公开(公告)号：US20240124758A1

公开(公告)日：2024-04-18

申请号：US18277122

申请日：2022-01-27

Applicant: DEXERIALS CORPORATION

Inventor： Marina TOBATA ,  Keisuke ARAMAKI

IPC: C09K5/14 ,  C08J3/20 ,  C08J5/18 ,  C08K3/22 ,  C08K7/06 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08J3/203 ,  C08J5/18 ,  C08K3/22 ,  C08K7/06 ,  H05K7/2039 ,  B29K2105/12 ,  C08J2383/04 ,  C08K2003/2227 ,  C08K2201/001

Abstract: A heat-conductive sheet includes a binder resin and a fibrous filler having a major axis and dispersed in the binder resin. The major axis of the fibrous filler is arranged at an angle of 70 to 90 degrees with respect to a surface direction of the heat-conductive sheet when viewed in a cross-section along a thickness direction of the heat-conductive sheet. If the heat-conductive sheet is processed to a shape having a thickness of 2 mm and a diameter of 29 mm, and subject to a compression such that the thickness is decreased by 40% of the thickness before the compression, at room temperature for 24 hours, a difference of an angle of the major axis of the fibrous filler after release of the compression and an angle of the major axis of the fibrous filler before the compression is in a range within 10 degrees.

公开(公告)号：US20220098462A1

公开(公告)日：2022-03-31

申请号：US17430146

申请日：2020-12-09

Applicant: DEXERIALS CORPORATION

Inventor： Marina TOBATA ,  Keisuke ARAMAKI

IPC: C09K5/14 ,  C09J7/38 ,  C09J7/10 ,  C09J11/04 ,  H01L23/00 ,  H01L23/373

Abstract: A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet, the sheet includes: a sheet body formed by curing a thermally conductive resin composition containing at least a polymer matrix component and a thermally conductive filler, wherein the volume ratio of the thermally conductive filler to the polymer matrix component is 1.00 to 1.70, the thermally conductive filler contains a fibrous thermally conductive filler, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the polymer matrix component.

公开(公告)号：US20210296207A1

公开(公告)日：2021-09-23

申请号：US17259621

申请日：2019-07-04

Applicant: DEXERIALS CORPORATION

Inventor： Marina TOBATA ,  Keisuke ARAMAKI

IPC: H01L23/373 ,  C09K5/14 ,  C08J5/18 ,  C08K7/06 ,  C08K3/04 ,  H01L23/367 ,  H01L21/48

Abstract: A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet. The sheet includes: a sheet body obtained by curing a binder resin containing at least a polymer matrix component and a fibrous thermally conductive filler, wherein the volume ratio of the fibrous thermally conductive filler to the binder resin is 0.6 or less considering the binder resin as 1, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the binder resin.