公开(公告)号：US10064297B2

公开(公告)日：2018-08-28

申请号：US15090194

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tomoki Hanada ,  Ryo Nishimoto ,  Hiroyuki Ibaraki

IPC: H05K5/00 ,  H05K5/03

CPC classification number: H05K5/0052 ,  H05K5/0047

Abstract: An electronic control unit includes a substrate, a first cover, and a second cover. An electronic component is mounted on the substrate. The first cover is disposed to be opposed to one surface of the substrate and includes a first sidewall part extending in a direction perpendicular to the substrate, and claw part(s) projecting laterally from the first sidewall part. The second cover is disposed to be opposed to the other surface of the substrate and includes a second sidewall part, and groove part(s). The second sidewall part faces the first sidewall part. The groove part(s) is formed at the second sidewall part such that a shape of each of the groove part(s) when viewed from the direction perpendicular to the substrate is a recessed shape in conformity with a projecting shape of a corresponding claw part. Each groove part is fitted to a corresponding claw part.

公开(公告)号：US09326368B2

公开(公告)日：2016-04-26

申请号：US14582898

申请日：2014-12-24

Applicant: DENSO CORPORATION

Inventor： Ryo Nishimoto ,  Shinsuke Oota

IPC: G06F17/00 ,  H05K1/02 ,  H05K7/14 ,  H05K3/34

CPC classification number: H05K1/0209 ,  H05K3/3415 ,  H05K7/1432 ,  H05K2201/066 ,  H05K2201/10189 ,  Y02P70/613

Abstract: An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion.

Abstract translation: 电子控制单元包括板，发热装置，连接器和散热器。 该电路板具有绝缘层和局部暴露在绝缘层外部的布线图案。 发热装置安装在板上并电连接到布线图案。 连接器位于发热装置的附近，并且具有连接到布线图案的连接端子。 散热器位于与发热装置相对的板上，并且与发热装置接触以散热发热装置的热量。 布线图案具有包括安装部分和连接部分的焊盘图案。 发热装置安装在安装部分上。 连接器的连接端子连接到连接部分。

公开(公告)号：US10462936B2

公开(公告)日：2019-10-29

申请号：US15090268

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Ryo Nishimoto

IPC: H05K7/20

Abstract: An electronic control unit includes a plurality of heating elements, a substrate, a heat sink, and a housing. The substrate includes a heating region on which the plurality of heating elements are collectively mounted. The heat sink is provided to be opposed to one surface of the substrate, and includes a radiating part, which is disposed in correspondence to the heating region of the substrate and receives heat generated by the plurality of heating elements. The housing is provided to cover the other surface of the substrate. The heat sink includes a fixation part, which is disposed separately from the radiating part and to which an outer edge part of the housing is fixed.

公开(公告)号：US20160295745A1

公开(公告)日：2016-10-06

申请号：US15090268

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Ryo Nishimoto

IPC: H05K7/20

CPC classification number: H05K7/20854 ,  H05K7/20845 ,  H05K7/209

Abstract: An electronic control unit includes a plurality of heating elements, a substrate, a heat sink, and a housing. The substrate includes a heating region on which the plurality of heating elements are collectively mounted. The heat sink is provided to be opposed to one surface of the substrate, and includes a radiating part, which is disposed in correspondence to the heating region of the substrate and receives heat generated by the plurality of heating elements. The housing is provided to cover the other surface of the substrate. The heat sink includes a fixation part, which is disposed separately from the radiating part and to which an outer edge part of the housing is fixed.

Abstract translation: 电子控制单元包括多个加热元件，基板，散热器和外壳。 基板包括多个加热元件集中安装在其上的加热区域。 散热器设置为与衬底的一个表面相对，并且包括辐射部分，其布置成对应于衬底的加热区域并且接收由多个加热元件产生的热量。 壳体设置成覆盖衬底的另一表面。 散热器包括固定部分，该固定部分与散热部分分开设置，外壳的外边缘部分固定在该固定部分上。

公开(公告)号：US20160295729A1

公开(公告)日：2016-10-06

申请号：US15090194

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tomoki Hanada ,  Ryo Nishimoto ,  Hiroyuki Ibaraki

IPC: H05K5/03

CPC classification number: H05K5/0052 ,  H05K5/0047

Abstract: An electronic control unit includes a substrate, a first cover, and a second cover. An electronic component is mounted on the substrate. The first cover is disposed to be opposed to one surface of the substrate and includes a first sidewall part extending in a direction perpendicular to the substrate, and claw part(s) projecting laterally from the first sidewall part. The second cover is disposed to be opposed to the other surface of the substrate and includes a second sidewall part, and groove part(s). The second sidewall part faces the first sidewall part. The groove part(s) is formed at the second sidewall part such that a shape of each of the groove part(s) when viewed from the direction perpendicular to the substrate is a recessed shape in conformity with a projecting shape of a corresponding claw part. Each groove part is fitted to a corresponding claw part.

Abstract translation: 电子控制单元包括基板，第一盖和第二盖。 电子部件安装在基板上。 第一盖布置成与基板的一个表面相对，并且包括沿垂直于基板的方向延伸的第一侧壁部分和从第一侧壁部分侧向突出的爪部。 第二盖设置成与基板的另一个表面相对，并且包括第二侧壁部分和凹槽部分。 第二侧壁部分面向第一侧壁部分。 所述槽部形成在所述第二侧壁部，使得当从所述基板垂直的方向观察时，所述槽部的形状为与所述对应的爪部的突出形状一致的凹状 。 每个凹槽部分装配到相应的爪部分。