公开(公告)号：US20240363414A1

公开(公告)日：2024-10-31

申请号：US18633811

申请日：2024-04-12

申请人： DISCO CORPORATION

发明人： Akifumi SUZUKI ,  Junichi KUKI

IPC分类号： H01L21/78

CPC分类号： H01L21/78

摘要： A method of processing an SiC wafer includes a laser processing step of applying a laser beam to the SiC wafer along projected dicing lines established thereon to sever a metal film on the SiC wafer along the projected dicing lines and form grooves in the SiC wafer along the projected dicing lines, a tape mounting step of mounting a tape on the metal film before or after the laser processing step, and a dividing step of gripping, vertically between gripping members, an area of the SiC wafer adjacent to one at a time of the projected dicing lines along which the SiC wafer is to be divided and pressing, with a pressing member, an area of the SiC wafer adjacent to and across the one of the projected dicing lines from the gripping members, thereby dividing the SiC wafer along the one of the projected dicing lines.

公开(公告)号：US12100612B2

公开(公告)日：2024-09-24

申请号：US17109907

申请日：2020-12-02

申请人： DISCO CORPORATION

发明人： Shungo Yoshii

IPC分类号： H01L21/683 ,  B25J15/06

CPC分类号： H01L21/6838 ,  B25J15/0683

摘要： A plate-shaped workpiece holding tool includes a holding base having a joint port coupled to a suction source and a holding surface for holding the plate-shaped workpiece thereon, a first O-ring disposed on the holding surface, a second O-ring disposed on the holding surface radially inwardly of the first O-ring, a suction port that is open in the holding surface between the first O-ring and the second O-ring and held in fluid communication with the joint port, and a liquid supply mechanism for forming a liquid seal between the holding surface and the plate-shaped workpiece radially outwardly of the first O-ring.

公开(公告)号：US12090563B2

公开(公告)日：2024-09-17

申请号：US18175676

申请日：2023-02-28

申请人： DISCO CORPORATION

发明人： Yuta Mizumoto

IPC分类号： B23K26/00 ,  B23K1/00 ,  B23K1/005 ,  B23K26/03 ,  B23K26/04 ,  B23K101/40

CPC分类号： B23K1/0056 ,  B23K26/03 ,  B23K26/04 ,  B23K2101/40

摘要： A laser reflow method includes preparing a workpiece including a board and semiconductor chips each having one or more bumps formed on one surface thereof, the semiconductor chips being placed on the board with the bumps interposed therebetween. An inclination detection step captures an image of one semiconductor chip and detects an inclination of the semiconductor chip within the captured image. A laser beam irradiation step irradiates each semiconductor chip with a laser beam from another surface side opposite to the one surface to reflow the bumps formed within an irradiated range of the workpiece. A phase pattern displayed by a spatial light modulator is rotated in such a manner as to agree with the inclination of the detected semiconductor chip, to thereby rotate an irradiation range of the laser beam within an irradiated surface of the workpiece, before the semiconductor chips are irradiated with the laser beam.

公开(公告)号：US12080564B2

公开(公告)日：2024-09-03

申请号：US17657842

申请日：2022-04-04

申请人： DISCO CORPORATION

发明人： Kazuma Sekiya

IPC分类号： H01L21/56 ,  H01L21/48

CPC分类号： H01L21/561 ,  H01L21/4853 ,  H01L21/565

摘要： A package substrate processing method includes a holding step of holding a package substrate by a chuck table, a warp reducing step of, after the holding step is performed, reducing a warp in the package substrate by forming grooves of a first depth along planned dividing lines of the package substrate by using a first cutting blade, a groove forming step of forming grooves of, after the warp reducing step is performed, a second depth by further cutting the grooves of the first depth by using the first cutting blade, and a dividing step of, after the groove forming step is performed, forming packaged chips by further cutting the grooves of the second depth and thus dividing the package substrate by using a second cutting blade thinner than the first cutting blade.

公开(公告)号：US20240290613A1

公开(公告)日：2024-08-29

申请号：US18436272

申请日：2024-02-08

申请人： DISCO CORPORATION

发明人： Naoki KITA

IPC分类号： H01L21/02

CPC分类号： H01L21/02354

摘要： A wafer processing method includes a circular recess forming step of forming a circular recess in a center of a back surface of a wafer to thereby form an annular projection surrounding the circular recess, and a modified layer forming step of applying a laser beam of such a wavelength as to be transmitted through the wafer to the annular projection to thereby form a modified layer.

