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公开(公告)号:US10996002B2
公开(公告)日:2021-05-04
申请号:US16371195
申请日:2019-04-01
Applicant: DENSO CORPORATION
Inventor: Yasumitsu Omi , Takeshi Yoshinori , Masayuki Takeuchi , Koji Miura
IPC: F28D15/02 , F28F9/02 , H01M10/6557
Abstract: An evaporator evaporates a working fluid by heat from a battery. The evaporator includes at least one evaporation channel connected to the battery in a thermally conductive manner. The evaporator includes a supply channel connected to an upstream end of the evaporation channel, and supplies the working fluid in liquid phase from the supply channel to the evaporation channel. The evaporator includes an outflow channel connected with a downstream end of the evaporation channel, and discharges the working fluid. The outflow channel is disposed above the supply channel, and the supply channel is disposed at a position more insulated from the heat of the battery than the evaporation channel is.
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公开(公告)号:US10910684B2
公开(公告)日:2021-02-02
申请号:US16373683
申请日:2019-04-03
Applicant: DENSO CORPORATION
Inventor: Yasumitsu Omi , Takeshi Yoshinori , Masayuki Takeuchi , Koji Miura
IPC: H01M10/613 , H01L23/427 , H01M10/625 , B60H1/00 , F28D15/02 , H01L23/46
Abstract: A first thermosiphon circuit includes a first evaporator configured to cool a first target device by a latent heat of evaporation of a working fluid that absorbs a heat from the first target device, and a first passage communicating with the first evaporator. A second thermosiphon circuit includes a second evaporator configured to cool a second target device by a latent heat of evaporation of a working fluid that absorbs a heat from the second target device, and a second passage communicating with the second evaporator. A main condenser includes a first heat exchanger provided in the first passage and a second heat exchanger provided in the second passage, and is configured to allow the working fluid flowing through the first heat exchanger, the working fluid flowing through the second heat exchanger, and a predetermined cold energy supply medium to exchange heat with each other.
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公开(公告)号:US10906141B2
公开(公告)日:2021-02-02
申请号:US16293877
申请日:2019-03-06
Applicant: DENSO CORPORATION
Inventor: Yasumitsu Omi , Takashi Yamanaka , Yoshiki Kato , Takeshi Yoshinori , Masayuki Takeuchi , Koji Miura
Abstract: A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.
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公开(公告)号:US10950909B2
公开(公告)日:2021-03-16
申请号:US16285275
申请日:2019-02-26
Applicant: DENSO CORPORATION
Inventor: Koji Miura , Takashi Yamanaka , Yasumitsu Omi , Yoshiki Kato , Masayuki Takeuchi , Takeshi Yoshinori
IPC: H01M10/6569 , H01M10/625 , H01M10/633 , H01M10/613 , H01M10/6556 , H05K7/20 , H01M10/6552 , F28D15/06 , F28D15/02 , B60L58/26 , B60K6/28
Abstract: A device temperature regulator is provided with a gas passage part that guides a gaseous working fluid evaporated in a device heat exchanger to a condenser, and a liquid passage part that guides a liquid working fluid condensed in the condenser to the device heat exchanger. The device temperature regulator is provided with a supply amount regulator that increases or decreases a supply amount of the liquid working fluid supplied to the device heat exchanger. The supply amount regulator decreases the supply amount of the liquid working fluid to the device heat exchanger such that a liquid surface is formed in a state where the gaseous working fluid is positioned at a lower side lower than a heat exchanging portion exchanging heat with a temperature regulation target device in the device heat exchanger, when a condition for keeping the temperature regulation target device at a temperature is satisfied.
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公开(公告)号:US11029098B2
公开(公告)日:2021-06-08
申请号:US16282477
申请日:2019-02-22
Applicant: DENSO CORPORATION
Inventor: Masayuki Takeuchi , Yasumitsu Omi , Takashi Yamanaka , Yoshiki Kato , Takeshi Yoshinori , Koji Miura
IPC: F28D15/06 , H01M10/6569 , H01M10/613 , H01M10/633 , H05K7/20 , H01M10/625 , H01M10/647 , H01M10/6556 , H01M10/652 , F28D15/02 , H01M10/63 , B60H1/00
Abstract: A device temperature regulator includes a forward passage in which a forward flow passage is formed to cause a working fluid to flow to a heat absorber from a heat radiator, and a backward passage in which a backward flow passage is formed to cause the working fluid to flow to the heat radiator from the heat absorber. In addition, the device temperature regulator includes a bubble generator, which generates a bubble in the working fluid collecting in the heat absorber and having a liquid phase, and a controller that causes the bubble generator to generate the bubble in a precondition is satisfied.
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