/148

Abstract: Instead of insert molding a mold member with a resin case to integrate it, a filler is filled into a first opening formed in the resin case while the mold member is disposed therein, whereby integration is performed. This makes it possible to suppress peeling between the mold member and the resin case due to a thermal cycle, and also makes it possible to suppress leakage of a measurement medium to the outside through a gap between the mold member and the resin case.

公开(公告)号：US20190252336A1

公开(公告)日：2019-08-15

申请号：US16392881

申请日：2019-04-24

Applicant: DENSO CORPORATION

Inventor： Mariko FUJIEDA ,  Kazuaki MAWATARI ,  Ryuta IKOMA ,  Kazuya HIRASAWA ,  Shinji KAWANO

IPC: H01L23/00 ,  G01L19/06 ,  H01L29/84 ,  G01L9/00

CPC classification number: H01L24/08 ,  G01L9/00 ,  G01L19/06 ,  H01L24/03 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L29/84 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2224/8592

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

公开(公告)号：US20200381341A1

公开(公告)日：2020-12-03

申请号：US16884122

申请日：2020-05-27

Applicant: DENSO CORPORATION

Inventor： Kazuya HIRASAWA

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/50 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame, a semiconductor chip, a plurality of three-dimensional wrings, and a mold resin. The semiconductor chip is mounted on the lead frame. The mold resin covers a part of the lead frame, the semiconductor chip, and a part of each of the plurality of three-dimensional wirings.