公开(公告)号：US20160066439A1

公开(公告)日：2016-03-03

申请号：US14784080

申请日：2014-04-03

Applicant: DENSO CORPORATION

Inventor： Hiroaki ANDO ,  Kiminobu INAYOSHI ,  Tetsuichi TAKEUCHI ,  Naoto MAKINO ,  Tetsuya SUEYOSHI ,  Kenichi KATOH ,  Keisuke NISHIO

IPC: H05K5/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K5/0013 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16013 ,  H01L2924/3512 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/613

Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.

Abstract translation: 车载电子设备具有半导体封装和多层布线板。 多层布线基板的电极焊盘，其上焊接有半导体封装的信号端子，在多层布线基板的内层具有布线图形。 施加阻焊剂并与电极垫的外围间隔开至外部。 信号端子被焊接到电极焊盘以覆盖电极焊盘的侧表面的上表面和上端。 结果，在与信号端子连接的焊料中不太可能发生裂纹。 因此，即使信号端子以少数提供在半导体封装中，信号端子也可以高可靠性地电连接。