Semiconductor device
    1.
    发明授权

    公开(公告)号:US11233147B2

    公开(公告)日:2022-01-25

    申请号:US16745682

    申请日:2020-01-17

    Abstract: A semiconductor device includes an inversion type semiconductor element including: a semiconductor substrate; a first conductive type layer formed on the semiconductor substrate; an electric field blocking layer formed on the first conductive type layer and including a linear shaped portion; a JFET portion formed on the first conductive type layer and having a linear shaped portion; a current dispersion layer formed on the electric field blocking layer and the JFET portion; a deep layer formed on the electric field blocking layer and the JFET portion; a base region formed on the current dispersion layer and the deep layer; a source region formed on the base region; trench gate structures including a gate trench, a gate insulation film, and a gate electrode, and arranged in a stripe shape; an interlayer insulation; a source electrode; and a drain electrode formed on a back surface side of the semiconductor substrate.

    Semiconductor device and manufacturing process therefor

    公开(公告)号:US10964809B2

    公开(公告)日:2021-03-30

    申请号:US16816463

    申请日:2020-03-12

    Abstract: A semiconductor device comprises: a cell region that includes a semiconductor element; an outer peripheral region that surrounds an outer periphery of the cell region; a substrate that has a front surface and a back surface, and is made of a semiconductor of a first or second conductivity type; a first conductivity layer that is formed on the front surface of the substrate and made of the semiconductor of the first conductivity type having a lower impurity concentration than impurity concentration of the substrate; a first electrode that is provided on an opposite side of the substrate across the first conductivity layer, the first electrode being provided in the semiconductor element; and a second electrode that is placed toward the back surface of the substrate, the second electrode being provided in the semiconductor element.

    Semiconductor device and method for manufacturing the same

    公开(公告)号:US12288817B2

    公开(公告)日:2025-04-29

    申请号:US17871231

    申请日:2022-07-22

    Inventor: Masato Noborio

    Abstract: A semiconductor device has a cell region formed with a semiconductor element and an outer peripheral region surrounding the cell region. The outer peripheral region includes a guard ring part having a plurality of guard rings of the second conductivity-type, and a plurality of guard ring column regions of the second conductivity-type. Each of the guard rings is disposed in a surface layer portion of the drift layer and has a frame shape surrounding the cell region. The guard ring column regions are extended from the guard rings toward the substrate. Each of the guard ring column regions has a width smaller than a width of each of the guard rings in a direction along a planar direction of the substrate in a predetermined cross-section defined along the cell region and the outer peripheral region. At least two guard ring column regions are provided for each guard ring.

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