公开(公告)号：US20240343956A1

公开(公告)日：2024-10-17

申请号：US18683435

申请日：2022-08-01

Applicant: DEXERIALS CORPORATION

Inventor： Kouki HATSUDA ,  Minoru NAGASHIMA ,  He YANG ,  Kaori WAKU ,  Takeshi NOGUCHI

IPC: C09J167/07 ,  C08G63/91

CPC classification number: C09J167/07 ,  C08G63/912

Abstract: A tacky agent-forming composition includes a polylactic acid structure-including monofunctional (meth)acrylic monomer, a polylactic acid structure-including polyfunctional (meth)acrylic monomer, and a polylactic acid structure-including non-functional compound. A content of the polylactic acid structure-including non-functional compound is 10% by mole or more.

公开(公告)号：US20240239939A1

公开(公告)日：2024-07-18

申请号：US18559666

申请日：2022-04-22

Applicant: DEXERIALS CORPORATION

Inventor： Kaori WAKU ,  Kouki HATSUDA ,  Minoru NAGASHIMA ,  He YANG

IPC: C08F283/01 ,  A01K85/00 ,  B29C64/124 ,  B29K33/00 ,  B29L31/00 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

CPC classification number: C08F283/01 ,  A01K85/1897 ,  B33Y70/00 ,  B33Y80/00 ,  B29C64/124 ,  B29K2033/08 ,  B29L2031/7002 ,  B33Y10/00

Abstract: To provide a resin composition for three-dimensional shaping. The resin composition includes a polyfunctional urethane (meth) acrylate having a molecular weight of 700 or greater and 1,300 or less.

公开(公告)号：US20240266086A1

公开(公告)日：2024-08-08

申请号：US18018796

申请日：2021-07-12

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Kaori WAKU ,  Takeshi NISHIO ,  Yusuke TANAKA ,  Shoko KUGA

IPC: H01B1/22 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36

CPC classification number: H01B1/22 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/302 ,  B23K35/3033

Abstract: A composite conductive particles capable of suppressing cracking and peeling of metal films to provide excellent adhesion of metal films, and a method for manufacturing a composite conductive particle. The composite conductive particle includes a host particle; and adhesive fine particles arranged on a surface of the host particle and containing oxygen atoms; and conductive fine particles in contact with the adhesive fine particle. By arranging adhesive fine particles containing oxygen atoms on the surface of the host particle and bringing the conductive fine particles into contact with the adhesive fine particles, it is possible to achieve excellent adhesion of the metal film.