公开(公告)号：US11299575B2

公开(公告)日：2022-04-12

申请号：US16616704

申请日：2018-05-15

申请人： DIC Corporation

发明人： Daisuke Nakazawa ,  Norio Kosaka ,  Hideaki Kawahara

IPC分类号： C08F279/02 ,  C08F220/18 ,  C08F8/04 ,  C08F136/06 ,  C08F220/06 ,  C08F220/14 ,  C08F220/20 ,  C08K5/17 ,  C09D151/04

摘要： There is provided a water-based resin composition that contains a polymer (A) containing, as essential raw materials, a hydrogenated polybutadiene (a1) with an iodine value in the range of 5 to 25, a monomer (a2) with an acid group, and a monomer (a3) with a hydroxy group, a basic compound (B), and an aqueous medium (C), wherein the hydrogenated polybutadiene (a1) constitutes 4% to 38% by mass of the raw materials of the polymer (A), and the polymer (A) has an acid value in the range of 10 to 65 mgKOH/g. A water-based resin composition of the present invention has high storage stability and forms a coating film with good physical properties, such as high adhesiveness to various substrates and high blocking resistance, and is therefore suitably used in a water-based paint.

公开(公告)号：US20180327629A1

公开(公告)日：2018-11-15

申请号：US15527874

申请日：2015-11-12

申请人： DIC Corporation

发明人： Tsugio Tomura ,  Hiroshi Moriyama ,  Hideaki Kawahara

IPC分类号： C09D163/00 ,  C08G59/50 ,  C04B41/00 ,  C04B41/63 ,  C04B41/48

CPC分类号： C09D163/00 ,  C04B41/009 ,  C04B41/4853 ,  C04B41/63 ,  C08G59/223 ,  C08G59/226 ,  C08G59/245 ,  C08G59/5026 ,  C08G59/5033 ,  C04B28/02

摘要： Provided are a curing agent for epoxy resins, which is a curing agent capable of curing an epoxy resin at room temperature, and which can form a cured product (cured coating film) having excellent adhesion even to a substrate which is not in an environment completely dried, and an epoxy resin composition obtained using the same. A curing agent for epoxy resins, containing (a1) an aromatic amine, (a2) an aliphatic amine having an aromatic ring or a cycloalkane ring, and (a3) a curing accelerator, and an epoxy resin composition containing the curing agent and an epoxy resin.

公开(公告)号：US10435583B2

公开(公告)日：2019-10-08

申请号：US15527874

申请日：2015-11-12

申请人： DIC Corporation

发明人： Tsugio Tomura ,  Hiroshi Moriyama ,  Hideaki Kawahara

IPC分类号： C09D163/00 ,  C04B41/63 ,  C04B41/00 ,  C04B41/48 ,  C08G59/50 ,  C08G59/22 ,  C08G59/24 ,  C04B28/02

摘要： Provided are a curing agent for epoxy resins, which is a curing agent capable of curing an epoxy resin at room temperature, and which can form a cured product (cured coating film) having excellent adhesion even to a substrate which is not in an environment completely dried, and an epoxy resin composition obtained using the same. A curing agent for epoxy resins, containing (a1) an aromatic amine, (a2) an aliphatic amine having an aromatic ring or a cycloalkane ring, and (a3) a curing accelerator, and an epoxy resin composition containing the curing agent and an epoxy resin.