HEAT CONDUCTION DEVICE
    2.
    发明申请

    公开(公告)号:US20190331437A1

    公开(公告)日:2019-10-31

    申请号:US16438630

    申请日:2019-06-12

    Abstract: A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

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