公开(公告)号：US20240269768A1

公开(公告)日：2024-08-15

申请号：US18430080

申请日：2024-02-01

申请人： DISCO CORPORATION

发明人： Asahi NOMOTO

IPC分类号： B23K26/0622 ,  B23K101/40

CPC分类号： B23K26/0622 ,  B23K2101/40

摘要： A wafer manufacturing method includes a separation layer forming step of forming a separation layer including a plurality of modified regions within a workpiece by moving the workpiece and a condensing point of a pulsed laser beam having a wavelength transmittable through the workpiece relative to each other at a predetermined speed along a processing feed direction in a state in which the workpiece is irradiated with the laser beam, and the condensing point of the laser beam is located at a predetermined depth position of the workpiece, and a separating step of separating a wafer from the workpiece with the separation layer as a starting point, in the separation layer forming step, a repetition frequency of the laser beam is set according to pulse energy and the relative predetermined speed between the workpiece and the condensing point such that the separation layer can be formed.

公开(公告)号：US20240254368A1

公开(公告)日：2024-08-01

申请号：US18559745

申请日：2022-05-11

申请人： DISCO CORPORATION ,  DENKA COMPANY LIMITED

发明人： Shingo Motoike ,  Kazuki Iizuka ,  Masashi Nakamura ,  Mizuki Hasumi

IPC分类号： C09J7/29 ,  C09J7/38 ,  C09J135/02 ,  H01L21/304 ,  H01L21/683

CPC分类号： C09J7/29 ,  C09J7/385 ,  C09J135/02 ,  H01L21/304 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/162 ,  C09J2301/204 ,  C09J2301/302 ,  C09J2433/00 ,  C09J2433/006

摘要： The present invention aims to provide an adhesive sheet for back grinding capable of suppressing peeling of an adhesive layer and capable of peeling a wafer easily from an adhesive sheet.
According to the present invention, provided is an adhesive sheet for back grinding of a semiconductor wafer having a convex part, comprising: a base material layer; and an adhesive layer provided on the base material layer, wherein: the adhesive layer comprises an opening part having a diameter smaller than a diameter of the semiconductor wafer; the adhesive layer is adhered to an outer peripheral part of the semiconductor wafer so shat the convex part of the semiconductor wafer is placed in the opening part; the adhesive layer is configured so that the convex part is protected by the base material layer with the semiconductor wafer adhered to the adhesive layer; the base material layer comprises a cushion layer and a surface treatment layer provided thereon; the adhesive layer is provided on the surface treatment layer; the surface treatment layer is formed of an acrylic resin composition containing an acrylic resin; the acrylic resin is cross-linked by light irradiation or heating; and the adhesive layer is formed of an acrylic resin composition containing an acrylic resin.

公开(公告)号：US20240238938A1

公开(公告)日：2024-07-18

申请号：US18391950

申请日：2023-12-21

申请人： DISCO CORPORATION

发明人： Takashi YAMAGUCHI

IPC分类号： B24B41/00 ,  B24B41/06 ,  B24B51/00

CPC分类号： B24B41/005 ,  B24B41/068 ,  B24B51/00

摘要： Provided is a grinding apparatus including a holding unit that holds a workpiece by a chuck table, a grinding unit, a transporting mechanism that has a holding part capable of holding the workpiece, a first table that holds the workpiece to be loaded onto the holding unit, a second table that holds the workpiece having been unloaded from the holding unit, and a controller. When the controller determines that replacement of a grinding wheel is necessary in a state in which all of the holding unit, the first table, and the second table are holding workpieces, the controller makes the holding part of the transporting mechanism hold the workpiece held by the holding unit.

公开(公告)号：US20240231608A9

公开(公告)日：2024-07-11

申请号：US18538063

申请日：2023-12-13

申请人： DISCO CORPORATION

发明人： Takafumi OMORI

IPC分类号： G06F3/04886 ,  G06F3/0482 ,  H01L21/67

CPC分类号： G06F3/04886 ,  G06F3/0482 ,  H01L21/67092

摘要： There is provided a touch panel that displays an image in which a plurality of functional buttons are arranged. The plurality of buttons include a long-touch button a function of which can be rendered active after the button is continuously touched for a predetermined time period, and attendant on the long-touch button, a count-down signal notifying a time period remaining before a timing at which the function can be rendered active is displayed.

公开(公告)号：US20240227100A1

公开(公告)日：2024-07-11

申请号：US18405135

申请日：2024-01-05

申请人： DISCO CORPORATION

发明人： Naoki OMIYA ,  Kazuki MORI

IPC分类号： B23Q3/08

CPC分类号： B23Q3/084

摘要： A jig for use in manufacturing a wafer from an ingot and for being delivered while being integrated with the ingot includes a base having a holding mechanism for holding the ingot such that the ingot protrudes therefrom and an information recording member fixed to the base for recording individual information of the ingot identifiably therein. Preferably, the base has a disk-shaped recess defined therein that has a predetermined depth for accommodating a bottom portion of the ingot therein.