公开(公告)号：US20230159797A1

公开(公告)日：2023-05-25

申请号：US18098412

申请日：2023-01-18

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  C09J7/10 ,  H05K3/32 ,  H04N23/54 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/146 ,  H01R4/04 ,  H05K1/18

CPC classification number: C09J9/02 ,  C09J7/10 ,  H05K3/323 ,  H04N23/54 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/14618 ,  H01R4/04 ,  H05K1/181 ,  C08K3/08

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

公开(公告)号：US20180002575A1

公开(公告)日：2018-01-04

申请号：US15541881

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  H04N5/225 ,  H05K1/18 ,  C09J11/04 ,  H01B1/22 ,  H01L27/146 ,  H01R4/04 ,  C09J163/00 ,  C08K3/10 ,  C08K3/36 ,  C08K9/02 ,  H05K1/02

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.