公开(公告)号：US09555828B2

公开(公告)日：2017-01-31

申请号：US14582877

申请日：2014-12-24

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi Tashima ,  Jyunichi Oogoshi ,  Takayuki Uchida ,  Katsuhiko Hayashi ,  Shinsuke Oota

IPC: H05K7/20 ,  B62D5/04 ,  H05K1/02 ,  H05K7/14 ,  H05K1/18

CPC classification number: B62D5/0406 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/1432 ,  H05K7/20854 ,  H05K2201/09972

Abstract: In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Abstract translation: 在电子控制单元中，高温发生装置安装在板的第一表面或第二表面上，散热构件面向板的第一表面定位，并且导热构件位于 板和散热构件。 导热构件与高发热装置接触，以将高发热装置的热传递到散热构件。 安装在板上的高发热装置的数量与布置在第一表面的第一有限区域内的高发热装置的数量或第二表面的第二限制区域的数量的比率大于 预定比例。 第二有限区域位于与第一有限区域对应的位置。

公开(公告)号：US09326368B2

公开(公告)日：2016-04-26

申请号：US14582898

申请日：2014-12-24

Applicant: DENSO CORPORATION

Inventor： Ryo Nishimoto ,  Shinsuke Oota

IPC: G06F17/00 ,  H05K1/02 ,  H05K7/14 ,  H05K3/34

CPC classification number: H05K1/0209 ,  H05K3/3415 ,  H05K7/1432 ,  H05K2201/066 ,  H05K2201/10189 ,  Y02P70/613

Abstract: An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion.

Abstract translation: 电子控制单元包括板，发热装置，连接器和散热器。 该电路板具有绝缘层和局部暴露在绝缘层外部的布线图案。 发热装置安装在板上并电连接到布线图案。 连接器位于发热装置的附近，并且具有连接到布线图案的连接端子。 散热器位于与发热装置相对的板上，并且与发热装置接触以散热发热装置的热量。 布线图案具有包括安装部分和连接部分的焊盘图案。 发热装置安装在安装部分上。 连接器的连接端子连接到连接部分。

公开(公告)号：US20140254103A1

公开(公告)日：2014-09-11

申请号：US14190682

申请日：2014-02-26

Applicant: DENSO CORPORATION

Inventor： Tomoaki YOSHIMI ,  Shinsuke Oota

IPC: H05K7/20

CPC classification number: H05K7/2089 ,  H05K7/209

Abstract: A substrate of an electronic control unit has a control region on which a control component is disposed and a power region on which a power component is disposed. Substrate-fixing portions of a housing project from a bottom portion, and the substrate is fixed to the substrate-fixing portions. A heat radiating portion extends from the bottom portion. Semiconductor modules are fixed to a first outer surface and a second outer surface of the heat radiating portion, the first outer surface being on a side opposite to the power component. The heat radiating portion is located between the semiconductor modules and the power component. Therefore, heat interference between the semiconductor modules and the power component is reduced, and a heat radiation performance improves.

Abstract translation: 电子控制单元的基板具有设置有控制部件的控制区域和配置有功率部件的功率区域。 壳体的基板固定部从底部伸出，基板固定在基板固定部上。 散热部从底部延伸。 半导体模块固定在散热部分的第一外表面和第二外表面上，第一外表面位于与功率部件相对的一侧。 散热部分位于半导体模块和功率部件之间。 因此，半导体模块和功率部件之间的热干扰降低，散热性能提高。