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公开(公告)号:US11233147B2
公开(公告)日:2022-01-25
申请号:US16745682
申请日:2020-01-17
Applicant: DENSO CORPORATION
Inventor: Masato Noborio , Jun Saito , Yukihiko Watanabe
IPC: H01L29/739 , H01L29/78 , H01L29/423 , H01L29/16 , H01L29/08 , H01L29/417
Abstract: A semiconductor device includes an inversion type semiconductor element including: a semiconductor substrate; a first conductive type layer formed on the semiconductor substrate; an electric field blocking layer formed on the first conductive type layer and including a linear shaped portion; a JFET portion formed on the first conductive type layer and having a linear shaped portion; a current dispersion layer formed on the electric field blocking layer and the JFET portion; a deep layer formed on the electric field blocking layer and the JFET portion; a base region formed on the current dispersion layer and the deep layer; a source region formed on the base region; trench gate structures including a gate trench, a gate insulation film, and a gate electrode, and arranged in a stripe shape; an interlayer insulation; a source electrode; and a drain electrode formed on a back surface side of the semiconductor substrate.
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公开(公告)号:US12211902B2
公开(公告)日:2025-01-28
申请号:US17520882
申请日:2021-11-08
Applicant: DENSO CORPORATION
Inventor: Masato Noborio , Takehiro Kato , Yusuke Yamashita
Abstract: In a semiconductor device, a source region is made of an epitaxial layer so as to reduce variation in thickness of a base region and variation in a threshold value. Outside of a cell part, a side surface of a gate trench is inclined relative to a normal direction to a main surface of a substrate, as compared with a side surface of a gate trench in the cell part that is provided by the epitaxial layer of the source region being in contact with the base region.
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公开(公告)号:US10964809B2
公开(公告)日:2021-03-30
申请号:US16816463
申请日:2020-03-12
Applicant: DENSO CORPORATION
Inventor: Masato Noborio , Masayasu Ishiko , Jun Saito
IPC: H01L29/78 , H01L21/265 , H01L29/06 , H01L29/08 , H01L29/16 , H01L29/417 , H01L29/423 , H01L29/66
Abstract: A semiconductor device comprises: a cell region that includes a semiconductor element; an outer peripheral region that surrounds an outer periphery of the cell region; a substrate that has a front surface and a back surface, and is made of a semiconductor of a first or second conductivity type; a first conductivity layer that is formed on the front surface of the substrate and made of the semiconductor of the first conductivity type having a lower impurity concentration than impurity concentration of the substrate; a first electrode that is provided on an opposite side of the substrate across the first conductivity layer, the first electrode being provided in the semiconductor element; and a second electrode that is placed toward the back surface of the substrate, the second electrode being provided in the semiconductor element.
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公开(公告)号:US12288817B2
公开(公告)日:2025-04-29
申请号:US17871231
申请日:2022-07-22
Inventor: Masato Noborio
Abstract: A semiconductor device has a cell region formed with a semiconductor element and an outer peripheral region surrounding the cell region. The outer peripheral region includes a guard ring part having a plurality of guard rings of the second conductivity-type, and a plurality of guard ring column regions of the second conductivity-type. Each of the guard rings is disposed in a surface layer portion of the drift layer and has a frame shape surrounding the cell region. The guard ring column regions are extended from the guard rings toward the substrate. Each of the guard ring column regions has a width smaller than a width of each of the guard rings in a direction along a planar direction of the substrate in a predetermined cross-section defined along the cell region and the outer peripheral region. At least two guard ring column regions are provided for each guard ring.
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