公开(公告)号：US20190225744A1

公开(公告)日：2019-07-25

申请号：US16313310

申请日：2017-06-22

申请人： DIC Corporation

发明人： Akito Kawasaki ,  Yutaka Satou ,  Tatsuya Okamoto

IPC分类号： C08G63/42 ,  C08G63/78 ,  H01L23/29 ,  H05K1/03

摘要： Provided are an active ester resin composition capable of both exhibiting low shrinkage during curing and forming a cured product having a low elastic modulus under high temperature conditions; a curable resin composition including the ester resin composition; a cured product of the curable resin composition; a printed wiring board; and a semiconductor encapsulating material. The active ester resin composition includes an active ester compound (A) that is an esterification product of a naphthol compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and an active ester resin (B) including a product of reaction of essential raw materials including a compound (b1) having one phenolic hydroxyl group, a compound (b2) having two or more phenolic hydroxy groups, and an aromatic polycarboxylic acid or an acid halide thereof (b3), in which the content of the active ester compound (A) is 40% or more.

公开(公告)号：US20180327541A1

公开(公告)日：2018-11-15

申请号：US15527876

申请日：2015-11-10

申请人： DIC Corporation

发明人： Kazuo Arita ,  Tatsuya Okamoto

IPC分类号： C08G59/40 ,  C08G63/197 ,  H05K1/03

CPC分类号： C08G59/40 ,  C08G63/181 ,  C08G63/197 ,  C08J5/24 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/46 ,  H05K2201/012 ,  H05K2201/0145 ,  H01L2924/00

摘要： Provided are a thermosetting resin composition whose cured product exhibits a low dielectric constant and a low loss tangent as well as excellent flame retardancy, heat resistance, and thermal decomposition resistance, a cured product obtained from the thermosetting resin composition, and an active ester resin for use in the thermosetting resin composition. Specifically, the thermosetting resin composition contains, as essential components, an epoxy resin and an active ester resin having a resin structure that has a structural segment represented by formula (I) below and monovalent aryloxy groups at both terminals:

公开(公告)号：US20190172768A1

公开(公告)日：2019-06-06

申请号：US16313269

申请日：2017-06-22

申请人： DIC Corporation

发明人： Yutaka Satou ,  Tatsuya Okamoto ,  Akito Kawasaki

IPC分类号： H01L23/29 ,  H01L23/31 ,  C08L67/02 ,  C08L63/00

摘要： Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (α); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.

公开(公告)号：US20190169424A1

公开(公告)日：2019-06-06

申请号：US16313244

申请日：2017-06-22

申请人： DIC Corporation

发明人： Yutaka Satou ,  Akito Kawasaki ,  Tatsuya Okamoto

IPC分类号： C08L63/00 ,  H05K1/03 ,  H01L23/29

摘要： Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.

公开(公告)号：US20190153215A1

公开(公告)日：2019-05-23

申请号：US16313293

申请日：2017-06-22

申请人： DIC Corporation

发明人： Yutaka Satou ,  Akito Kawasaki ,  Tatsuya Okamoto ,  Kazuhisa Yamoto

IPC分类号： C08L67/02 ,  C08L61/06 ,  H01L23/29 ,  H01B3/42

摘要： Provided are an active ester composition capable of exhibiting high curability and forming a cured product with various excellent properties such as low dielectric properties, a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition. The active ester composition includes, as essential components, an active ester compound (A) and a phenolic hydroxyl group-containing compound (B), in which the active ester compound (A) is an esterification product of a compound having one phenolic hydroxyl group in the molecular structure (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2). Also provided are a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition.

公开(公告)号：US10741464B2

公开(公告)日：2020-08-11

申请号：US16313269

申请日：2017-06-22

申请人： DIC Corporation

发明人： Yutaka Satou ,  Tatsuya Okamoto ,  Akito Kawasaki

IPC分类号： H01L23/29 ,  H01L23/31 ,  C08G59/42 ,  C08G59/02 ,  H05K1/03 ,  C08G63/133 ,  C08L63/00 ,  C08L67/02

摘要： Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (α); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.

公开(公告)号：US20170320994A1

公开(公告)日：2017-11-09

申请号：US15512637

申请日：2015-09-24

申请人： DIC CORPORATION

发明人： Kazuo Arita ,  Tatsuya Okamoto ,  Kazuhisa Yamoto ,  Yutaka Sato

IPC分类号： C08G14/10 ,  C09K5/14 ,  C09K21/14 ,  H01L23/29 ,  C08L63/04 ,  H05K1/03 ,  C08J5/24 ,  C08L61/28 ,  H05K3/18 ,  H05K3/00 ,  H05K3/42

CPC分类号： C08G14/10 ,  C08G59/62 ,  C08G59/64 ,  C08J5/24 ,  C08J2361/28 ,  C08J2363/04 ,  C08J2461/28 ,  C08J2461/34 ,  C08J2463/04 ,  C08L61/28 ,  C08L61/34 ,  C08L63/04 ,  C08L2201/02 ,  C08L2201/08 ,  C09K5/14 ,  C09K21/14 ,  H01L23/14 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/005 ,  H05K3/18 ,  H05K3/42 ,  H01L2924/00 ,  C08L63/00

摘要： A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

公开(公告)号：US20220251254A1

公开(公告)日：2022-08-11

申请号：US17622779

申请日：2020-02-20

申请人： DIC Corporation

发明人： Tomohiro Shimono ,  Tatsuya Okamoto

IPC分类号： C08F22/40

摘要： To provide a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties, and a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor apparatus having both excellent heat resistance and dielectric properties. The invention has an indane scaffold represented by the following general formula (1): in formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group, and q represents an integer value of 0 to 4.

公开(公告)号：US11299448B2

公开(公告)日：2022-04-12

申请号：US16610582

申请日：2018-04-10

申请人： DIC Corporation

发明人： Tatsuya Okamoto ,  Yutaka Satou

IPC分类号： C07C65/21 ,  C07C67/03 ,  C08L27/12 ,  H01L23/29 ,  H05K1/03 ,  C08K5/10

摘要： An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

公开(公告)号：US11053384B2

公开(公告)日：2021-07-06

申请号：US16313244

申请日：2017-06-22

申请人： DIC Corporation

发明人： Yutaka Satou ,  Akito Kawasaki ,  Tatsuya Okamoto

IPC分类号： C08L63/00 ,  H05K1/03 ,  H01L23/29 ,  H01L23/31 ,  C08K3/36 ,  C08G59/42 ,  C08G59/62 ,  C09D163/00 ,  C08K5/00 ,  C08K5/12

摘要： Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.